Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/04/2014US8642465 Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus
02/04/2014US8642464 Method of manufacturing semiconductor device
02/04/2014US8642463 Routing layer for mitigating stress in a semiconductor die
02/04/2014US8642462 Interconnection designs and materials having improved strength and fatigue life
02/04/2014US8642461 Side wettable plating for semiconductor chip package
02/04/2014US8642460 Semiconductor switching device and method of making the same
02/04/2014US8642459 Method for forming a semiconductor device with an isolation region on a gate electrode
02/04/2014US8642458 Method of fabricating nonvolatile memory device
02/04/2014US8642457 Method of fabricating semiconductor device
02/04/2014US8642456 Implementing semiconductor signal-capable capacitors with deep trench and TSV technologies
02/04/2014US8642455 High-throughput printing of semiconductor precursor layer from nanoflake particles
02/04/2014US8642454 Low temperature selective epitaxy of silicon germanium alloys employing cyclic deposit and etch
02/04/2014US8642453 Schottky barrier diode and method of forming a Schottky barrier diode
02/04/2014US8642452 Semiconductor-on-insulator device with asymmetric structure
02/04/2014US8642451 Active region patterning in double patterning processes
02/04/2014US8642450 Low temperature junction growth using hot-wire chemical vapor deposition
02/04/2014US8642449 Silicon wafer
02/04/2014US8642448 Wafer dicing using femtosecond-based laser and plasma etch
02/04/2014US8642447 Semiconductor wafer and manufacturing method of semiconductor device
02/04/2014US8642446 Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer
02/04/2014US8642445 Method and apparatus for reducing package warpage
02/04/2014US8642444 Method of manufacturing bonded substrate, bonded substrate, method of manufacturing solid-state imaging apparatus, solid-state imaging apparatus, and camera
02/04/2014US8642443 Process for the realization of islands of at least partially relaxed strained material
02/04/2014US8642442 Memory device having three-dimensional gate structure
02/04/2014US8642441 Self-aligned STI with single poly for manufacturing a flash memory device
02/04/2014US8642440 Capacitor with deep trench ion implantation
02/04/2014US8642439 Semiconductor device and method of formation
02/04/2014US8642438 Method of manufacturing an integrated circuit device
02/04/2014US8642437 Gap-filling composition with excellent shelf life by end-capping
02/04/2014US8642436 Method of manufacturing silicon carbide semiconductor device
02/04/2014US8642435 Performing treatment on stressors
02/04/2014US8642434 Structure and method for mobility enhanced MOSFETS with unalloyed silicide
02/04/2014US8642433 Method for manufacturing semiconductor device
02/04/2014US8642432 N-dopant for carbon nanotubes and graphene
02/04/2014US8642431 N-type carrier enhancement in semiconductors
02/04/2014US8642430 Processes for preparing stressed semiconductor wafers and for preparing devices including the stressed semiconductor wafers
02/04/2014US8642429 Wide and deep oxide trench in a semiconductor substrate with interspersed vertical oxide ribs
02/04/2014US8642428 Semiconductor device including line-type active region and method for manufacturing the same
02/04/2014US8642427 Semiconductor device and method for fabricating the same
02/04/2014US8642426 Semiconductor device and production method therefor
02/04/2014US8642425 Method of making an insulated gate semiconductor device and structure
02/04/2014US8642424 Replacement metal gate structure and methods of manufacture
02/04/2014US8642423 Polysilicon/metal contact resistance in deep trench
02/04/2014US8642422 Method of manufacturing a semiconductor device
02/04/2014US8642421 Light-emitting diode device structure with SixNy layer
02/04/2014US8642420 Fabrication of a semiconductor device with extended epitaxial semiconductor regions
02/04/2014US8642419 Methods of forming isolation structures for semiconductor devices
02/04/2014US8642418 Method of manufacturing semiconductor device with offset sidewall structure
02/04/2014US8642417 Method of manufacturing strained source/drain structures
02/04/2014US8642416 Method of forming three dimensional integrated circuit devices using layer transfer technique
02/04/2014US8642415 Semiconductor substrate with transistors having different threshold voltages
02/04/2014US8642414 MOS transistor structure with in-situ doped source and drain and method for forming the same
02/04/2014US8642413 Formation of strain-inducing films using hydrogenated amorphous silicon
02/04/2014US8642412 Method for manufacturing an oxide-based semiconductor thin film transistor (TFT) including out diffusing hydrogen or moisture from the oxide semiconductor layer into an adjacent insulating layer which contains a halogen element
02/04/2014US8642410 Method for manufacturing semiconductor device and method for growing graphene
02/04/2014US8642409 Semiconductor device and method of manufacturing the same
02/04/2014US8642408 Semiconductor device
02/04/2014US8642407 Devices having reduced susceptibility to soft-error effects and method for fabrication
02/04/2014US8642406 Semiconductor device and method for manufacturing the same
02/04/2014US8642405 Process for production of SOI substrate and process for production of semiconductor device
02/04/2014US8642404 Thin film transistor liquid crystal display array substrate and manufacturing method thereof
02/04/2014US8642403 Replacement contacts for all-around contacts
02/04/2014US8642402 Thin film transistor manufacturing method, thin film transistor, thin film transistor substrate and image display apparatus, image display apparatus and semiconductor device
02/04/2014US8642401 Insulated gate type semiconductor device and method for fabricating the same
02/04/2014US8642400 Method of manufacturing semiconductor device including capacitor element
02/04/2014US8642399 Fuse of semiconductor device and method of forming the same
02/04/2014US8642398 Resistive random access memory and method for manufacturing the same
02/04/2014US8642397 Semiconductor wafer level package (WLP) and method of manufacture thereof
02/04/2014US8642396 Ultra-thin quad flat no-lead (QFN) package
02/04/2014US8642395 Method of making chip-on-lead package
02/04/2014US8642394 Method of manufacturing electronic device on leadframe
02/04/2014US8642393 Package on package devices and methods of forming same
02/04/2014US8642392 Semiconductor device and production method therefor
02/04/2014US8642391 Self-assembly of chips on a substrate
02/04/2014US8642390 Tape residue-free bump area after wafer back grinding
02/04/2014US8642389 Method of manufacturing a semiconductor device
02/04/2014US8642388 Method for manufacturing light emitting diodes including forming circuit structures with a connecting section
02/04/2014US8642387 Method of fabricating stacked packages using laser direct structuring
02/04/2014US8642386 Heat spreader as mechanical reinforcement for ultra-thin die
02/04/2014US8642385 Wafer level package structure and the fabrication method thereof
02/04/2014US8642384 Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability
02/04/2014US8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die
02/04/2014US8642380 Manufacturing method of semiconductor device
02/04/2014US8642377 Method of producing conductive thin film
02/04/2014US8642376 Methods for depositing a material atop a substrate
02/04/2014US8642373 Photovoltaic device including an inflexible or a flexible substrate and method for manufacturing the same
02/04/2014US8642372 Solar cell and method for manufacturing the same
02/04/2014US8642371 Method and system for fabricating ion-selective field-effect transistor (ISFET)
02/04/2014US8642370 Cavity open process to improve undercut
02/04/2014US8642369 Vertically structured LED by integrating nitride semiconductors with Zn(Mg,Cd,Be)O(S,Se) and method for making same
02/04/2014US8642368 Enhancement of LED light extraction with in-situ surface roughening
02/04/2014US8642367 Thin film transistor having improved manufacturability and method for manufacturing a display panel containing same
02/04/2014US8642366 Method for fabricating group-III nitride semiconductor laser device
02/04/2014US8642365 Method of manufacturing ridge-type semiconductor laser
02/04/2014US8642364 Thin film transistor structure, method of manufacturing the same, and electronic device
02/04/2014US8642363 Monolithic full-color LED micro-display on an active matrix panel manufactured using flip-chip technology
02/04/2014US8642361 Method and system for large scale manufacture of thin film photovoltaic devices using multi-chamber configuration
02/04/2014US8642358 Method for fabricating magnetic tunnel junction device
02/04/2014US8642252 Methods for fabrication of an air gap-containing interconnect structure
02/04/2014US8642135 Systems and methods for plasma doping microfeature workpieces