| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/22/2014 | CN103531615A 氮化物功率晶体管及其制造方法 Nitride power transistor and its manufacturing method |
| 01/22/2014 | CN103531614A 电荷补偿半导体器件 Charge compensation of semiconductor devices |
| 01/22/2014 | CN103531613A Semiconductor device and method for producing a doped semiconductor layer |
| 01/22/2014 | CN103531607A Organic light-emitting display panel and manufacturing method thereof |
| 01/22/2014 | CN103531595A Low-temperature polycrystalline silicon transistor array substrate and manufacturing method thereof, as well as display device |
| 01/22/2014 | CN103531593A Pixel structure, array substrate, display device and manufacturing method of pixel structure |
| 01/22/2014 | CN103531591A Thin film transistor substrate having metal oxide and manufacturing method thereof |
| 01/22/2014 | CN103531590A 像素结构及其制造方法 Pixel structure and its manufacturing method |
| 01/22/2014 | CN103531589A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 01/22/2014 | CN103531588A III-V compound having a semiconductor device and a manufacturing method of the metal contact member |
| 01/22/2014 | CN103531586A Power semiconductor device and manufacturing method thereof |
| 01/22/2014 | CN103531579A Structure for improving packaging reliability of semiconductor chip and preparation method thereof |
| 01/22/2014 | CN103531578A Semiconductor devices and methods of manufacture thereof |
| 01/22/2014 | CN103531576A Trimming resistance control device and wafer testing system using device |
| 01/22/2014 | CN103531573A Substrate for semiconductor package and process for manufacturing |
| 01/22/2014 | CN103531571A Electroless-nickel-bump structure of wafer die pads and manufacturing method thereof |
| 01/22/2014 | CN103531565A Thermal leadless array package with die attach pad locking feature |
| 01/22/2014 | CN103531564A Power transistor with heat dissipation and forming method thereof |
| 01/22/2014 | CN103531560A Chip packaging structure and manufacturing method thereof |
| 01/22/2014 | CN103531559A Flip chip bonding structure and forming method thereof |
| 01/22/2014 | CN103531558A Lead frame packages and methods of formation thereof |
| 01/22/2014 | CN103531554A 半导体组件及其制造方法 The method of manufacturing a semiconductor component and |
| 01/22/2014 | CN103531553A Substrate, method of manufacturing substrate, semiconductor device, and electronic apparatus |
| 01/22/2014 | CN103531551A Semiconductor packaging structure and forming method thereof |
| 01/22/2014 | CN103531550A Packaging structure and packaging method for improved small-space plastic package |
| 01/22/2014 | CN103531549A Semiconductor chip packaging structure and packaging method |
| 01/22/2014 | CN103531548A Semiconductor package structure having an air gap and method for forming |
| 01/22/2014 | CN103531547A Semiconductor packages and methods of forming the same |
| 01/22/2014 | CN103531543A Method for reducing shadow effect in technology for preparing static random access memory |
| 01/22/2014 | CN103531542A Manufacturing method of CMOS (Complementary Metal-Oxide-Semiconductor Transistor) device for reducing back bias voltage and temperature instability |
| 01/22/2014 | CN103531541A Forming method of CMOS tube |
| 01/22/2014 | CN103531540A Manufacturing method for semiconductor device |
| 01/22/2014 | CN103531539A Method for forming CMOS tube |
| 01/22/2014 | CN103531538A Forming method of complementary type metal-oxide semiconductor tube |
| 01/22/2014 | CN103531537A 半导体装置 Semiconductor device |
| 01/22/2014 | CN103531536A Component and method of manufacturing a component using an ultrathin carrier |
| 01/22/2014 | CN103531535A Method for repairing side wall damage of ultralow dielectric constant film |
| 01/22/2014 | CN103531534A Metal groove etching method |
| 01/22/2014 | CN103531533A Method for manufacturing through substrate via (tsv), tsv structure of through silicon via and control method of tsv capacitance |
| 01/22/2014 | CN103531532A Method for forming contact window |
| 01/22/2014 | CN103531531A Method used for manufacturing semiconductor device |
| 01/22/2014 | CN103531530A Method for processing copper surface in interconnection |
| 01/22/2014 | CN103531529A Semiconductor process and semiconductor structure thereof |
| 01/22/2014 | CN103531528A Manufacturing method for dual-damascene structure |
| 01/22/2014 | CN103531527A Manufacturing method for metal interconnection structure |
| 01/22/2014 | CN103531526A Metal interconnection structure and manufacturing method therefor |
| 01/22/2014 | CN103531525A Metal interconnection structure and manufacturing method thereof |
| 01/22/2014 | CN103531524A Preparation method of interconnection structure with air gap |
| 01/22/2014 | CN103531523A Preparation method of STI (shallow trench isolation) structure |
| 01/22/2014 | CN103531522A Preparation method of STI (shallow trench isolation) structure |
| 01/22/2014 | CN103531521A Method for forming shallow trench isolation structure |
| 01/22/2014 | CN103531520A Forming method of shallow trench isolation and semiconductor structure |
| 01/22/2014 | CN103531519A 半导体结构及其形成方法 And a method for forming a semiconductor structure |
| 01/22/2014 | CN103531518A Method of determining a target mesa configuration of an electrostatic chuck |
| 01/22/2014 | CN103531517A Pickup device for chip on glass based on chip bonding manufacture procedure |
| 01/22/2014 | CN103531516A Chuck table mechanism of cutting apparatus |
| 01/22/2014 | CN103531515A Apparatus for supporting a workpiece during processing of the workpiece |
| 01/22/2014 | CN103531514A Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device |
| 01/22/2014 | CN103531513A Substrate support apparatus and substrate processing apparatus |
| 01/22/2014 | CN103531512A Vacuum generating device of wafer chuck |
| 01/22/2014 | CN103531511A Sucking disc, wafer bearing stage using same and wafer adsorption method |
| 01/22/2014 | CN103531510A Transfer and alignment photoetching method of P+ epitaxy pattern of semiconductor circuit |
| 01/22/2014 | CN103531509A Method for precisely positioning circle center on workbench |
| 01/22/2014 | CN103531508A Substrate transfer facility and transfer method |
| 01/22/2014 | CN103531507A Module bearing tray and IGBT module packaging method |
| 01/22/2014 | CN103531506A Screening, sorting and positioning jig for surface-mounted crystals |
| 01/22/2014 | CN103531505A Wafer assembly system |
| 01/22/2014 | CN103531504A Sheet adhesion apparatus and sheet adhesion method |
| 01/22/2014 | CN103531503A Method and apparatus for processing substrate |
| 01/22/2014 | CN103531502A Workpiece bench apparatus |
| 01/22/2014 | CN103531501A Etching rate monitoring method and equipment |
| 01/22/2014 | CN103531500A Calibration method of wafer defect detection equipment |
| 01/22/2014 | CN103531499A Method for monitoring matching degree between electron beam scanners |
| 01/22/2014 | CN103531498A Wafer defect analysis system |
| 01/22/2014 | CN103531497A Systems and methods for detecting defects on a wafer |
| 01/22/2014 | CN103531496A Integrated defect detection and location systems and methods in semiconductor chip devices |
| 01/22/2014 | CN103531495A Semiconductor detection apparatus, semiconductor detection system and substrate temperature detection method |
| 01/22/2014 | CN103531494A Method and system for compensating change in diameter of wire on wire bonding machine |
| 01/22/2014 | CN103531493A Semiconductor device package and manufacture method thereof |
| 01/22/2014 | CN103531492A Hybrid bonding systems and methods for semiconductor wafers |
| 01/22/2014 | CN103531491A Semiconductor technology, semiconductor structure and package structure thereof |
| 01/22/2014 | CN103531490A Packaging structure for recessed surface structure provided with controllable curvature, and manufacturing method thereof |
| 01/22/2014 | CN103531489A Method for manufacturing semiconductor device, semiconductor device and pressure bonding device |
| 01/22/2014 | CN103531488A Semiconductor device, method of manufacturing the same, and camera |
| 01/22/2014 | CN103531487A Formation method of semiconductor packaging structure |
| 01/22/2014 | CN103531486A Method for manufacturing lead frame |
| 01/22/2014 | CN103531485A Manufacturing method of substrate structure |
| 01/22/2014 | CN103531484A Manufacturing method for chip-bearing substrate structure |
| 01/22/2014 | CN103531483A Bearing part and manufacturing method of coreless packaging substrate |
| 01/22/2014 | CN103531482A Production method of graphene field-effect transistor |
| 01/22/2014 | CN103531481A Passage partial pressure field-effect transistor on basis of channel mode and production method |
| 01/22/2014 | CN103531480A Semiconductor device and driver circuit with drain and isolation structure, and method of manufacture thereof |
| 01/22/2014 | CN103531479A Semiconductor device and method of manufacturing a transistor having a vertical channel |
| 01/22/2014 | CN103531478A Multi-Gate FETs and methods for forming the same |
| 01/22/2014 | CN103531477A FinFET method and structure with embedded underlying anti-punch through layer |
| 01/22/2014 | CN103531476A Manufacturing method for semiconductor device |
| 01/22/2014 | CN103531475A Semiconductor device and manufacturing method therefor |
| 01/22/2014 | CN103531474A Manufacturing method of semiconductor device |
| 01/22/2014 | CN103531473A Etching method for silicon oxide and silicon nitride double-layer composite side wall (ON side wall) |
| 01/22/2014 | CN103531472A MOSFET and preparation method thereof |