Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2014
01/21/2014US8633041 Method for manufacturing quantum cascade laser
01/21/2014US8633040 Method for synthesising semiconductor quantum dots
01/21/2014US8633039 Methods of combinatorial processing for screening multiple samples on a semiconductor substrate
01/21/2014US8633038 Manufacturing method of semiconductor integrated circuit device
01/21/2014US8633037 Semiconductor device
01/21/2014US8633036 Manufacturing method of ferroelectric capacitor
01/21/2014US8632969 Method and a device for detecting genes
01/21/2014US8632939 Polymer, chemically amplified positive resist composition and pattern forming process
01/21/2014US8632854 Substrate centering device and organic material deposition system
01/21/2014US8632851 Method of forming an I-II-VI2 compound semiconductor thin film of chalcopyrite structure
01/21/2014US8632714 Mold structures, and method of transfer of fine structures
01/21/2014US8632693 Wetting agent for semiconductors, and polishing composition and polishing method employing it
01/21/2014US8632692 Compositions for use in semiconductor devices
01/21/2014US8632690 Method and apparatus for preventing native oxide regrowth
01/21/2014US8632687 Method for electron beam induced etching of layers contaminated with gallium
01/21/2014US8632637 Method and apparatus for plasma processing
01/21/2014US8632634 Coating apparatus and coating method
01/21/2014US8632166 Printing device and method of manufacturing a light emitting device
01/21/2014DE202013105600U1 Objekt-Halte-und-Ausricht-Vorrichtung, Vorrichtung zum Ausrichten eines Objekts und einer Maske zueinander sowie Vakuumkammer mit einer dieser beiden Vorrichtungen Object-holding-and-alignment apparatus, apparatus for aligning a mask of an object and to each other and vacuum chamber with one of these two devices
01/16/2014WO2014011914A1 Laser, plasma etch, and backside grind process for wafer dicing
01/16/2014WO2014011913A1 Laser scribing and plasma etch for high die break strength and clean sidewall
01/16/2014WO2014011678A1 Compositions and methods for selective polishing of silicon nitride materials
01/16/2014WO2014011674A2 Methods and apparatuses for forming semiconductor films
01/16/2014WO2014011657A2 Method of stripping photoresist on a single substrate system
01/16/2014WO2014011641A1 Polycrystalline silicon e-fuse and resistor fabrication in a metal replacement gate process
01/16/2014WO2014011615A1 Integrating through substrate vias from wafer backside layers of integrated circuits
01/16/2014WO2014011596A1 Methods for depositing oxygen deficient metal films
01/16/2014WO2014011566A1 Apparatus and method for cross-flow purge for optical components in a chamber
01/16/2014WO2014011548A1 Leakage reducing writeline charge protection circuit
01/16/2014WO2014011423A1 Gas mixing apparatus
01/16/2014WO2014011415A1 Three dimensional nand device and method of charge trap layer separation and floating gate formation in the nand device
01/16/2014WO2014011382A1 Method of patterning a low-k dielectric film
01/16/2014WO2014011378A1 Method of diced wafer transportation
01/16/2014WO2014011373A1 Uniform masking for wafer dicing using laser and plasma etch
01/16/2014WO2014011364A1 Method to reduce dielectric constant of a porous low-k film
01/16/2014WO2014010933A1 Semiconductor wafer surface protecting semi-adhesive film and production method for same
01/16/2014WO2014010888A1 Printing plate for reverse offset printing and method for manufacturing same
01/16/2014WO2014010887A1 Printed material fixing piece, printing device, and printing method
01/16/2014WO2014010808A1 Method for producing three-dimensional structures assembled with nanoparticles
01/16/2014WO2014010798A1 Etching chamber for manufacturing semiconductor led
01/16/2014WO2014010751A1 Etching apparatus and etching method technical field
01/16/2014WO2014010745A1 Solar-cell element and method for manufacturing same
01/16/2014WO2014010744A1 Composition for formation of passivation layer, semiconductor substrate with passivation layer, method for manufacturing semiconductor substrate with passivation layer, solar cell element, method for manufacturing solar cell element, and solar cell
01/16/2014WO2014010743A1 Passivation layer forming composition, semiconductor substrate with passivation layer and manufacturing method thereof, solar cell device and manufacturing method thereof, and solar cell
01/16/2014WO2014010630A1 Pattern forming method and substrate processing system
01/16/2014WO2014010593A1 Mark, method for forming same, and exposure apparatus
01/16/2014WO2014010592A1 Mark formation method and device manufacturing method
01/16/2014WO2014010589A1 Lift-off apparatus and lift-off method
01/16/2014WO2014010552A1 Illumination optical system, exposure device, and device manufacturing method
01/16/2014WO2014010517A1 Imprint method, and imprinting device
01/16/2014WO2014010516A1 Imprint method, and imprinting device
01/16/2014WO2014010499A1 Plasma processing method, and plasma processing device
01/16/2014WO2014010473A1 Photosensitive resin composition, photosensitive dry film, pattern formation method, printed circuit board, and method for producing same
01/16/2014WO2014010471A1 Etching fluid, etching force recovery agent, method for manufacturing semiconductor substrate for solar cell, and semiconductor substrate for solar cell
01/16/2014WO2014010408A1 Mask blank and method for manufacturing phase-shift mask
01/16/2014WO2014010405A1 Transistor and transistor manufacturing method
01/16/2014WO2014010403A1 Substrate treatment device, program and substrate treatment method
01/16/2014WO2014010392A1 Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blanks including actinic ray-sensitive or radiation-sensitive film, pattern forming method and photomask
01/16/2014WO2014010371A1 Method for manufacturing compound solar cell
01/16/2014WO2014010356A1 Acquisition method for s-parameters in microwave introduction modules, and malfunction detection method
01/16/2014WO2014010345A1 Photosensitive resin composition, conductive wire protection film, and touch panel member
01/16/2014WO2014010333A1 METHOD FOR FORMING Cu WIRING, AND COMPUTER-READABLE MEMORY MEDIUM
01/16/2014WO2014010317A1 Plasma treatment device
01/16/2014WO2014010310A1 Method for production of semiconductor element
01/16/2014WO2014010282A1 Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other
01/16/2014WO2014010258A1 Acrylic resin composition for semiconductor sealing, semiconductor device using same, and manufacturing method thereof
01/16/2014WO2014010237A1 Method for producing semiconductor device
01/16/2014WO2014010233A1 Drive system and drive method, and exposure device and exposure method
01/16/2014WO2014010220A1 Submount, sealed semiconductor element, and method for fabricating same
01/16/2014WO2014010166A1 Evaluation method and production method for semiconductor wafers
01/16/2014WO2014010005A1 Etching method
01/16/2014WO2014009996A1 Semiconductor device and method for producing same
01/16/2014WO2014009991A1 Mosfet having 3d-structure and manufacturing method for same
01/16/2014WO2014009990A1 Mosfet having 3d-structure and manufacturing method for same
01/16/2014WO2014009470A1 Device for electrically testing the interconnections of a microelectronic device
01/16/2014WO2014009388A1 Device and method for heat treating an object
01/16/2014WO2014009387A1 System and method for processing substrates
01/16/2014WO2014009386A1 Process box, assembly, and method for processing a coated substrate
01/16/2014WO2014008767A1 Ldmos device with stepped multiple discontinuous field plates and manufacturing method
01/16/2014WO2014008698A1 Method for manufacturing semiconductor component
01/16/2014WO2014008697A1 Method for manufacturing shallow groove partition
01/16/2014WO2014008696A1 Method for manufacturing semiconductor component
01/16/2014WO2014008691A1 Method for manufacturing semiconductor component
01/16/2014WO2014008685A1 Method for manufacturing semiconductor device
01/16/2014WO2014008684A1 Method for preparing tin through pvd
01/16/2014WO2014008679A1 Line width measuring device and method
01/16/2014WO2014008663A1 Fabrication of nano-structure electrodes for ultra-capacitor
01/16/2014WO2013177557A3 Methods of atomic layer deposition of hafnium oxide as gate dielectrics
01/16/2014WO2013168634A8 Transfer method and thermal nanoimprint device
01/16/2014WO2013144709A3 Method of forming a freestanding semiconductor wafer
01/16/2014US20140019716 Plateable diffusion barrier techniques
01/16/2014US20140017909 Film deposition method and film deposition apparatus
01/16/2014US20140017908 Method for Forming Conformal, Homogeneous Dielectric Film by Cyclic Deposition and Heat Treatment
01/16/2014US20140017907 Nitridation of atomic layer deposited high-k dielectrics using trisilylamine
01/16/2014US20140017906 Method for forming tin by pvd
01/16/2014US20140017905 Film deposition apparatus and method of depositing film
01/16/2014US20140017904 Flowable film dielectric gap fill process
01/16/2014US20140017903 Methods for fabricating integrated circuits with stressed semiconductor material
01/16/2014US20140017902 Nonaqueous cleaning liquid and method for etching processing of silicon substrate
01/16/2014US20140017901 Vapour etch of silicon dioxide with improved selectivity