Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/05/2014CN103562434A Method for manufacturing molybdenum oxide-containing thin film, starting material for forming molybdenum oxide-containing thin film, and molybdenum amide compound
02/05/2014CN103562344A Texture etching solution composition and texture etching method for crystalline silicon wafer
02/05/2014CN103562337A Polishing composition and polishing method
02/05/2014CN103561908A System for grinding/polishing hard and brittle materials, and grinding/polishing method
02/05/2014CN103561557A Chip mounting device provided with vertical portions with elastic materials and driven by threaded rod
02/05/2014CN103560191A Gan semiconductor optical element, method for manufacturing gan semiconductor optical element, epitaxial wafer and method for growing gan semiconductor film
02/05/2014CN103560171A Method for saturating solar cell graphite boats
02/05/2014CN103560153A Tunneling field effect transistor and preparation method thereof
02/05/2014CN103560152A Tunneling field effect transistor of vertical structure and preparation method thereof
02/05/2014CN103560151A Super-junction VDMOS of optimized body diode reversed recovery feature and manufacturing method
02/05/2014CN103560149A 绝缘栅双极型晶体管及其制造方法 Insulated gate bipolar transistor and its manufacturing method
02/05/2014CN103560148A Junction terminal structure of super junction device and manufacturing method of super junction device
02/05/2014CN103560147A Nitrogen and phosphorus zinc oxide thin film, preparation method thereof and thin film transistor
02/05/2014CN103560146A Epitaxy structure for manufacturing GaN hetero-junction filed-effect transistor and growing method thereof
02/05/2014CN103560144A Method and corresponding device for restraining tunneling transistor from leaking current and method for manufacturing corresponding device
02/05/2014CN103560143A Automobile rectification chip and method for manufacturing rectification base material thereof
02/05/2014CN103560142A Semiconductor laminate, semiconductor device and manufacturing method thereof
02/05/2014CN103560136A Semiconductor substrate with low warping degree and manufacturing method of semiconductor substrate
02/05/2014CN103560135A Array substrate of X-ray sensor and manufacturing method thereof
02/05/2014CN103560134A Array substrate, manufacturing method thereof and display device
02/05/2014CN103560133A Optical passive integrated device design platform based on silicon substrate and manufacturing method thereof
02/05/2014CN103560125A Three-dimensional flexible substrate electromagnetic shielding packaged structure and manufacturing method
02/05/2014CN103560124A Through silicon via (TSV) structure and manufacture method thereof
02/05/2014CN103560122A Frame csp package with bumping optimization technology and production process thereof
02/05/2014CN103560121A Frame csp package with bumping optimization technology based on chips of different sizes and production process thereof
02/05/2014CN103560120A Chemical method palladium plating copper bonding wire and preparing method thereof
02/05/2014CN103560119A Three-dimensional flexible substrate packaging structure used for multi-shield chips and three-dimensional flexible substrate manufacturing method
02/05/2014CN103560116A Embedded optics in modular assemblies
02/05/2014CN103560114A TFT array substrate, manufacturing method thereof and display device
02/05/2014CN103560113A Array structure and manufacturing method thereof, array substrate and display device
02/05/2014CN103560112A Method for manufacturing thin film transistor substrate and thin film transistor substrate manufactured through same
02/05/2014CN103560111A Method for manufacturing array substrate, array substrate and display device
02/05/2014CN103560110A Array substrate and preparation method and display device thereof
02/05/2014CN103560109A Method for forming multiple contact holes
02/05/2014CN103560108A Method for filling deep holes with photoresist
02/05/2014CN103560107A Method of forming an interconnect structure
02/05/2014CN103560106A Method for manufacturing semiconductor substrate with low warping degree
02/05/2014CN103560105A Method for manufacturing semiconductor substrate with smooth edge
02/05/2014CN103560104A Vacuum adsorption conveying device and substrate conveying method
02/05/2014CN103560103A Conveying device and method for safely conveying wafer to FOUP
02/05/2014CN103560102A Mechanical arm operating system
02/05/2014CN103560101A Flexible device stripping device
02/05/2014CN103560100A 空气净化系统和洁净室 Air purification systems and clean room
02/05/2014CN103560099A Machine for manufacturing electrode tapes
02/05/2014CN103560098A Method for monitoring edge thickness measurement stability of wafer
02/05/2014CN103560097A Wiring path optimization method for three-dimensional chip
02/05/2014CN103560096A Bonding method for compound semiconductor and silicon substrate semiconductor at low temperature
02/05/2014CN103560095A Method using heat-ultrasound-electromagnetism compound field to regulate intermetallic compound growth to achieve high-reliability and three-dimensional interconnection of chips
02/05/2014CN103560094A Golden aluminum bimetal bonding transferring method
02/05/2014CN103560093A Flip chip bonding apparatus
02/05/2014CN103560092A Chip mounting device provided with limiting protrusions and driven by sliding block
02/05/2014CN103560091A Power device and assembling method thereof
02/05/2014CN103560090A Method for manufacturing heat dissipation structure for PoP encapsulation
02/05/2014CN103560089A Method for deoxidizing pins of surface-mounted components
02/05/2014CN103560088A Method for manufacturing array substrate
02/05/2014CN103560087A 4H-SiC Schottky barrier source/drain MOSFET device with field plate terminal protection and manufacturing method thereof
02/05/2014CN103560086A Super junction semiconductor device manufacturing method capable of improving avalanche capacity
02/05/2014CN103560085A Semiconductor device and manufacturing method thereof
02/05/2014CN103560084A Transverse bipolar junction transistor drive method
02/05/2014CN103560083A Stripping process for non-refrigerating infrared FPA detector electrode patterning
02/05/2014CN103560082A CMOS complementary metal oxide semiconductor contact hole etching method and CMOS complementary metal oxide semiconductor manufacturing method
02/05/2014CN103560081A Technology for processing film for cutting and grinding wafer
02/05/2014CN103560080A Method for reducing high-density plasma phosphorosilicate glass particles
02/05/2014CN103560079A Method for reducing GaN epitaxial defect through defect passivation
02/05/2014CN103560078A Method for accurately controlling steepness when silicon carbide high-temperature ions are injected into mask
02/05/2014CN103560077A Method for manufacturing polycrystalline silicon thin film substrate
02/05/2014CN103560076A Polycrystalline silicon manufacturing method improving uniformity of polycrystalline silicon layer
02/05/2014CN103560075A Bonding and separation method for baseboard
02/05/2014CN103560074A Quartz cylinder for cleaning and heating wafers
02/05/2014CN103560073A PCB chip extracting technology
02/05/2014CN103560068A Plasma treatment device evenly changing distribution of plasmas and control method thereof
02/05/2014CN103559566A Dispatching method for controlling process machine through defect scan result
02/05/2014CN103558739A Photoresist removing method and photolithography technique reworking method
02/05/2014CN103558737A Substrate holding device, exposure apparatus having the same and method for producing a device
02/05/2014CN103558254A Biosensor based on vertical-structure tunneling field effect transistor and preparation method thereof
02/05/2014CN103556126A Multi-chamber MOCVD reaction system with optimal configuration
02/05/2014CN102683264B Method for manufacturing semiconductor structure
02/05/2014CN102634249B Preparation method of carbon nanotube ink and preparation method of transistor device
02/05/2014CN102610701B Graphite boat being convenient to dismantle and assemble
02/05/2014CN102569190B Pixel structure and manufacturing method thereof
02/05/2014CN102569039B Rapid annealing method for ohmic contact of metal and silicon carbide
02/05/2014CN102544093B Semiconductor field effect structure and preparation method and application thereof
02/05/2014CN102496601B 像素结构及其制造方法 Pixel structure and its manufacturing method
02/05/2014CN102495531B Double-stage revolving and switching method and apparatus based on independent synchronic direction-regulation
02/05/2014CN102495528B Double-workpiece-table same-phase rotation exchange method and device based on follow-up rotation-resisting mechanisms
02/05/2014CN102468279B Integrated circuit device and method for preparing same
02/05/2014CN102468225B Fuse structure and manufacturing method thereof
02/05/2014CN102468175B Method for manufacturing transistor
02/05/2014CN102459122B Oxide sintered body, method for producing same, and starting material powder for producing oxide sintered body
02/05/2014CN102456615B Manufacturing process of removing metal layer redundancy metal filling
02/05/2014CN102446917B Multilayer MOM capacitor and manufacturing method thereof
02/05/2014CN102446832B Method for avoiding contact hole blockage caused by dual etching barrier layers
02/05/2014CN102446828B Manufacturing process for removing redundant filled metal from metal layers
02/05/2014CN102446824B Damascus integration method
02/05/2014CN102446808B Method for improving multi-exposure stability of shallow groove isolation
02/05/2014CN102446762B Metal oxide silicon (MOS) transistor and production method thereof
02/05/2014CN102446752B Method for forming side wall and storage unit formed thereby
02/05/2014CN102446749B Method for achieving accurate graphic positioning during observation using scanning electron microscope
02/05/2014CN102437120B Method for improving source/drain (SD) ultrashallow junction
02/05/2014CN102420192B Manufacturing method of twin-transistor and zero-capacitance dynamic RAM (Random Access Memory)