| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/15/2014 | CN103515449A Schottky semiconductor device with charge compensation groove and preparing method thereof |
| 01/15/2014 | CN103515448A Electrical device and method for manufacturing same |
| 01/15/2014 | CN103515447A Electronic device and method of manufacturing such device |
| 01/15/2014 | CN103515446A Semiconductor device and fabrication method thereof |
| 01/15/2014 | CN103515445A Thin film transistor and preparation method thereof |
| 01/15/2014 | CN103515443A Super-junction power device and manufacturing method thereof |
| 01/15/2014 | CN103515442A Single poly MOSFET device integrated with snubber |
| 01/15/2014 | CN103515440A Dummy gate electrode of semiconductor device |
| 01/15/2014 | CN103515437A Structure and method for a field effect transistor |
| 01/15/2014 | CN103515436A Super junction power device and manufacturing method thereof |
| 01/15/2014 | CN103515435A MOS transistor and formation method thereof, and SRAM memory cell circuit |
| 01/15/2014 | CN103515434A MOS transistor and formation method thereof, and SRAM memory cell circuit |
| 01/15/2014 | CN103515433A NMOS transistor and formation method thereof, and SRAM memory cell circuit |
| 01/15/2014 | CN103515431A Double diffusion drain metal oxide semiconductor element and manufacturing method thereof |
| 01/15/2014 | CN103515430A 鳍式场效应晶体管及其制造方法 Fin field effect transistor and manufacturing method thereof |
| 01/15/2014 | CN103515429A Compound semiconductor device and method for manufacturing the same |
| 01/15/2014 | CN103515424A Semiconductor device and fabricating method thereof |
| 01/15/2014 | CN103515423A Semiconductor devices, transistors and methods of manufacture thereof |
| 01/15/2014 | CN103515422A FinFET with high mobility and strain channel |
| 01/15/2014 | CN103515421A Semiconductor structure and manufacturing process thereof |
| 01/15/2014 | CN103515420A Semiconductor device and formation method thereof |
| 01/15/2014 | CN103515419A Graded aluminum-gallium-nitride and superlattice buffer layer for III-V nitride layer on silicon substrate |
| 01/15/2014 | CN103515417A Passivation scheme |
| 01/15/2014 | CN103515416A Chip structure and manufacturing method thereof |
| 01/15/2014 | CN103515414A 晶体管装置及其制造方法 Transistor device and manufacturing method |
| 01/15/2014 | CN103515410A Organic light emitting display device and method for manufacturing the same |
| 01/15/2014 | CN103515409A Display device and method of manufacturing the same |
| 01/15/2014 | CN103515408A Light emitting component chipset and circuit thereof and bonding wire bonding method |
| 01/15/2014 | CN103515395A Display device and manufacturing method for same |
| 01/15/2014 | CN103515394A Thin film transistor substrate having metal oxide semiconductor and method for manufacturing the same |
| 01/15/2014 | CN103515392A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515391A Nonvolatile memory unit and manufacturing method thereof |
| 01/15/2014 | CN103515390A Integrated circuit having FINFETs with different fin profiles |
| 01/15/2014 | CN103515389A Wiring-saving design method for SRAM cell |
| 01/15/2014 | CN103515388A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515387A Semiconductor device with adjustable potential distribution and manufacturing method of semiconductor device |
| 01/15/2014 | CN103515386A Vertical memory device and method of fabricating the same |
| 01/15/2014 | CN103515383A Integrated power semiconductor component, production method and chopper circuit |
| 01/15/2014 | CN103515382A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515378A 半导体装置和结构 The semiconductor devices and structures |
| 01/15/2014 | CN103515375A Array substrate, its manufacturing method and display device |
| 01/15/2014 | CN103515370A Power semiconductor package and manufacturing method thereof |
| 01/15/2014 | CN103515364A Power module package and method for manufacturing the same |
| 01/15/2014 | CN103515363A Method and apparatus of wafer level package for heterogeneous integration technology |
| 01/15/2014 | CN103515362A Package on package device and method of packaging semiconductor die |
| 01/15/2014 | CN103515361A Packaging element having stack structure and manufacturing method thereof |
| 01/15/2014 | CN103515357A Overlay mark and method of measuring the same |
| 01/15/2014 | CN103515355A 半导体元件与其制作方法 Semiconductor device and its manufacturing method |
| 01/15/2014 | CN103515354A Apparatus and method for low contact resistance carbon nanotube interconnect |
| 01/15/2014 | CN103515353A Photoresist fill type metal interconnect structure and manufacturing method thereof |
| 01/15/2014 | CN103515352A Component having plating through hole, and method for production the same |
| 01/15/2014 | CN103515351A Device contact, electric device package and method of manufacturing electric device package |
| 01/15/2014 | CN103515350A A vertical metal/insulating layer/metal MIM capacitor and a manufacturing method thereof |
| 01/15/2014 | CN103515346A Semiconductor module and method of formation thereof |
| 01/15/2014 | CN103515344A Semiconductor package and making method thereof |
| 01/15/2014 | CN103515343A Electronic component module and method for manufacturing the same |
| 01/15/2014 | CN103515342A Package structure and method for forming the same |
| 01/15/2014 | CN103515341A Electroless nickel bump structure of wafer die pad, and method of manufacturing the same |
| 01/15/2014 | CN103515340A Power module package and method for manufacturing the same |
| 01/15/2014 | CN103515336A Chip package, chip arrangement, circuit board, and method for manufacturing chip package |
| 01/15/2014 | CN103515335A Electro-thermal cooling device and method of fabrication thereof |
| 01/15/2014 | CN103515334A Chip package, method for forming the same, and method for forming semiconductor structure |
| 01/15/2014 | CN103515331A Semiconductor package and making method thereof |
| 01/15/2014 | CN103515330A Packaging substrate (semiconductor package) and fabrication method thereof |
| 01/15/2014 | CN103515324A Method of integrating high voltage device |
| 01/15/2014 | CN103515323A Method for manufacturing NAND device |
| 01/15/2014 | CN103515322A Method of fabricating semiconductor device |
| 01/15/2014 | CN103515321A Semiconductor device side wall forming method |
| 01/15/2014 | CN103515320A Semiconductor device and forming method thereof |
| 01/15/2014 | CN103515319A CMOS fully-silicided metal gate forming method |
| 01/15/2014 | CN103515318A CMOS fully-silicided metal gate preparation method |
| 01/15/2014 | CN103515317A CMOS device and forming method thereof |
| 01/15/2014 | CN103515316A Production method of 50-micron ultrathin chips |
| 01/15/2014 | CN103515315A Processing method and processing apparatus |
| 01/15/2014 | CN103515314A Integrated circuit package and method for forming the same |
| 01/15/2014 | CN103515313A Stripping method of flexible substrate for displayer |
| 01/15/2014 | CN103515312A Preparation method for metal hard mask layer and copper interconnected structure |
| 01/15/2014 | CN103515311A Chip package and method for manufacturing chip package |
| 01/15/2014 | CN103515310A Monitor structure and method of formation thereof |
| 01/15/2014 | CN103515309A Flip-chip electronic device and production method thereof |
| 01/15/2014 | CN103515308A Copper interconnect structure and method for fabricating thereof |
| 01/15/2014 | CN103515307A Semiconductor device having buried bit line and method for fabricating the same |
| 01/15/2014 | CN103515306A Method for fabricating integrated circuit with ruthenium-lined copper |
| 01/15/2014 | CN103515305A 3d ic stacking device and method of manufacture |
| 01/15/2014 | CN103515304A Etch damage and esl free dual damascene metal interconnect |
| 01/15/2014 | CN103515303A Self-repairing process for porous dielectric materials |
| 01/15/2014 | CN103515302A Semiconductor element and manufacturing method |
| 01/15/2014 | CN103515301A Method for forming groove |
| 01/15/2014 | CN103515300A Method for forming air gap in metal interconnection process |
| 01/15/2014 | CN103515299A Low-k intermetallic dielectric (Low-k IMD) layer etching method |
| 01/15/2014 | CN103515298A Manufacturing method of semi-conductor component |
| 01/15/2014 | CN103515297A Manufacturing method of semi-conductor component |
| 01/15/2014 | CN103515296A Method for planarization of conductive plug |
| 01/15/2014 | CN103515295A Method for processing through hole |
| 01/15/2014 | CN103515294A Method for manufacturing tungsten plug |
| 01/15/2014 | CN103515293A Method for forming contact hole |
| 01/15/2014 | CN103515292A Method for forming semiconductor structure |
| 01/15/2014 | CN103515291A Forming method of shallow trench isolation structure |
| 01/15/2014 | CN103515290A Double-shallow-trench isolation process |
| 01/15/2014 | CN103515289A Method for forming shallow trench isolation structure |