Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/06/2014DE112012002037T5 Kohlenstoff-Feldeffekttransistoren, die geladene Monoschichten aufweisen, um den parasitären Widerstand zu verringern Carbon-field effect transistors having charged monolayers, in order to reduce the parasitic resistance
02/06/2014DE112012001813T5 Mikromechanische Silicid-Einheit und Verfahren zum Herstellen derselben Micromechanical silicide unit and method for manufacturing the same
02/06/2014DE102013214741A1 Laserbearbeitungsvorrichtung Laser processing apparatus
02/06/2014DE102013111016A1 Method for forming chip on silicon wafer for manufacturing semiconductor utilized in electronic applications, involves forming separation layer under groove within substrate, and isolating substrate by separation layer
02/06/2014DE102013108376A1 Verfahren zur Herstellung einer Halbleitervorrichtung mit einer dielektrischen Struktur A process for producing a semiconductor device having a dielectric structure
02/06/2014DE102013108352A1 Integriertes System und Verfahren zum Herstellen des integrierten Systems Integrated system and method for manufacturing the integrated system
02/06/2014DE102013108196A1 Ein Chippackage und ein Verfahren zum Herstellen eines Chippackage A chip package and a method of manufacturing a chip package
02/06/2014DE102013108167A1 Halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements A semiconductor device and method of manufacturing a semiconductor device
02/06/2014DE102013108075A1 Chip-Gehäuse und Verfahren zur Herstellung eines Chip-Gehäuses Chip package and method of manufacturing a chip package
02/06/2014DE102013107725A1 Chipkartenmodul Chip card module
02/06/2014DE102012213566A1 Verfahren zum Herstellen eines Bondpads zum Thermokompressionsbonden und Bondpad A method for manufacturing a bonding pad to the thermocompression bonding and bonding pad
02/06/2014DE102012213555A1 Method for manufacturing DCB substrate for e.g. power semiconductor component in power converter, involves electroplating metal film on metallization layer and around cover so as to form pocket at desired position of power component
02/06/2014DE102012213548A1 Bondpad zum Thermokompressionsbonden, Verfahren zum Herstellen eines Bondpads und Bauelement Bonding pad for thermo-compression bonding, bonding pads and a method for producing component
02/06/2014DE102012213530A1 Verfahren und Messgerät zum Bestimmen eines Zustands eines Halbleitermaterials eines von einem Hersteller getesteten und ausgelieferten chemosensitiven Feldeffekttransistors The method and measuring device for determining a state of a semiconductor material is one of a manufacturer and delivered tested chemo-sensitive field effect transistor
02/06/2014DE102012211161A1 Verfahren zum Ausbilden einer elektrisch leitenden Struktur an einem Trägerelement, Schichtanordnung sowie Verwendung eines Verfahrens oder einer Schichtanordnung A method of forming an electrically conductive structure on a support element, layer arrangement, and using a method or a layer arrangement
02/06/2014DE102012111785A1 Integrierter Halbleiterschaltkreis mit Metall-Gate The semiconductor integrated circuit with metal gate
02/06/2014DE102012107149A1 Method for patterning copper indium gallium diselenide (CIGS) absorber layer on substrate, involves increasing electric conductivity of CIGS absorber layer differentiated by energy input by irradiation
02/06/2014DE102005010156B4 Verfahren zum Ausbilden einer Anordnung aus gestapelten Einzelschaltkreisen A method of forming an array of stacked individual circuits
02/06/2014CA2822663A1 Device having reduced bias temperature instability (bti)
02/05/2014EP2693485A1 Method for manufacturing organic element, method for bonding organic molecular crystal layer, method for manufacturing fine linear conductor, organic element, and fine linear conductor
02/05/2014EP2693484A1 Igbt
02/05/2014EP2693476A1 Three-dimensional integrated circuit laminate and interlayer filler material for three-dimensional integrated circuit laminate
02/05/2014EP2693474A2 Method of manufacturing a silver bond pad on a semiconductor power device using silver nanopaste, as well as an assembly including said semiconductor device
02/05/2014EP2693472A2 Power semiconductor module and its method of manufacturing
02/05/2014EP2693469A2 Hermetically sealed package for a silicon carbide semiconductor device
02/05/2014EP2693467A1 A method of producing a semiconductor device having an interconnect through the substrate
02/05/2014EP2693466A1 Device for tempering a vessel in a chamber
02/05/2014EP2693465A1 Electronic device and method of manufacturing such device
02/05/2014EP2693464A1 Method for producing organic transistor, organic transistor, method for producing semiconductor device, semiconductor device, and electronic apparatus
02/05/2014EP2693463A1 Semiconductor device having amplification factor with less dependence on current value
02/05/2014EP2693462A1 Method for manufacturing semiconductor devices
02/05/2014EP2693461A1 Semiconductor processing device
02/05/2014EP2693460A1 Polishing composition, polishing method using same, and method for producing semiconductor device
02/05/2014EP2693459A1 Polishing composition and polishing method
02/05/2014EP2693458A1 Method for correcting mask for euv exposure, and mask for euv exposure
02/05/2014EP2693270A1 Method for producing lithographic printing plate
02/05/2014EP2692813A1 Abrasive grit with ridges of varying heights
02/05/2014EP2692776A1 Organopolysiloxane, method for producing same, and curable resin composition containing organopolysiloxane
02/05/2014EP2692478A1 Lead-free solder ball
02/05/2014EP2691984A1 P-type oxide, p-type oxide-producing composition, method for producing p-type oxide, semiconductor device, display device, image display apparatus, and system
02/05/2014EP2691982A2 Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
02/05/2014EP2691981A1 Electronic module and method for the production thereof
02/05/2014EP2691979A1 Diode, circuit employing the same and methods of manufacture
02/05/2014EP2691978A1 Method and apparatus for forming a straight line projection on a semiconductor substrate
02/05/2014EP2691977A1 Method for growing a monocrystalline tin- containing semiconductor material
02/05/2014EP2691976A1 Method of controlling silicon oxide film thickness
02/05/2014EP2691813A1 Surface planarisation
02/05/2014EP2691809A1 Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive resin film therefrom and method of forming pattern using the composition
02/05/2014EP2691439A1 Antireflective coating composition and process thereof
02/05/2014CN203423212U Structure for reducing deformation of water baffle of solar cell polishing device
02/05/2014CN203423188U Thin film transistor, array substrate and display device
02/05/2014CN203423158U Solar silicon wafer-used jig for protecting silicon wafer surface from being damaged
02/05/2014CN203423157U Quartz vacuum nozzle
02/05/2014CN203423156U CELL filling fixture
02/05/2014CN203423155U Chip calibration system
02/05/2014CN203423154U Transmission device for crystal silicon wafer flocking
02/05/2014CN203423153U Material conveying device for direct-insertion type LED lamp bead crystal fixing machine
02/05/2014CN203423152U Basket enabling solar silicon wafers to be stably and uniformly corroded
02/05/2014CN203423151U Split type silicon chip bearing box
02/05/2014CN203423150U Lamination workbench
02/05/2014CN203423149U Quadrilateral multi-pin super-large-chip high-frequency integrated circuit packaging mold
02/05/2014CN203423148U No-pin surface-mount ball-type matrix integrated circuit packaging mold
02/05/2014CN203423147U Chip bonding machine for microfluidic control chip
02/05/2014CN203419982U Convenient-to-store graphite boat sheet for solar silicon chip
02/05/2014CN203418708U Tiny outline transistor bilateral multi-pin integrated circuit packaging die
02/05/2014CN203418199U BGA (ball grid array) ball-planting jig
02/05/2014CN203417887U Double-surface cleaning equipment between wafer production processes
02/05/2014CN203417882U Cleaning fixture for multi-disc annular boat
02/05/2014CN203417880U Wafer cleaning equipment with multiple bayonet lock sets
02/05/2014CN1885165B Coating apparatus and method of fabricating liquid crystal display device using same
02/05/2014CN103563086A Low-profile local interconnect and method of making the same
02/05/2014CN103563085A Vertical tunneling negative differential resistance devices
02/05/2014CN103563083A Semiconductor switching device and method of making the same
02/05/2014CN103563070A Apparatuses including stair-step structures and methods of forming the same
02/05/2014CN103563069A Semiconductor device, semiconductor substrate, method for producing semiconductor substrate, and method for producing semiconductor device
02/05/2014CN103563068A Semiconductor device, semiconductor substrate, method for producing semiconductor substrate, and method for producing semiconductor device
02/05/2014CN103563067A A routing layer for mitigating stress in a semiconductor die
02/05/2014CN103563066A Complementary bipolar inverter
02/05/2014CN103563065A Methods and apparatus for controlling temperature of a multi-zone heater in a process chamber
02/05/2014CN103563064A Integrated circuit inspection device
02/05/2014CN103563063A Resin composition, semiconductor device using same, and method of manufacturing semiconductor device
02/05/2014CN103563062A Bonded structure
02/05/2014CN103563061A 半导体装置 Semiconductor device
02/05/2014CN103563060A Switching element
02/05/2014CN103563059A Method and structure for low resistive source and drain regions in a replacement metal gate process flow
02/05/2014CN103563058A 半导体器件 Semiconductor devices
02/05/2014CN103563057A Silicide micromechanical device and methods to fabricate same
02/05/2014CN103563056A Polishing pad and manufacturing method therefor
02/05/2014CN103563055A Method for producing silicon carbide substrate
02/05/2014CN103563054A Water soluble mask for substrate dicing by laser and plasma etch
02/05/2014CN103563053A Method of manufacturing semiconductor chips
02/05/2014CN103563052A Method for fabricating electrode structure having nanogap length, electrode structure having nanogap length obtained thereby, and nanodevice
02/05/2014CN103563051A Composite substrate, light-emitting element, and method for manufacturing composite substrate
02/05/2014CN103563050A A transistor and method of forming the transistor so as to have reduced base resistance
02/05/2014CN103563049A Method for manufacturing bonded wafer, and bonded SOI wafer
02/05/2014CN103563048A Method of controlling silicon oxide film thickness
02/05/2014CN103563000A Voltage-controlled magnetic anisotropy (vcma) switch and magneto-electric memory (meram)
02/05/2014CN103562794A Method for producing lithographic printing plate
02/05/2014CN103562793A 感光性硅氧烷树脂组合物 The photosensitive resin composition of the silicone
02/05/2014CN103562435A Light emission analyzing device
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