Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/08/2014CN103500701A Method for manufacturing nanometer device
01/08/2014CN103500700A Method for manufacturing semiconductor device
01/08/2014CN103499945A Glass-packaged diode detecting and labeling device
01/08/2014CN103499905A Array substrate, manufacturing method thereof and display device
01/08/2014CN103498196A Method for fabricating silicon wafer
01/08/2014CN103495928A Machining method for improving surface quality and product yield of sapphire substrate
01/08/2014CN102651345B Manufacturing method of transistor
01/08/2014CN102623397B Array substrate structure for display panel and method of making the same
01/08/2014CN102623307B Universal self-aligned preparation method for full-limited quantum dots between varieties of materials
01/08/2014CN102601938B Device and method for automatically breaking (removing) plastic sealing material slag of mold machine
01/08/2014CN102569095B Method for preparing LTCC (low-temperature co-fired ceramic) substrate with channels
01/08/2014CN102543839B Planarization method for interlayer dielectric (ILD) layer
01/08/2014CN102543663B Automatic lead molding device
01/08/2014CN102509704B Method for manufacturing T-shaped gate by adopting single electron beam exposure
01/08/2014CN102492932B In-situ surface passivation method in ALD (atomic layer deposition) production of GaAs-based MOS (Metal Oxide Semiconductor) devices
01/08/2014CN102479707B Transistor and manufacturing method for same
01/08/2014CN102465248B Protective cover and surface treatment method thereof
01/08/2014CN102437124B Method for increasing writing speed of floating body effect storage unit and semiconductor device
01/08/2014CN102437068B Hole measurement pattern and hole measurement method
01/08/2014CN102414817B Semiconductor device provided with semiconductor substrate having diode zone and igbt zone
01/08/2014CN102386211B LDMOS device and fabrication method thereof
01/08/2014CN102386139B Split word line fabrication process
01/08/2014CN102386084B Method for planarizing surface of wafer
01/08/2014CN102376652B Method for manufacturing split gate flash by reducing writing interference
01/08/2014CN102376649B Method for forming storage device
01/08/2014CN102373445B Method for monitoring leakage rate in chemical vapor deposition reaction cavity
01/08/2014CN102347218B Method of pitch dimension shrinkage
01/08/2014CN102334177B Transfer body and method for producing the same
01/08/2014CN102308377B Apparatus and method for picking up semiconductor die
01/08/2014CN102245803B Catalyst chemical vapor deposition apparatus
01/08/2014CN102240927B Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment
01/08/2014CN102237358B Semiconductor device and method for fabricating the same
01/08/2014CN102184940B 半导体结构及其形成方法 And method of forming a semiconductor structure
01/08/2014CN102157407B Use method of adhesive for circuit member connection
01/08/2014CN102039558B Method for controlling grinding process
01/08/2014CN102034788B Substrate with built-in semiconductor element and method for manufacturing the same
01/08/2014CN102024758B Method for manufacturing Schottky diode
01/08/2014CN102005409B Preparation method of dual damascene structure
01/08/2014CN101996886B Method for manufacturing semiconductor device
01/08/2014CN101946318B Semiconductor element module and method for manufacturing the same
01/08/2014CN101881901B Production line of liquid crystal display
01/08/2014CN101872095B Liquid crystal display panel and forming method thereof
01/08/2014CN101796629B Method for manufacturing a semiconductor die and a semiconductor device comprising the semiconductor die obtained thereby
01/08/2014CN101794323B Method and apparatus for correcting assist-feature-printing errors
01/08/2014CN101767095B Picking and placing device of test sorting machine
01/08/2014CN101740515B Semiconductor component and method of manufacture
01/08/2014CN101740395B Semiconductor component and method of manufacture
01/08/2014CN101527282B Method for manufacturing semiconductor device
01/08/2014CN101286043B Heat processing apparatus, method of automatically tuning control constants, and storage medium
01/07/2014US8627259 Capacitance modification without affecting die area
01/07/2014US8627258 Adjusting capacitance of capacitors without affecting die area
01/07/2014US8627239 Mask fabrication supporting method, mask blank providing method, and mask blank dealing system
01/07/2014US8626329 Product assembly system and control software
01/07/2014US8625381 Stacked semiconductor device
01/07/2014US8625096 Method and system for increasing alignment target contrast
01/07/2014US8625058 Photodetector and display device
01/07/2014US8625016 Image sensors having multiple photoelectric conversion devices therein
01/07/2014US8624626 3D IC structure and method
01/07/2014US8624582 Measuring method, arrangement and software product
01/07/2014US8624407 Microelectronic assembly with impedance controlled wirebond and reference wirebond
01/07/2014US8624402 Mock bump system for flip chip integrated circuits
01/07/2014US8624397 Electrode layer structure for a thin-film transistor and process for manufacture thereof
01/07/2014US8624387 Top port multi-part surface mount silicon condenser microphone package
01/07/2014US8624386 Bottom port multi-part surface mount silicon condenser microphone package
01/07/2014US8624385 Top port surface mount silicon condenser microphone package
01/07/2014US8624384 Bottom port surface mount silicon condenser microphone package
01/07/2014US8624371 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
01/07/2014US8624370 Integrated circuit packaging system with an interposer and method of manufacture thereof
01/07/2014US8624363 Method for semiconductor leadframes in low volume and rapid turnaround
01/07/2014US8624362 IC wafer having electromagnetic shielding effects and method for making the same
01/07/2014US8624357 Composite semiconductor substrates for thin-film device layer transfer
01/07/2014US8624354 Semiconductor devices including 3-D structures with support pad structures and related methods and systems
01/07/2014US8624353 Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer
01/07/2014US8624351 Package structure and method for making the same
01/07/2014US8624350 Semiconductor device and method of fabricating the same
01/07/2014US8624349 Simultaneous isolation trench and handle wafer contact formation
01/07/2014US8624348 Chips with high fracture toughness through a metal ring
01/07/2014US8624340 Plasma processing apparatus and method thereof
01/07/2014US8624327 Integrated semiconductor structure for SRAM and fabrication methods thereof
01/07/2014US8624326 FinFET device and method of manufacturing same
01/07/2014US8624325 Semiconductor device and method of manufacturing the same
01/07/2014US8624324 Connecting through vias to devices
01/07/2014US8624322 High voltage device with a parallel resistor
01/07/2014US8624314 Semiconductor device and method for manufacturing semiconductor device
01/07/2014US8624304 Printed material constrained by well structures and devices including same
01/07/2014US8624297 Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density
01/07/2014US8624295 SRAM devices utilizing strained-channel transistors and methods of manufacture
01/07/2014US8624290 Display device and method for manufacturing the same
01/07/2014US8624287 Light emitting diode and method of fabricating the same
01/07/2014US8624277 Display substrate and method of manufacturing the same
01/07/2014US8624275 Organic light-emitting panel for controlling an organic light emitting layer thickness and organic display device
01/07/2014US8624270 Device having a plurality of light emitting structures bonded by adhesive layers and light emitting device package having the same
01/07/2014US8624268 Light emitting device package and method of manufacturing the same
01/07/2014US8624263 Diamond semiconductor device and method of manufacturing the same
01/07/2014US8624256 Display device
01/07/2014US8624252 Substrate having film pattern and manufacturing method of the same, manufacturing method of semiconductor device, liquid crystal television, and el television
01/07/2014US8624248 Semiconductor device and manufacturing method thereof
01/07/2014US8624238 Thin-film transistor substrate and method of fabricating the same
01/07/2014US8624236 Phase change memory cell having vertical channel access transistor
01/07/2014US8624225 Methods of forming structures having nanotubes extending between opposing electrodes and structures including same