| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/23/2014 | US20140024175 Methods for protecting a die surface with photocurable materials |
| 01/23/2014 | US20140024173 Method of Making a Multicomponent Film |
| 01/23/2014 | US20140024172 Vapor deposition apparatus for continuous deposition and treatment of a thin film layer on a substrate |
| 01/23/2014 | US20140024147 Corrugated membrane mems actuator fabrication method |
| 01/23/2014 | US20140024146 Semiconductor structure |
| 01/23/2014 | US20140024145 Method and structure for multi-core chip product test and selective voltage binning disposition |
| 01/23/2014 | US20140024144 Integrated circuit die and method of making |
| 01/23/2014 | US20140024143 System for in-situ film stack measurement during etching and etch control method |
| 01/23/2014 | US20140024142 Spectral reflectometry window heater |
| 01/23/2014 | US20140024138 Method for etching metal layer and method for manufacturing a semiconductor device using the same |
| 01/23/2014 | US20140023461 Electrostatic charge removal for solar cell grippers |
| 01/23/2014 | US20140023460 Slit valve door with moving mating part |
| 01/23/2014 | US20140022844 Electronic device including a nonvolatile memory cell including a tunnel structure |
| 01/23/2014 | US20140022563 Periodic Patterns and Technique to Control Misalignment Between Two Layers |
| 01/23/2014 | US20140022523 Exposure apparatus, exposure method, method for producing device, and optical part |
| 01/23/2014 | US20140022430 Solid-state imaging device and manufacturing method |
| 01/23/2014 | US20140022002 Thermal management of tightly integrated semiconductor device, system and/or package |
| 01/23/2014 | US20140021982 Nanoelectromechanical logic devices |
| 01/23/2014 | US20140021639 Vertical System Integration |
| 01/23/2014 | US20140021638 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package |
| 01/23/2014 | US20140021637 Semiconductor device |
| 01/23/2014 | US20140021635 Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias |
| 01/23/2014 | US20140021632 Vertical type semiconductor device and method for manufacturing the same |
| 01/23/2014 | US20140021631 Semiconductor device and manufacturing method thereof |
| 01/23/2014 | US20140021629 Semiconductor package and method of fabricating the same |
| 01/23/2014 | US20140021628 Method for forming interlayer connectors in a three-dimensional stacked ic device |
| 01/23/2014 | US20140021626 Liquid crystal display device and method of manufacturing a liquid crystal display device |
| 01/23/2014 | US20140021624 Mounting structure of semiconductor device and method of manufacturing the same |
| 01/23/2014 | US20140021623 Method of forming electric contact interface regions of an electronic device |
| 01/23/2014 | US20140021622 Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections |
| 01/23/2014 | US20140021621 Packaged semiconductor die with power rail pads |
| 01/23/2014 | US20140021620 Power device and power device module |
| 01/23/2014 | US20140021618 Semiconductor device and manufacturing method of same |
| 01/23/2014 | US20140021617 Semiconductor substrate and method of fabricating the same |
| 01/23/2014 | US20140021615 Multi-layer barrier layer stacks for interconnect structures |
| 01/23/2014 | US20140021614 Hybrid interconnect scheme including aluminum metal line in low-k dielectric |
| 01/23/2014 | US20140021613 Multi-layer barrier layer for interconnect structure |
| 01/23/2014 | US20140021612 Semiconductor device and fabricating process for the same |
| 01/23/2014 | US20140021611 Novel Copper Etch Scheme for Copper Interconnect Structure |
| 01/23/2014 | US20140021610 Chip package and a method for manufacturing a chip package |
| 01/23/2014 | US20140021609 Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device |
| 01/23/2014 | US20140021608 Semiconductor package and method of fabricating the same |
| 01/23/2014 | US20140021607 Solder volume compensation with c4 process |
| 01/23/2014 | US20140021606 Control of silver in c4 metallurgy with plating process |
| 01/23/2014 | US20140021605 Package on Package Devices and Methods of Packaging Semiconductor Dies |
| 01/23/2014 | US20140021603 Using an interconnect bump to traverse through a passivation layer of a semiconductor die |
| 01/23/2014 | US20140021601 Semiconductor manufacturing method and semiconductor structure thereof |
| 01/23/2014 | US20140021600 Redistribution layer (rdl) with variable offset bumps |
| 01/23/2014 | US20140021599 Three-dimensional integrated circuits and fabrication thereof |
| 01/23/2014 | US20140021598 Methods and arrangements relating to semiconductor packages including multi-memory dies |
| 01/23/2014 | US20140021596 Wafer-level device packaging |
| 01/23/2014 | US20140021590 Method of Manufacturing Semiconductor Devices Using Ion Implantation |
| 01/23/2014 | US20140021589 Semiconductor Photocatalyst Coated with Graphitic Carbon Film and Method of Fabricating the Same |
| 01/23/2014 | US20140021588 Semiconductor device and production method |
| 01/23/2014 | US20140021584 Process-compatible decoupling capacitor and method for making the same |
| 01/23/2014 | US20140021583 Package structures including a capacitor and methods of forming the same |
| 01/23/2014 | US20140021582 Configurable passive components |
| 01/23/2014 | US20140021578 Vertical electronic fuse |
| 01/23/2014 | US20140021577 Semiconductor structures and devices and methods of forming the same |
| 01/23/2014 | US20140021560 High voltage device with a parallel resistor |
| 01/23/2014 | US20140021556 Spacer shaper formation with conformal dielectric film for void free pmd gap fill |
| 01/23/2014 | US20140021555 Manufacturing method of semiconductor device and semiconductor device |
| 01/23/2014 | US20140021553 Semiconductor device and method of fabricating the same |
| 01/23/2014 | US20140021552 Strain Adjustment in the Formation of MOS Devices |
| 01/23/2014 | US20140021548 Semiconductor-on-insulator (soi) structure with selectively placed sub-insulator layer void(s) and method of forming the soi structure |
| 01/23/2014 | US20140021547 Integrated circuit including transistor structure on depleted silicon-on-insulator, related method and design structure |
| 01/23/2014 | US20140021544 Double Diffused Drain Metal Oxide Semiconductor Device and Manufacturing Method Thereof |
| 01/23/2014 | US20140021539 Power Transistor with High Voltage Counter Implant |
| 01/23/2014 | US20140021538 Replacement Gate Fin First Wire Last Gate All Around Devices |
| 01/23/2014 | US20140021535 Semiconductor device having vertical gates and fabrication thereof |
| 01/23/2014 | US20140021534 Integration of high voltage trench transistor with low voltage cmos transistor |
| 01/23/2014 | US20140021532 Vertical tunnel field effect transistor (fet) |
| 01/23/2014 | US20140021526 Electronic device including a tunnel structure |
| 01/23/2014 | US20140021523 Dram with dual level word lines |
| 01/23/2014 | US20140021517 Semiconductor Device and Fabrication Method Thereof |
| 01/23/2014 | US20140021490 Semiconductor device and method of fabricating same |
| 01/23/2014 | US20140021484 Semiconductor Device |
| 01/23/2014 | US20140021481 Nitride-based semiconductor device and manufacturing method thereof |
| 01/23/2014 | US20140021479 Gan power device with solderable back metal |
| 01/23/2014 | US20140021477 Systems, methods and materials including crystallization of substrates via sub-melt laser anneal, as well as products produced by such processes |
| 01/23/2014 | US20140021476 Semiconductor device and method of manufacturing thereof |
| 01/23/2014 | US20140021469 Integrated circuit including sensor structure, related method and design structure |
| 01/23/2014 | US20140021459 Light emitting device |
| 01/23/2014 | US20140021439 Semiconductor Constructions, Memory Arrays, Methods of Forming Semiconductor Constructions and Methods of Forming Memory Arrays |
| 01/23/2014 | US20140021431 Semiconductor Constructions, Memory Cells, Memory Arrays and Methods of Forming Memory Cells |
| 01/23/2014 | US20140021264 Chip card module |
| 01/23/2014 | US20140021162 Manufacturing method of lead frame substrate |
| 01/23/2014 | US20140021038 Sputtering target, method for manufacturing the same, and method for manufacturing thin film transistor |
| 01/23/2014 | US20140020926 Lead frame, lead frame assembly and method of cutting lead frame assembly |
| 01/23/2014 | US20140020834 Apparatus for etching high aspect ratio features |
| 01/23/2014 | US20140020831 Plasma processing apparatus |
| 01/23/2014 | US20140020750 Silicon substrate having textured surface, and process for producing same |
| 01/23/2014 | US20140020721 Substrate processing method, substrate processing apparatus and storage medium |
| 01/23/2014 | US20140020712 Method and materials for making a monolithic porous pad cast onto a rotatable base |
| 01/23/2014 | US20140020709 Plasma etching apparatus and plasma cleaning method |
| 01/23/2014 | US20140020628 Shadow mask module and organic vapor deposition apparatus and thermal evaporation apparatus using the same |
| 01/23/2014 | US20140020619 Method for Growing a Monocrystalline Tin-Containing Semiconductor Material |
| 01/23/2014 | US20140020259 Systems and methods for at least partially converting films to silicon oxide and/or improving film quality using ultraviolet curing in steam and densification of films using uv curing in ammonia |
| 01/23/2014 | DE112012001891T5 Verfahren zum Polieren eines nicht-Oxid-Einkristallsubstrats A method of polishing a non-oxide single-crystal substrate |
| 01/23/2014 | DE112012001845T5 Vorrichtung zum Abscheiden von Materialien auf einem Substrat An apparatus for depositing materials on a substrate |