Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2014
02/06/2014US20140038351 Method for manufacturing semiconductor device
02/06/2014US20140038348 Etchant composition and manufacturing method for thin film transistor using the same
02/06/2014US20140038344 Thin film solar cells
02/06/2014US20140038334 Laser-induced flaw formation in nitride semiconductors
02/06/2014US20140038329 Epitaxial growth on thin lamina
02/06/2014US20140038319 Method for forming an electrical connection between metal layers
02/06/2014US20140038317 Method for forming an electrical connection between metal layers
02/06/2014US20140038316 Examination of a silicon substrate for a solar cell
02/06/2014US20140037982 Method for Strengthening Adhesion Between Dielectric Layers Formed Adjacent to Metal Layers
02/06/2014US20140037845 Apparatus for depositing a multilayer coating on discrete sheets
02/06/2014US20140037527 Compositions of Matter, and Methods of Removing Silicon Dioxide
02/06/2014US20140036565 Memory device and method of manufacturing memory structure
02/06/2014US20140036403 Substrate holder, substrate holder unit, substrate transport apparatus, and substrate bonding apparatus
02/06/2014US20140036398 Esd protection circuit with high immunity to voltage slew
02/06/2014US20140036266 Polishing monitoring method, polishing method, and polishing monitoring apparatus
02/06/2014US20140035935 Passives via bar
02/06/2014US20140035619 Semiconductor integrated circuit, programmable logic device, method of manufacturing semiconductor integrated citcuit
02/06/2014US20140035609 Probe card with simplified registration steps and manufacturing method thereof
02/06/2014US20140035170 Semiconductor device and programming method
02/06/2014US20140035167 Method for producing a bonding pad for thermocompression bonding, and bonding pad
02/06/2014US20140035159 Multilevel interconnect structures and methods of fabricating same
02/06/2014US20140035157 Semiconductor package, manufacturing method thereof, and semiconductor package manufacturing mold
02/06/2014US20140035156 Method of fabricating a semiconductor package
02/06/2014US20140035155 Device with integrated power supply
02/06/2014US20140035154 Chip package and a method for manufacturing a chip package
02/06/2014US20140035153 Reconstituted wafer-level package dram
02/06/2014US20140035151 Integrated circuits and methods for fabricating integrated circuits using double patterning processes
02/06/2014US20140035150 Metal cored solder decal structure and process
02/06/2014US20140035147 Semiconductor device and method for fabricating the same
02/06/2014US20140035146 Metal wiring of semiconductor device and method for manufacturing the same
02/06/2014US20140035143 Method of reducing contact resistance of a metal
02/06/2014US20140035142 Profile control in interconnect structures
02/06/2014US20140035141 Self aligned borderless contact
02/06/2014US20140035139 Semiconductor device and method of manufacturing the same
02/06/2014US20140035135 Solder bump for ball grid array
02/06/2014US20140035134 Dense interconnect with solder cap (disc) formation with laser ablation and resulting semiconductor structures and packages
02/06/2014US20140035130 Packaging method using solder coating ball and package manufactured thereby
02/06/2014US20140035128 Semiconductor seal ring
02/06/2014US20140035127 Chip package and a method for manufacturing a chip package
02/06/2014US20140035126 Semiconductor manufacturing method and semiconductor structure thereof
02/06/2014US20140035125 Semiconductor manufacturing method, semiconductor structure and package structure thereof
02/06/2014US20140035123 Semiconductor device and method for manufacturing semiconductor device
02/06/2014US20140035118 Semiconductor Module Arrangement and Method for Producing and Operating a Semiconductor Module Arrangement
02/06/2014US20140035113 Packaging and methods for packaging
02/06/2014US20140035109 Method and structure of forming backside through silicon via connections
02/06/2014US20140035107 Double seal ring
02/06/2014US20140035106 Multiple seal-ring structure for the design, fabrication, and packaging of integrated circuits
02/06/2014US20140035105 Semiconductor device, method for manufacturing semiconductor device, and base member for semiconductor device formation
02/06/2014US20140035104 Germanium on insulator apparatus
02/06/2014US20140035103 Group iii nitride crystal production method and group iii nitride crystal
02/06/2014US20140035099 Integrated circuits with metal-insulator-metal (mim) capacitors and methods for fabricating same
02/06/2014US20140035097 Semiconductor package having an antenna and manufacturing method thereof
02/06/2014US20140035096 Method for controlling electrical property of passive device during fabrication of integrated component and related integrated component
02/06/2014US20140035095 Semiconductor package and method for fabricating base for semiconductor package
02/06/2014US20140035072 Hybrid mems bump design to prevent in-process and in-use stiction
02/06/2014US20140035068 Transistor having replacement metal gate and process for fabricating the same
02/06/2014US20140035066 Non-Planar FET and Manufacturing Method Thereof
02/06/2014US20140035064 Semiconductor structures and methods of manufacture
02/06/2014US20140035062 Transistor device and a method of manufacturing same
02/06/2014US20140035059 Semiconductor device having metallic source and drain regions
02/06/2014US20140035058 Semiconductor Devices and Methods of Manufacturing the Same
02/06/2014US20140035049 Semiconductor device and fabricating method thereof
02/06/2014US20140035045 Method of Manufacturing Dummy Gates of a Different Material as Insulation between Adjacent Devices
02/06/2014US20140035032 Power device integration on a common substrate
02/06/2014US20140035030 Semiconductor device
02/06/2014US20140035029 Semiconductor device and method for fabricating the same
02/06/2014US20140035021 Memory Devices Comprising Word Line Structures, At Least One Select Gate Structure, and a Plurality Of Doped Regions
02/06/2014US20140035020 Method of Forming an Embedded Memory Device
02/06/2014US20140035014 Otp memory cell and fabricating method thereof
02/06/2014US20140035010 Integrated circuit having a replacement gate structure and method for fabricating the same
02/06/2014US20140035001 Compound semiconductor structure
02/06/2014US20140035000 Source and Drain Doping Profile Control Employing Carbon-Doped Semiconductor Material
02/06/2014US20140034982 Light-emitting device
02/06/2014US20140034965 Semiconductor device and method for manufacturing same
02/06/2014US20140034963 Device having reduced bias temperature instability (bti)
02/06/2014US20140034962 Normally-Off Compound Semiconductor Tunnel Transistor with a Plurality of Charge Carrier Gases
02/06/2014US20140034961 Surface-modified semiconductor, method of making the semiconductor, and method of arranging particles
02/06/2014US20140034956 Asymmetric Gate MOS Device and Method of Making
02/06/2014US20140034955 Nano-MOS Devices and Method of Making
02/06/2014US20140034945 Semiconductor device and method for manufacturing the same
02/06/2014US20140034908 Epitaxially Thickened Doped or Undoped Core Nanowire FET Structure and Method for Increasing Effective Device Width
02/06/2014US20140034905 Epitaxially Thickened Doped or Undoped Core Nanowire FET Structure and Method for Increasing Effective Device Width
02/06/2014US20140034899 Graphene semiconductor and electrical device including the same
02/06/2014US20140034897 Method for forming a pcram with low reset current
02/06/2014US20140034892 Phase change material gradient structures and methods
02/06/2014US20140034632 Apparatus and method for selective oxidation at lower temperature using remote plasma source
02/06/2014US20140034608 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
02/06/2014US20140034584 Process liquid supply apparatus operating method, process liquid supply apparatus and non-transitory storage medium
02/06/2014US20140034548 Wafer container
02/06/2014US20140034455 In-line furnace conveyors with integrated wafer retainers
02/06/2014US20140034242 Edge ring assembly for plasma processing chamber and method of manufacture thereof
02/06/2014US20140034240 Apparatus for treating substrate
02/06/2014US20140034239 Differential counter electrode tuning in a plasma reactor with an rf-driven workpiece support electrode
02/06/2014US20140034238 Semiconductor Processing Device
02/06/2014US20140034096 Acoustic Assisted Single Wafer Wet Clean For Semiconductor Wafer Process
02/06/2014US20140034094 Methods and Apparatus for Cleaning Semiconductor Wafers
02/06/2014US20140033981 MOCVD for Growing III-V Compound Semiconductors on Silicon Substrates
02/06/2014US20140033975 Frame and mask assembly having the same
02/06/2014US20140033814 Capacitive pressure sensor in an overmolded package
02/06/2014US20140033519 Through silicon via repair
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