Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/21/2014US8633593 Semiconductor device
01/21/2014US8633591 Electronic device
01/21/2014US8633564 Semicondutor isolation structure
01/21/2014US8633563 High-voltage integrated circuit device
01/21/2014US8633555 Magnetic sensor
01/21/2014US8633554 MEMS device etch stop
01/21/2014US8633553 Process for manufacturing a micromechanical structure having a buried area provided with a filter
01/21/2014US8633549 Semiconductor device and fabrication method thereof
01/21/2014US8633546 Semiconductor device
01/21/2014US8633545 Saddle type MOS device
01/21/2014US8633540 Integrated circuit with a laterally diffused metal oxide semiconductor device and method of forming the same
01/21/2014US8633536 Gate dielectric of semiconductor device
01/21/2014US8633534 Transistor channel mobility using alternate gate dielectric materials
01/21/2014US8633533 Semiconductor integrated circuit having capacitor for providing stable power and method of manufacturing the same
01/21/2014US8633531 Semiconductor device
01/21/2014US8633530 Semiconductor device and method of manufacturing the same
01/21/2014US8633524 Solid-state imaging device
01/21/2014US8633507 LED with versatile mounting ways
01/21/2014US8633494 Semiconductor device and method for manufacturing semiconductor device
01/21/2014US8633492 Semiconductor device and method for manufacturing the same
01/21/2014US8633491 Display device and manufacturing method thereof
01/21/2014US8633489 Semiconductor device and method of manufacturing the same
01/21/2014US8633485 Display device and manufacturing method thereof
01/21/2014US8633423 Methods and apparatus for controlling substrate temperature in a process chamber
01/21/2014US8633375 Solar cell and method for Manufacturing the same
01/21/2014US8633329 Titanium-containing precursors for vapor deposition
01/21/2014US8633119 Methods for manufacturing high dielectric constant films
01/21/2014US8633118 Method of forming thin metal and semi-metal layers by thermal remote oxygen scavenging
01/21/2014US8633117 Sputter and surface modification etch processing for metal patterning in integrated circuits
01/21/2014US8633116 Dry etching method
01/21/2014US8633115 Methods for atomic layer etching
01/21/2014US8633114 Methods for manufacturing high dielectric constant films
01/21/2014US8633113 Method for fabricating a bottom oxide layer in a trench
01/21/2014US8633112 Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
01/21/2014US8633111 Composition for polishing surfaces of silicon dioxide
01/21/2014US8633110 Titanium nitride films
01/21/2014US8633109 Soft error rate (SER) reduction in advanced silicon processes
01/21/2014US8633108 Dual damascene process
01/21/2014US8633107 Method of producing a semiconductor device and semiconductor device having a through-wafer interconnect
01/21/2014US8633106 Heterojunction bipolar transistors and methods of manufacture
01/21/2014US8633105 Method of fabricating a self-aligning damascene memory structure
01/21/2014US8633104 Methods of manufacturing three-dimensional semiconductor devices
01/21/2014US8633103 Semiconductor device and manufacturing method of the same
01/21/2014US8633102 Module comprising a semiconductor chip
01/21/2014US8633101 Semiconductor device and manufacturing method of semiconductor device
01/21/2014US8633100 Method of manufacturing integrated circuit packaging system with support structure
01/21/2014US8633099 Method for forming interlayer connectors in a three-dimensional stacked IC device
01/21/2014US8633098 Method of manufacturing a semiconductor device
01/21/2014US8633097 Single-junction photovoltaic cell
01/21/2014US8633095 Semiconductor device with voltage compensation structure
01/21/2014US8633093 Oxygen doping method to gallium nitride single crystal substrate
01/21/2014US8633092 Quantum well device
01/21/2014US8633091 Chip package and fabrication method thereof
01/21/2014US8633090 Method for forming substrate with buried insulating layer
01/21/2014US8633089 Die bonding method utilizing rotary wafer table
01/21/2014US8633088 Glass frit wafer bond protective structure
01/21/2014US8633087 Method of manufacturing GaN-based semiconductor device
01/21/2014US8633086 Power devices having reduced on-resistance and methods of their manufacture
01/21/2014US8633085 Dual-depth self-aligned isolation structure for a back gate electrode
01/21/2014US8633084 Methods of forming a memory cell having programmable material that comprises a multivalent metal oxide portion and an oxygen containing dielectric portion
01/21/2014US8633083 Apparatus and method for a metal oxide semiconductor field effect transistor with source side punch-through protection implant
01/21/2014US8633082 Method for fabricating high-gain MOSFETs with asymmetric source/drain doping for analog and RF applications
01/21/2014US8633081 Modifying growth rate of a device layer
01/21/2014US8633080 Methods of making multi-state non-volatile memory cells
01/21/2014US8633079 Method for fabricating a SONOS memory
01/21/2014US8633078 Method for manufacturing semiconductor device
01/21/2014US8633077 Transistors with uniaxial stress channels
01/21/2014US8633076 Method for adjusting fin width in integrated circuitry
01/21/2014US8633075 Semiconductor device with high voltage transistor
01/21/2014US8633074 Electrically programmable and erasable memory device and method of fabrication thereof
01/21/2014US8633073 Method of forming semiconductor device
01/21/2014US8633072 Method of manufacturing semiconductor device
01/21/2014US8633071 Silicon device on Si: C-oi and Sgoi and method of manufacture
01/21/2014US8633070 Lightly doped source/drain last method for dual-epi integration
01/21/2014US8633069 Array substrate and manufacturing method thereof, active display
01/21/2014US8633068 Vertical transistor actuation
01/21/2014US8633067 Fabricating photonics devices fully integrated into a CMOS manufacturing process
01/21/2014US8633066 Thin film transistor with reduced edge slope angle, array substrate and having the thin film transistor and manufacturing method thereof
01/21/2014US8633065 Method for manufacturing mother substrate and array substrate
01/21/2014US8633064 Methods of manufacture of top port multipart surface mount silicon condenser microphone package
01/21/2014US8633063 Integrated circuit packaging system with pad connection and method of manufacture thereof
01/21/2014US8633062 Integrated circuit package system with integral inner lead and paddle and method of manufacture thereof
01/21/2014US8633061 Method of fabricating package structure
01/21/2014US8633060 Semiconductor device production method and semiconductor device
01/21/2014US8633059 Integrated circuit packaging system with interconnect and method of manufacture thereof
01/21/2014US8633058 Integrated circuit packaging system with step mold and method of manufacture thereof
01/21/2014US8633057 Semiconductor package and method of fabricating the same
01/21/2014US8633056 Integrated circuit package system and method of manufacture thereof
01/21/2014US8633055 Graphene field effect transistor
01/21/2014US8633052 Wedge imprint patterning of irregular surface
01/21/2014US8633051 Semiconductor device and method for manufacturing semiconductor device
01/21/2014US8633050 Solar cell, and method of manufacturing the same
01/21/2014US8633049 Method of fabrication of Al/GE bonding in a wafer packaging environment and a product produced therefrom
01/21/2014US8633048 Method for fabricating package structure having MEMS elements
01/21/2014US8633047 Method for manufacturing a sensor chip
01/21/2014US8633046 Manufacturing method for semiconductor light-emitting element
01/21/2014US8633045 Method for making epitaxial structure
01/21/2014US8633044 Display device and method for fabricating same
01/21/2014US8633043 Method of fabricating fringe field switching liquid crystal display device
01/21/2014US8633042 Light emitting diode