| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2014 | WO2014014109A1 Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell |
| 01/23/2014 | WO2014014108A1 Passivation-layer-forming composition, semiconductor substrate having passivation layer, method for manufacturing semiconductor substrate having passivation layer, solar-cell element, method for manufacturing solar-cell element, and solar cell |
| 01/23/2014 | WO2014014107A1 Composition for forming passivation layer, semiconductor substrate with passivation layer, method for producing said semiconductor substrate, solar cell element, and method for producing same |
| 01/23/2014 | WO2014014091A1 Target assembly |
| 01/23/2014 | WO2014014058A1 Electronic part and method for manufacturing same |
| 01/23/2014 | WO2014014057A1 Semiconductor film and semiconductor element |
| 01/23/2014 | WO2014014039A1 Display device and electronic device including the display device |
| 01/23/2014 | WO2014014034A1 Resin composition for forming resist underlayer film, resist underlayer film, method for forming resist underlayer film, pattern forming method, crosslinking agent and compound |
| 01/23/2014 | WO2014014008A1 Production method for sealing layer-coated semiconductor element and semiconductor device |
| 01/23/2014 | WO2014014007A1 Sealing layer-coated semiconductor and production method for semiconductor device |
| 01/23/2014 | WO2014013980A1 Composite wafer and manufacturing method therefor |
| 01/23/2014 | WO2014013970A1 Epoxy resin composition for semiconductor encapsulation and method for manufacturing semiconductor device |
| 01/23/2014 | WO2014013961A1 Liquid crystal display device |
| 01/23/2014 | WO2014013959A1 Semiconductor device and method for manufacturing semiconductor device |
| 01/23/2014 | WO2014013956A1 Semiconductor device and method for manufacturing same, and rinsing fluid |
| 01/23/2014 | WO2014013941A1 Method for manufacturing semiconductor device |
| 01/23/2014 | WO2014013922A1 Structure having stainproof microrelief surface and process for producing same |
| 01/23/2014 | WO2014013902A1 Cleaning fluid for semiconductor, and cleaning method using same |
| 01/23/2014 | WO2014013888A1 Semiconductor device and semiconductor device fabrication method |
| 01/23/2014 | WO2014013887A1 Apparatus for polishing plate-like body and method for polishing plate-like body |
| 01/23/2014 | WO2014013882A1 Water-repellent protective film, and chemical solution for forming protective film |
| 01/23/2014 | WO2014013865A1 Wafer appearance inspection device and method for setting sensitivity threshold value for wafer appearance inspection device |
| 01/23/2014 | WO2014013864A1 Upper electrode and plasma processing apparatus |
| 01/23/2014 | WO2014013863A1 Bottom electrode and plasma treatment apparatus |
| 01/23/2014 | WO2014013856A1 Exposure apparatus, method of obtaining amount of regulation of object to be regulated, program, and method of manufacturing article |
| 01/23/2014 | WO2014013848A1 Semiconductor device |
| 01/23/2014 | WO2014013821A1 Semiconductor device and production method for semiconductor device |
| 01/23/2014 | WO2014013809A1 Method for treating substrate |
| 01/23/2014 | WO2014013764A1 Heater for bonding device and method for cooling same |
| 01/23/2014 | WO2014013733A1 Supporting apparatus, movable body apparatus, exposure apparatus, and device manufacturing method |
| 01/23/2014 | WO2014013728A1 Sputtering target, oxide semiconductor thin film, and method for producing oxide semiconductor thin film |
| 01/23/2014 | WO2014013697A1 Electronic device and method for manufacturing same |
| 01/23/2014 | WO2014013581A1 Semiconductor device |
| 01/23/2014 | WO2014013563A1 Imprinting device |
| 01/23/2014 | WO2014013214A1 An alkyltelluroether precursor for use in the single source chemical vapour deposition of a metal telluride |
| 01/23/2014 | WO2014013193A1 Method for manufacturing a thin film of ordered silicon nanopatterns |
| 01/23/2014 | WO2014013173A1 Process for fabricating a single-crystal film |
| 01/23/2014 | WO2014013078A1 Semiconductor die with a through silicon via and manufacturing process of a such via |
| 01/23/2014 | WO2014013055A1 Coating process and coating for press-fit contact |
| 01/23/2014 | WO2014012953A1 Method for assessing the quality of a brick separated from an ingot |
| 01/23/2014 | WO2014012879A1 Device for separating wafers |
| 01/23/2014 | WO2014012749A1 Electrostatic clamp, lithographic apparatus and method |
| 01/23/2014 | WO2014012638A1 Electro-adhesion gripper for holding workpieces |
| 01/23/2014 | WO2014012437A1 Paste applying mechanism for applying conductive paste on surface of conductive wire and paste applying method |
| 01/23/2014 | WO2014012436A1 Calibration mechanism and method for calibrating solar cell |
| 01/23/2014 | WO2014012427A1 Manufacturing method for dmos semiconductor device |
| 01/23/2014 | WO2014012426A1 Method for manufacturing field stop igbt |
| 01/23/2014 | WO2014012425A1 Method for manufacturing field stop igbt |
| 01/23/2014 | WO2014012370A1 Chip package and packaging method |
| 01/23/2014 | WO2014012334A1 Manufacturing method of array substrate and array substrate and display device |
| 01/23/2014 | WO2014012324A1 Hybrid etching method for forming hole on substrate of nitride device |
| 01/23/2014 | WO2014012320A1 Thin film transistor and manufacturing method thereof, array substrate, and display device |
| 01/23/2014 | WO2014012276A1 Semiconductor device fabrication method |
| 01/23/2014 | WO2014012275A1 Semiconductor component and manufacturing method therefor |
| 01/23/2014 | WO2014012271A1 Semiconductor device fabrication method |
| 01/23/2014 | WO2014012266A1 Method for forming gate structure, method for forming semiconductor component, and semiconductor component |
| 01/23/2014 | WO2014012265A1 Method for forming gate structure, method for forming semiconductor component, and semiconductor component |
| 01/23/2014 | WO2014012264A1 Gate structure, semiconductor component, and methods for forming both |
| 01/23/2014 | WO2014012263A1 Semiconductor device and method for manufacturing same |
| 01/23/2014 | WO2014012237A1 Method and apparatus for growing nitride-based compound semiconductor crystals |
| 01/23/2014 | WO2014012136A2 Cmos fabrication of a thin-film bulk acoustic resonator |
| 01/23/2014 | WO2013176905A4 A high electron mobility field effect transistor and method of manufacturing the same |
| 01/23/2014 | WO2013171084A3 Electric contact structure for semiconductors |
| 01/23/2014 | WO2012103528A3 Low-temperature fabrication of metal oxide thin films and nanomaterial-derived metal composite thin films |
| 01/23/2014 | US20140024294 Polishing endpoint detection method and polishing endpoint detection apparatus |
| 01/23/2014 | US20140024225 Method of manufacturing semiconductor device, method of processing substrate and substrate processing apparatus |
| 01/23/2014 | US20140024224 Method of manufacturing semiconductor integrated circuit device |
| 01/23/2014 | US20140024223 Atomic Layer Deposition with Plasma Source |
| 01/23/2014 | US20140024222 High throughput epitaxial lift off for flexible electronics |
| 01/23/2014 | US20140024221 Etching method |
| 01/23/2014 | US20140024220 Method of fabricating an ultra low-k dielectric self-aligned via |
| 01/23/2014 | US20140024219 Image transfer process employing a hard mask layer |
| 01/23/2014 | US20140024218 Integrated Circuit Method With Triple Patterning |
| 01/23/2014 | US20140024217 Method for forming resist patterns and method for producing patterend substrates employing the resist patterns |
| 01/23/2014 | US20140024216 Gst cmp slurries |
| 01/23/2014 | US20140024215 Double patterning method |
| 01/23/2014 | US20140024214 Method for fabricating semiconductor device |
| 01/23/2014 | US20140024213 Processes for forming integrated circuits with post-patterning treament |
| 01/23/2014 | US20140024212 Multi-layer barrier layer for interconnect structure |
| 01/23/2014 | US20140024211 Use of graphene to limit copper surface oxidation, diffusion and electromigration in interconnect structures |
| 01/23/2014 | US20140024210 Low cost anti-fuse structure and method to make same |
| 01/23/2014 | US20140024209 Method of simultaneously forming multiple structures having different critical dimensions using sidewall transfer |
| 01/23/2014 | US20140024208 Integrated circuit device including low resistivity tungsten and methods of fabrication |
| 01/23/2014 | US20140024206 Etchant composition and method of forming metal wire and thin film transistor array panel using the same |
| 01/23/2014 | US20140024204 Method for Selective Growth of Highly Doped Group IV - Sn Semiconductor Materials |
| 01/23/2014 | US20140024203 Shallow heavily doped semiconductor layer by cyclic selective epitaxial deposition process |
| 01/23/2014 | US20140024201 Method for fabricating semiconductor device |
| 01/23/2014 | US20140024200 Film deposition apparatus and film deposition method |
| 01/23/2014 | US20140024199 Semiconductor wafer dicing method |
| 01/23/2014 | US20140024198 Post-gate isolation area formation for fin field effect transistor device |
| 01/23/2014 | US20140024194 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same |
| 01/23/2014 | US20140024191 Method of multiple patterning to form semiconductor devices |
| 01/23/2014 | US20140024186 Method for forming dual gate insulation layers and semiconductor device having dual gate insulation layers |
| 01/23/2014 | US20140024185 Self-aligned process to fabricate a memory cell array with a surrounding-gate access transistor |
| 01/23/2014 | US20140024183 Method of forming semiconductor structure |
| 01/23/2014 | US20140024181 Semiconductor structure having nfet extension last implants |
| 01/23/2014 | US20140024180 Interface adhesion improvement method |
| 01/23/2014 | US20140024179 Producing method of semiconductor device |
| 01/23/2014 | US20140024178 Magnetically sealed wafer plating jig system and method |
| 01/23/2014 | US20140024176 In-situ foam material as integrated heat spreader (ihs) sealant |