Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/29/2014CN103538936A Piece taking mechanism for battery pieces and conveying system provided with piece taking mechanism
01/29/2014CN103537976A System and method to control thickness outline of wafer and chemical mechanical planarization process
01/29/2014CN103537975A Endpoint detection in chemical mechanical polishing using multiple spectra
01/29/2014CN103537804A 激光加工方法 The laser processing method
01/29/2014CN102646642B Manufacture method of rear-grid accumulating Si-nanometer wire field effect transistor (NWFET) based on silicon on insulator (SOI)
01/29/2014CN102593048B Treatment method of aluminum wire corrosion defects
01/29/2014CN102543838B Method for manufacturing semiconductor device
01/29/2014CN102543664B Diode lead forming device
01/29/2014CN102522328B Manufacturing method of MOS (Metal Oxide Semiconductor)-device grid-electrode hole
01/29/2014CN102501154B Work piece installing and clamping device in ion beam polishing process and method thereof
01/29/2014CN102496589B Cushion block device for track of chip mounting machine
01/29/2014CN102446952B Semiconductor structure and formation method thereof
01/29/2014CN102437103B Method for manufacturing integrated circuit with partially-redundant through holes and integrated circuit
01/29/2014CN102403392B Vacuum process equipment, vacuum transmission process equipment and methods
01/29/2014CN102341895B Semiconductor chip and semiconductor device
01/29/2014CN102337089B Wafer processing adhesive tape and method for processing semiconductor therewith
01/29/2014CN102272905B Semiconductor device and method for fabricating the same
01/29/2014CN102270607B Manufacturing method of grid stack and semiconductor device
01/29/2014CN102263160B Chip transmission device and location sensing system and visible checking system having chip transmission device
01/29/2014CN102256452B Circuit board with built-in semiconductor chip and method of manufacturing the same
01/29/2014CN102209426B Plasma processing method and plasma processing apparatus
01/29/2014CN102184891B Intelligent label, its fabrication method and management process of the goods with the same
01/29/2014CN102174299B Circuit-connecting material, and connection structure for circuit member
01/29/2014CN102171800B Semiconductor device and method for manufacturing same
01/29/2014CN102165578B Method for manufacturing semiconductor device
01/29/2014CN102161141B Welding wire machine
01/29/2014CN102123970B Surface-treated ceramic member, method for producing same, and vacuum processing device
01/29/2014CN102120927B Adhesive composition for semiconductor device and die attach film
01/29/2014CN102110673B Wafer level MMCM (microwave multichip module) packaging structure using photosensitive BCB (benzocyclobutene) as dielectric layer and method
01/29/2014CN102110651B Semiconductor device and manufacturing method thereof
01/29/2014CN102105375B Apparatus and method for transferring board-like work
01/29/2014CN102089859B Within-sequence metrology based process tuning for adaptive self-aligned double patterning
01/29/2014CN102054812B Device and manufacturing method
01/29/2014CN102037546B Methods of making an unsupported article of pure or doped semiconducting material
01/29/2014CN101930908B Method for polishing the edge of a semiconductor wafer
01/29/2014CN101901858B Vertical structure semiconductor devices
01/29/2014CN101853808B Method of forming a circuit structure
01/29/2014CN101723674B Aluminum-nitride-based composite material, method for manufacturing the same, and member for a semiconductor manufacturing apparatus
01/29/2014CN101621021B Substrate support frame and substrate processing device containing the frame
01/29/2014CN101492592B Chemico-mechanical polishing solution
01/28/2014USRE44730 Method of manufacturing a MOSFET structure
01/28/2014US8640072 Method for forming an electrical connection between metal layers
01/28/2014US8639463 Electron beam apparatus for inspecting a pattern on a sample using multiple electron beams
01/28/2014US8639019 Method and apparatus for inspecting pattern defects
01/28/2014US8638594 Integrated circuits with asymmetric transistors
01/28/2014US8638430 Method for defect determination in fine concave-convex pattern and method for defect determination on patterned medium
01/28/2014US8638418 Lithographic apparatus
01/28/2014US8638415 Active drying station and method to remove immersion liquid using gas flow supply with gas outlet between two gas inlets
01/28/2014US8638382 Solid-state imaging device and electronic apparatus
01/28/2014US8638370 Apparatus and method of processing substrate containing mark and method of manufacturing device
01/28/2014US8638084 Bandgap bias circuit compenastion using a current density range and resistive loads
01/28/2014US8638001 Adhesive sheet for producing semiconductor device
01/28/2014US8637997 Semiconductor device and method of manufacturing the same
01/28/2014US8637994 Microfeature workpieces having alloyed conductive structures, and associated methods
01/28/2014US8637984 Multi-chip package with pillar connection
01/28/2014US8637983 Face-to-face (F2F) hybrid structure for an integrated circuit
01/28/2014US8637970 Chip package and fabrication method thereof
01/28/2014US8637969 Stacked chips in a semiconductor package
01/28/2014US8637965 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device
01/28/2014US8637963 Radiation-shielded semiconductor device
01/28/2014US8637962 Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
01/28/2014US8637959 Vertical parasitic PNP device in a BiCMOS process and manufacturing method of the same
01/28/2014US8637958 Structure and method for forming isolation and buried plate for trench capacitor
01/28/2014US8637956 Semiconductor devices structures including an isolation structure
01/28/2014US8637954 Integrated circuit technology with different device epitaxial layers
01/28/2014US8637953 Wafer scale membrane for three-dimensional integrated circuit device fabrication
01/28/2014US8637950 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
01/28/2014US8637948 Photovoltaic device
01/28/2014US8637944 Multifunctional nanoscopy for imaging cells
01/28/2014US8637939 Semiconductor device and method for fabricating the same
01/28/2014US8637938 Semiconductor device with pocket regions and method of manufacturing the same
01/28/2014US8637935 Semiconductor device including embedded isolation regions and method for forming the same
01/28/2014US8637932 Semiconductor device and method for manufacturing the same
01/28/2014US8637930 FinFET parasitic capacitance reduction using air gap
01/28/2014US8637927 Semiconductor devices and methods of forming the same
01/28/2014US8637922 Semiconductor device
01/28/2014US8637919 Nonvolatile memory device
01/28/2014US8637913 Nonvolatile memory device and method for fabricating the same
01/28/2014US8637908 Borderless contacts in semiconductor devices
01/28/2014US8637907 Optical sensors for detecting relative motion and/or position and methods and systems for using such optical sensors
01/28/2014US8637905 Semiconductor device and fabrication method thereof
01/28/2014US8637904 Method of producing semiconductor device and semiconductor device
01/28/2014US8637872 Semiconductor device and method of manufacturing semiconductor device
01/28/2014US8637861 Transistor having oxide semiconductor with electrode facing its side surface
01/28/2014US8637848 Single crystal group III nitride articles and method of producing same by HVPE method incorporating a polycrystalline layer for yield enhancement
01/28/2014US8637765 Single junction type cigs thin film solar cell and method for manufacturing the thin film solar cell
01/28/2014US8637413 Nonvolatile resistive memory element with a passivated switching layer
01/28/2014US8637412 Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD
01/28/2014US8637411 Plasma activated conformal dielectric film deposition
01/28/2014US8637410 Method for metal deposition using hydrogen plasma
01/28/2014US8637409 Etching method, method for manufacturing semiconductor device, and etching device
01/28/2014US8637408 In-situ reclaim of volatile components
01/28/2014US8637407 Methods of forming fine patterns in semiconductor devices
01/28/2014US8637406 Image transfer process employing a hard mask layer
01/28/2014US8637404 Metal cations for initiating polishing
01/28/2014US8637403 Locally tailoring chemical mechanical polishing (CMP) polish rate for dielectrics
01/28/2014US8637402 Conductive line structure and the method of forming the same
01/28/2014US8637401 Methods and devices for high accuracy deposition on a continuously moving substrate
01/28/2014US8637400 Interconnect structures and methods for back end of the line integration
01/28/2014US8637399 Etching composition, method of forming a metal pattern and method of manufacturing a display substrate