Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/22/2014CN103531471A MOSFET and preparation method thereof
01/22/2014CN103531470A Semiconductor device and method for manufacturing the same
01/22/2014CN103531469A Manufacturing method of metal gate transistor
01/22/2014CN103531468A MOS transistor and manufacturing method thereof
01/22/2014CN103531467A Semiconductor device and forming method thereof
01/22/2014CN103531466A Preparation method for island-actuated single-electron transistor
01/22/2014CN103531465A Preparation method of fast recovery diode
01/22/2014CN103531464A Etching method for silicon nitride high depth-to-width ratio hole
01/22/2014CN103531463A Preparation method of low surface pore and low dielectric constant thin-film material
01/22/2014CN103531462A Silicon oxide film forming method and apparatus
01/22/2014CN103531461A Method of etching
01/22/2014CN103531460A Manufacture method of inversed trapeziform alternative gate
01/22/2014CN103531459A Manufacturing method for semiconductor device
01/22/2014CN103531458A Method for carrying out wet etching on GaAs-based material by utilizing two-step method
01/22/2014CN103531457A Groove-type flocking machine
01/22/2014CN103531456A Method for forming stable residual oxide on floating gate
01/22/2014CN103531455A Semiconductor device and manufacturing method therefor
01/22/2014CN103531454A Method for manufacturing semiconductor device
01/22/2014CN103531453A 半导体集成器件及其制作方法 The semiconductor integrated device and manufacturing method thereof
01/22/2014CN103531452A Method for forming CMOS tube
01/22/2014CN103531451A Substrate support member for ion implantation and method of ion implantation
01/22/2014CN103531450A Method for forming laterally varying doping concentrations and a semiconductor device
01/22/2014CN103531449A Diffusion technology for prolonging minority carrier lifetime of metallurgical silicon wafer
01/22/2014CN103531448A Apparatuses for atomic layer deposition
01/22/2014CN103531447A Method for reducing defect density of gallium nitride nanowire array crystal
01/22/2014CN103531446A Method for preparing interconnected structure of metal hard mask layer and copper
01/22/2014CN103531445A Technique for reducing depth-to-width ratio of LTPS (low temperature poly silicon) contact hole
01/22/2014CN103531444A Method for forming semiconductor structure
01/22/2014CN103531443A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/22/2014CN103531442A Preparation method of flexible substrate
01/22/2014CN103531441A Preparation method of multi-port quantum regulation and control device based on bifurcated nanowire
01/22/2014CN103531440A Surface repairing method for back side of wafer
01/22/2014CN103531439A Method for lowering trap led-out resistance
01/22/2014CN103531438A Device for processing substrate or substrate pair
01/22/2014CN103531437A Method for manufacturing semiconductor device and semiconductor device
01/22/2014CN103531429A Plasma etching device and etching method thereof
01/22/2014CN103531428A Etch tool process indicator method and apparatus
01/22/2014CN103531138A Test structure of display panel, test method thereof and test structure after testing
01/22/2014CN103530679A Semiconductor device and method of manufacturing the same
01/22/2014CN103529613A Array substrate, manufacturing method thereof and display device
01/22/2014CN103529608A Array substrate for liquid crystal display device and method for fabricating the same
01/22/2014CN103529054A Diode/triode appearance inspection and packaging device
01/22/2014CN103526296A Method of manufacturing gallium nitride substrate and gallium nitride substrate manufactured by the same
01/22/2014CN103526205A Wet etching device
01/22/2014CN103526184A Method of operating film deposition apparatus and film deposition apparatus
01/22/2014CN103526183A Film deposition apparatus, and method of depositing a film
01/22/2014CN103526180A Film forming method
01/22/2014CN103526178A Silicon oxide film forming method and forming apparatus
01/22/2014CN103525324A Adhesive tape for surface protection of a semiconductor wafer and method of producing a semiconductor wafer
01/22/2014CN103525323A Adhesive tape for surface protection of a semiconductor wafer and method of producing a semiconductor wafer using the same
01/22/2014CN103525322A Sealing resin sheet, method for producing electronic component package and electronic component package
01/22/2014CN103522294A Front manipulator end effector provided with limiter
01/22/2014CN103521871A Method and apparatus for dispensing a fluxless solder on a substrate
01/22/2014CN103521474A Method for cleaning surfaces of sapphire substrate materials by using polishing to replace washing
01/22/2014CN103521423A High-frequency piezoelectric ultrasonic transducer used for integrated circuit thermosonic bonding equipment
01/22/2014CN102893315B 有源矩阵基板和显示面板 The active matrix substrate and a display panel
01/22/2014CN102593064B Manufacturing method of gate-control diode semiconductor memory device
01/22/2014CN102543937B Flip chip on-chip package and manufacturing method thereof
01/22/2014CN102543907B Package and manufacture method for thermal enhanced quad flat no-lead flip chip
01/22/2014CN102543836B Method for etching through hole
01/22/2014CN102486987B Etching method and system
01/22/2014CN102482507B Near-infrared absorbing film compositions
01/22/2014CN102479726B Manufacturing method of semiconductor packaging component
01/22/2014CN102468339B Active element and method for manufacturing the same
01/22/2014CN102468334B VDMOS (Vertical Double-diffusion Metal Oxide Semiconductor Structure) device and manufacturing method thereof
01/22/2014CN102446787B Vacuum transmission processing equipment and method
01/22/2014CN102364390B Liquid crystal display (LCD) panel and method for forming same
01/22/2014CN102257091B Cutting fluid composition for wiresawing
01/22/2014CN102254952B Stacked capacitor for double-poly flash memory and manufacture method thereof
01/22/2014CN102254861B Manufacturing methods of thin film transistor matrix substrate and display panel
01/22/2014CN102227678B Liquid crystal display device and method for manufacturing liquid crystal display device tft substrate
01/22/2014CN102197340B Exposure apparatus and photomask
01/22/2014CN102189542B Manipulator for conveying semiconductor wafers
01/22/2014CN102177573B Semiconductor devices having faceted silicide contacts, and related fabrication methods
01/22/2014CN102106191B Workpiece support for a plasma reactor with controlled apportionment of RF power to a process kit ring
01/22/2014CN102105619B Sputtering target for oxide thin film and process for producing the sputtering target
01/22/2014CN102064151B Lead frame for manufacturing discrete semiconductor and manufacturing method thereof
01/22/2014CN102009812B Cassette transport apparatus
01/22/2014CN101952193B Microfluidic device and methods of operation and making
01/22/2014CN101901798B Semiconductor device and manufacturing method of the same
01/22/2014CN101872779B Image display system and manufacturing method thereof
01/22/2014CN101862907B Laser beam machining method, laser beam machining apparatus, and laser machined product
01/22/2014CN101802629B Method and apparatus for measuring a lifetime of charge carriers
01/22/2014CN101783365B Transistor with wire source and drain
01/22/2014CN101768412B CMP slurry composition for barrier polishing for manufacturing copper interconnects, polishing method using the composition, and semiconductor device manufactured by the method
01/22/2014CN101764144B El apparatus, method for manufacturing the el apparatus and electronic equipment
01/22/2014CN101631641B Device for processing substrate
01/22/2014CN101326639B Resistance in an integrated circuit
01/21/2014USRE44720 Method of manufacturing a MOSFET structure
01/21/2014US8635573 Method of fabricating a semiconductor device having a defined minimum gate spacing between adjacent gate structures
01/21/2014US8634266 Semiconductor device
01/21/2014US8634236 Phase change memory device, storage system having the same and fabricating method thereof
01/21/2014US8634170 Semiconductor integrated circuit
01/21/2014US8634060 Method for a multiple exposure, microlithography projection exposure installation and a projection system
01/21/2014US8634056 Lithographic apparatus and device manufacturing method
01/21/2014US8633643 LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
01/21/2014US8633636 Laminated ceramic electronic component and manufacturing method thereof
01/21/2014US8633602 Semiconductor device, and method and apparatus for manufacturing the same
01/21/2014US8633595 Semiconductor device having groove-shaped via-hole
01/21/2014US8633594 Semiconductor device having groove-shaped via-hole