| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/09/2014 | US20140008809 Die up fully molded fan-out wafer level packaging |
| 01/09/2014 | US20140008806 Stair step formation using at least two masks |
| 01/09/2014 | US20140008805 Component and Method of Manufacturing a Component Using an Ultrathin Carrier |
| 01/09/2014 | US20140008801 Submicron connection layer and method for using the same to connect wafers |
| 01/09/2014 | US20140008800 Method for manufacturing through substrate via (tsv), structure and control method of tsv capacitance |
| 01/09/2014 | US20140008799 Method for fabricating metal line and device with metal line |
| 01/09/2014 | US20140008795 Semiconductor package and method of fabricating the same |
| 01/09/2014 | US20140008787 Conductive bump structure and method of fabricating a semiconductor structure |
| 01/09/2014 | US20140008786 Bump-on-trace packaging structure and method for forming the same |
| 01/09/2014 | US20140008785 Package Redistribution Layer Structure and Method of Forming Same |
| 01/09/2014 | US20140008779 Wafer level package, chip size package device and method of manufacturing wafer level package |
| 01/09/2014 | US20140008777 Thermal leadless array package with die attach pad locking feature |
| 01/09/2014 | US20140008776 Chip package and method of manufacturing the same |
| 01/09/2014 | US20140008774 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof |
| 01/09/2014 | US20140008773 Integrated Antenna Structure |
| 01/09/2014 | US20140008771 Method for forming compound epitaxial layer by chemical bonding and epitaxy product made by the same method |
| 01/09/2014 | US20140008768 Semiconductor wafer and manufacturing method thereof |
| 01/09/2014 | US20140008767 Oxide removal from semiconductor surfaces |
| 01/09/2014 | US20140008763 Distributed substrate top contact for moscap measurements |
| 01/09/2014 | US20140008759 Fuse of semiconductor device and method for forming the same |
| 01/09/2014 | US20140008758 Complementary bipolar inverter |
| 01/09/2014 | US20140008757 Integrating through substrate vias from wafer backside layers of integrated circuits |
| 01/09/2014 | US20140008756 Deep trench heat sink |
| 01/09/2014 | US20140008737 Cantilever Packages for Sensor MEMS (MIcro-Electro-Mechanical System) |
| 01/09/2014 | US20140008736 FinFET with High Mobility and Strain Channel |
| 01/09/2014 | US20140008734 Multi-Gate FETs and Methods for Forming the Same |
| 01/09/2014 | US20140008733 Drain extended mos device for bulk finfet technology |
| 01/09/2014 | US20140008731 Field-effect-transistor with self-aligned diffusion contact |
| 01/09/2014 | US20140008730 Complementary Metal-Oxide-Semiconductor Device Comprising Silicon and Germanium and Method for Manufacturing Thereof |
| 01/09/2014 | US20140008729 Strained silicon and strained silicon germanium on insulator |
| 01/09/2014 | US20140008726 Semiconductor structure and method of fabricating the same |
| 01/09/2014 | US20140008723 Lateral insulated gate bipolar transistor structure with low parasitic bjt gain and stable threshold voltage |
| 01/09/2014 | US20140008720 Integrated circuit and method for fabricating the same having a replacement gate structure |
| 01/09/2014 | US20140008717 Charge Compensation Semiconductor Device |
| 01/09/2014 | US20140008714 Three Dimensional NAND Device and Method of Charge Trap Layer Separation and Floating Gate Formation in the NAND Device |
| 01/09/2014 | US20140008713 Method and apparatus for embedded nvm utilizing an rmg process |
| 01/09/2014 | US20140008711 Vertical gate device with reduced word line resistivity |
| 01/09/2014 | US20140008699 Iii-v compound semiconductor device having metal contacts and method of making the same |
| 01/09/2014 | US20140008692 Molded package for light emitting device and light emitting device using the same |
| 01/09/2014 | US20140008659 High electron mobility transistor and method of forming the same |
| 01/09/2014 | US20140008658 Stress-Controlled HEMT |
| 01/09/2014 | US20140008644 Oxygen engineered single-crystal reo template |
| 01/09/2014 | US20140008616 Transistor device and materials for making |
| 01/09/2014 | US20140008613 Stacked semiconductor device and a method of manufacturing the same |
| 01/09/2014 | US20140008612 Coupled Asymmetric Quantum Confinement Structures |
| 01/09/2014 | US20140008611 Structures and methods relating to graphene |
| 01/09/2014 | US20140008605 Method for dispersing quantum dots or quantum wires in zeolite, method for stabilizing quantum dots or quantum wires in zeolite, and zeolite containing quantum dots or quantum wires dispersed by the method |
| 01/09/2014 | US20140008604 Super-Long Semiconductor Nano-Wire Structure and Method of Making |
| 01/09/2014 | US20140008602 Thermal isolation in memory cells |
| 01/09/2014 | US20140008234 Method of metal plating semiconductors |
| 01/09/2014 | US20140008112 Single Component, Low Temperature Curable Polymeric Composition And Related Method |
| 01/09/2014 | US20140008017 Ejection apparatus for lifting chips off of carrier materials |
| 01/09/2014 | US20140007902 Method of stripping photoresist on a single substrate system |
| 01/09/2014 | DE202010018093U1 Testvorrichtung Test device |
| 01/09/2014 | DE19983711B3 Wortleitungstreiber für Halbleiterspeicher Wordline drivers for semiconductor memories |
| 01/09/2014 | DE112012000932T5 Verbessertes Seitenwand-Bildübertragungsverfahren Improved sidewall image transfer method |
| 01/09/2014 | DE112012000755T5 Siliciumcarbid-Halbleitervorrichtung und Verfahren zu deren Fertigung Silicon carbide semiconductor device and process for their production |
| 01/09/2014 | DE112012000748T5 Siliziumcarbid-Halbleitervorrichtung und Verfahren zu deren Fertigung Silicon carbide semiconductor device and process for their production |
| 01/09/2014 | DE10320874B4 Integrierter Halbleiterspeicher mit einem Transistor verringerter Gate-Oxiddicke Integrated semiconductor memory having a transistor gate oxide thickness reduced |
| 01/09/2014 | DE102013213205A1 Halbleitereinheit Semiconductor unit |
| 01/09/2014 | DE102013212864A1 Halbleiterchip und Verfahren zum Erkennen eines Defekts in einem Halbleiterchip Semiconductor chip and method for detecting a defect in a semiconductor chip |
| 01/09/2014 | DE102013106994A1 Bauteil und Verfahren zur Herstellung eines Bauteils mittels eines ultradünnen Trägers Component and process for producing a component by means of an ultra-thin carrier |
| 01/09/2014 | DE102013106936A1 Chip-Baustein und Verfahren zu seiner Herstellung Chip package and process for its preparation |
| 01/09/2014 | DE102013106931A1 Plasmasystem, Spannvorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung Plasma system, tensioning device and method of manufacturing a semiconductor device |
| 01/09/2014 | DE102013106774A1 Verfahren zur Herstellung einer Halbleiter-LED A process for producing a semiconductor LED |
| 01/09/2014 | DE102013106622A1 Durch mechanische Spannung gesteuerter HEMT By mechanical tension controlled HEMT |
| 01/09/2014 | DE102013106152A1 Drainerweiterte MOS-Vorrichtung für Bulk-Finfet-Technologie Extended drain MOS device for bulk FinFET technology |
| 01/09/2014 | DE102013010734A1 Halbleitervorrichtung und verfahren zum herstellen der halbleitervorrichtung A semiconductor device and method of manufacturing the semiconductor device |
| 01/09/2014 | DE102012109319A1 Bump-on-Trace-Baugruppenstruktur und Verfahren zur Herstellung derselben Bump-on-trace assembly structure and method of manufacturing the same |
| 01/09/2014 | DE102012108142A1 Vorrichtung und Verfahren für einen MOS-Transistor Apparatus and method for a MOS transistor |
| 01/09/2014 | DE102012013539A1 Wafer und Verfahren zur Herstellung von Wafern mit Oberflächenstrukturen Wafer and Process for the preparation of wafers having surface structures |
| 01/09/2014 | DE102012013370A1 Ausstoßvorrichtung zum Abheben eines Chips von einem Trägermaterial An emission device for picking up a chip from a carrier material |
| 01/09/2014 | DE102011112270B4 Vorrichtung zum Auftrennen eines Ingots in Ingotabschnitte An apparatus for separating a ingots in Ingotabschnitte |
| 01/09/2014 | DE102011111175B4 Verfahren und Vorrichtung zur Flüssigkeits-Niveauregelung bei Durchlaufanlagen Method and apparatus for liquid level control in continuous flow systems |
| 01/09/2014 | DE102010037247B4 Halbleiterstruktur und Verfahren für deren Herstellung Semiconductor structure and methods for their preparation |
| 01/09/2014 | CA2878338A1 Composite substrate for layered heaters |
| 01/08/2014 | EP2682989A1 Thyristor for controlling two types of charge carriers |
| 01/08/2014 | EP2682983A1 CMOS device comprising silicon and germanium and method for manufacturing thereof |
| 01/08/2014 | EP2682982A2 Device and method for supporting individual components |
| 01/08/2014 | EP2682981A2 Ejection device for lifting a chip from a support material |
| 01/08/2014 | EP2682980A1 Vaporizer, center rod used therein, and method for vaporizing material carried by carrier gas |
| 01/08/2014 | EP2682499A1 Copper-titanium alloy sputtering target, semiconductor wiring line formed using the sputtering target, and semiconductor element and device each equipped with the semiconductor wiring line |
| 01/08/2014 | EP2682497A1 Method for storing metallic lanthanum target, vacuum-sealed metallic lanthanum target, and thin film formed by sputtering using metallic lanthanum target |
| 01/08/2014 | EP2682442A1 Heat-peelable adhesive sheet |
| 01/08/2014 | EP2682441A1 A chemical mechanical polishing (CMP) composition comprising a non-ionic surfactant and an aromatic compound comprising at least one acid group |
| 01/08/2014 | EP2682440A1 A chemical mechanical polishing (cmp) composition comprising a non-ionic surfactant and a carbonate salt |
| 01/08/2014 | EP2682373A1 Heat treatment apparatus for ceramic materials for optical use, heat treatment method for ceramic materials for optical use, heat treatment method for synthetic quartz glass, method for producing optical system, and method for manufacturing exposure apparatus |
| 01/08/2014 | EP2682367A2 Method for n-doping graphene |
| 01/08/2014 | EP2681777A1 Semiconductor devices and fabrication methods |
| 01/08/2014 | EP2681776A2 Method for metallizing textured surfaces |
| 01/08/2014 | EP2681765A2 Apparatus and methods related to wire bond pads and reducing impact of high rf loss plating |
| 01/08/2014 | EP2681763A1 Improved system for substrate processing |
| 01/08/2014 | EP2681762A1 Wafer bonding system and method for bonding and debonding thereof |
| 01/08/2014 | EP2681761A1 Processing station for flat substrates, in particular solar cells |
| 01/08/2014 | EP2681760A2 Method and system for forming patterns using charged particle beam lithography |
| 01/08/2014 | EP2681571A2 Measurement of insulation resistance of configurable photovoltaic panels in a photovoltaic array |
| 01/08/2014 | DE202010018088U1 Testvorrichtung Test device |
| 01/08/2014 | CN203386788U Feed clamping device for LED material belts |
| 01/08/2014 | CN203386745U Semiconductor device having double-faced interconnect structure for Fo-WLCSP |
| 01/08/2014 | CN203386737U LED die bonder die sucking swing arm device |