| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/15/2014 | CN103515288A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515287A Method for manufacturing isolation groove, and light-emitting device |
| 01/15/2014 | CN103515286A Method for manufacturing shallow trench isolation structure |
| 01/15/2014 | CN103515285A Semiconductor structure and manufacturing process thereof |
| 01/15/2014 | CN103515284A Groove isolation structure and manufacturing method thereof |
| 01/15/2014 | CN103515283A Semiconductor device manufacturing method |
| 01/15/2014 | CN103515282A Fin field-effect transistor and forming method thereof |
| 01/15/2014 | CN103515281A Method for manufacturing shallow trench isolation structure |
| 01/15/2014 | CN103515280A Ejector pin device, lower electrode assembly, and assembly and disassembly methods of lower electrode assembly |
| 01/15/2014 | CN103515279A Method of manufacturing semiconductor element |
| 01/15/2014 | CN103515278A 真空吸笔 Vacuum suction pen |
| 01/15/2014 | CN103515277A Vacuum suction open |
| 01/15/2014 | CN103515276A Adhesive film, method of manufacturing semiconductor device, and semiconductor device |
| 01/15/2014 | CN103515275A Multi-focal length optical alignment apparatus and alignment method of multiple stacked substrates |
| 01/15/2014 | CN103515274A Solder ball printing and mounting apparatus |
| 01/15/2014 | CN103515273A Wafer transmission system |
| 01/15/2014 | CN103515272A Two-way conveyor used for solar cell panel production line |
| 01/15/2014 | CN103515271A Accommodation cassette |
| 01/15/2014 | CN103515270A Vacuum suction disk anti-blocking system in wet processing equipment |
| 01/15/2014 | CN103515269A Apparatus and method for adhering sheet |
| 01/15/2014 | CN103515268A Substrate placing method and equipment for vacuum processing system |
| 01/15/2014 | CN103515267A Device for and method of generating wiring data, and imaging system |
| 01/15/2014 | CN103515266A Sorting device for sorting wafers in magazine, and semiconductor apparatus having the same |
| 01/15/2014 | CN103515265A Method for detecting alignment deviation of through holes and lower layers of metal wires |
| 01/15/2014 | CN103515264A Detection apparatus and detection method for wafer position |
| 01/15/2014 | CN103515263A Test device and test method |
| 01/15/2014 | CN103515262A Wedge bonder and a method of cleaning a wedge bonder |
| 01/15/2014 | CN103515261A Method for manufacturing semiconductor device, and semiconductor device |
| 01/15/2014 | CN103515260A Package-in-packages and methods of formation thereof |
| 01/15/2014 | CN103515259A Method of manufacturing semiconductor packaging |
| 01/15/2014 | CN103515258A System and method for forming uniform rigid interconnect structures |
| 01/15/2014 | CN103515257A High-density semiconductor packaging structure packaging method |
| 01/15/2014 | CN103515256A A method for manufacturing a chip package, a chip package and a wafer level package |
| 01/15/2014 | CN103515255A IC card chip glue dispensing and packaging all-in-one machine |
| 01/15/2014 | CN103515254A Chip arrangements and a method for forming a chip arrangement |
| 01/15/2014 | CN103515253A Methods for manufacturing a chip package, a method for manufacturing a wafer level package, and a compression apparatus |
| 01/15/2014 | CN103515252A Semiconductor device and method of forming an embedded SOP fan-out package |
| 01/15/2014 | CN103515251A Bonding package components through plating |
| 01/15/2014 | CN103515250A Production method of 75-micron ultrathin chips |
| 01/15/2014 | CN103515249A Firstly-packaged secondly-etched three-dimensional system level chip front-installed bump packaged structure and technology method thereof |
| 01/15/2014 | CN103515248A Solder flow impeding feature on a lead frame |
| 01/15/2014 | CN103515247A Method of making cavity substrate with built-in stiffener and cavity |
| 01/15/2014 | CN103515246A Method of manufacturing a semiconductor device, and semiconductor device |
| 01/15/2014 | CN103515245A Channel voltage dividing field effect tube and production method based on high-energy ion implantation mode |
| 01/15/2014 | CN103515244A Replacement metal gate processing with reduced interlevel dielectric layer etch rate |
| 01/15/2014 | CN103515243A Transistor with recess gate and method for fabricating the same |
| 01/15/2014 | CN103515242A Power transistor and manufacturing method thereof |
| 01/15/2014 | CN103515241A Manufacturing method of semi-conductor component |
| 01/15/2014 | CN103515240A Transverse diffusion field effect transistor structure and manufacturing method |
| 01/15/2014 | CN103515239A Method for manufacturing ultra-thin SOI semiconductor device and ultra-thin SOI semiconductor device |
| 01/15/2014 | CN103515238A NMOS transistor and formation method, CMOS structure and formation method thereof |
| 01/15/2014 | CN103515237A Formation method of transistor |
| 01/15/2014 | CN103515236A Method for preparing thin-film transistor on flexible substrate |
| 01/15/2014 | CN103515235A Method for manufacturing metal gate semiconductor device |
| 01/15/2014 | CN103515234A Method of forming FinFET |
| 01/15/2014 | CN103515233A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515232A Semiconductor structure and manufacturing method thereof |
| 01/15/2014 | CN103515231A FinFET manufacturing method |
| 01/15/2014 | CN103515230A Semiconductor structure and formation method thereof |
| 01/15/2014 | CN103515229A Method for forming fin portion and fin field effect transistor |
| 01/15/2014 | CN103515228A Manufacturing method for semiconductor device |
| 01/15/2014 | CN103515227A Method of manufacturing a semiconductor device and a semiconductor device |
| 01/15/2014 | CN103515226A Buried polycrystal stripe inner transparent collector region insulated gate bipolar transistor and manufacturing method |
| 01/15/2014 | CN103515225A Method for manufacturing a diode, and a diode |
| 01/15/2014 | CN103515224A Rapid annealing method for polysilicon after ion implantation |
| 01/15/2014 | CN103515223A FinFET manufacturing method |
| 01/15/2014 | CN103515222A Top metal-layer groove etching method |
| 01/15/2014 | CN103515221A Semiconductor device and method of manufacturing the same |
| 01/15/2014 | CN103515220A Substrate processing apparatus and substrate processing method |
| 01/15/2014 | CN103515219A Substrate processing apparatus |
| 01/15/2014 | CN103515218A Substrate processing apparatus |
| 01/15/2014 | CN103515217A Formation method of metal silicide layer and formation method of NMOS transistor |
| 01/15/2014 | CN103515216A Method for manufacturing semiconductor component |
| 01/15/2014 | CN103515215A Method for manufacturing fin field effect tube |
| 01/15/2014 | CN103515214A Manufacturing method of semiconductor device |
| 01/15/2014 | CN103515213A Method of forming FinFET gate medium layer and method of forming FinFET |
| 01/15/2014 | CN103515212A Manufacturing method of semiconductor device for preventing metal silicide bridge |
| 01/15/2014 | CN103515211A Method for manufacturing semiconductor device with air gap |
| 01/15/2014 | CN103515210A Gate-last process transistor and forming method thereof |
| 01/15/2014 | CN103515209A Fin field effect transistor and formation method thereof |
| 01/15/2014 | CN103515208A A method for forming metal salicide layers and a method for forming storage unit gate electrodes of a flash memory |
| 01/15/2014 | CN103515207A Oxide layer, interface layer in HKMG structure, MOS transistor formation method and MOS transistor |
| 01/15/2014 | CN103515206A Preparation method for nanometer quantum dot floating gate |
| 01/15/2014 | CN103515205A FinFET channel doping method |
| 01/15/2014 | CN103515204A Heat treatment apparatus and heat treatment method |
| 01/15/2014 | CN103515203A Heat treatment method and heat treatment apparatus |
| 01/15/2014 | CN103515202A Semiconductor device and method of manufacturing semiconductor device |
| 01/15/2014 | CN103515201A Method and epitaxial product for forming compound epitaxial layer through chemical bonding |
| 01/15/2014 | CN103515200A Preparation method of thick polysilicon |
| 01/15/2014 | CN103515199A Mask pattern for hole patterning and method for fabricating semiconductor device using same |
| 01/15/2014 | CN103515198A Process method for continuously forming two holes or grooves with different depths |
| 01/15/2014 | CN103515197A Self-aligned multi-patterning mask layer and formation method thereof |
| 01/15/2014 | CN103515196A Method for material epitaxial doping |
| 01/15/2014 | CN103515195A Substrate resistor and method of making same |
| 01/15/2014 | CN103515194A Method of fabricating semiconductor device |
| 01/15/2014 | CN103515193A Semiconductor device fine pattern manufacturing method |
| 01/15/2014 | CN103515192A Quick thermal annealing method |
| 01/15/2014 | CN103515191A 半导体结构及其形成方法 And method of forming a semiconductor structure |
| 01/15/2014 | CN103515190A Treating apparatus for substrate |
| 01/15/2014 | CN103515179A Plasma reaction chamber and plasma device with same |