| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/22/2007 | US20070042519 Manufacturing method of solid-state imaging device and solid-state imaging device |
| 02/22/2007 | US20070042518 Method of manufacturing an amoled |
| 02/22/2007 | US20070042517 Light-emitting element, production method thereof, and light-emitting apparatus |
| 02/22/2007 | US20070042516 Methods for fabrication of localized membranes on single crystal substrate surfaces |
| 02/22/2007 | US20070042515 Printed fuse devices and methods for making the same |
| 02/22/2007 | US20070042514 Method and apparatus for cooling a blade server |
| 02/22/2007 | US20070042513 Electron beam exposure method, hot spot detecting apparatus, semiconductor device manufacturing method, and computer program product |
| 02/22/2007 | US20070042512 Apparatus and method of predicting performance of semiconductor manufacturing process and semiconductor device, and manufacturing method of semiconductor device |
| 02/22/2007 | US20070042511 Substrate processing apparatus and substrate processing method |
| 02/22/2007 | US20070042510 In situ process monitoring and control |
| 02/22/2007 | US20070042509 Detecting endpoint using luminescence in the fabrication of a microelectronics device |
| 02/22/2007 | US20070042508 Pulsed mass flow delivery system and method |
| 02/22/2007 | US20070042455 Porous ceramic, polymer and metal materials with pores created by biological fermentation |
| 02/22/2007 | US20070042440 Forming a first self-assembled monolayer molecules on an electrode substrate, binding the giant molecule with the functional group, substituting with a second self-assembled monolayer molecules the first self-assembled monolayer molecules, removing |
| 02/22/2007 | US20070042386 Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system |
| 02/22/2007 | US20070042288 Positive photoresist composition and method for forming resist pattern |
| 02/22/2007 | US20070042277 Method and apparatus for performing model-based layout conversion for use with dipole illumination |
| 02/22/2007 | US20070042213 Tantalum and niobium compounds and their use for chemical vapour deposition (CVD) |
| 02/22/2007 | US20070042110 System and method for carrying out liquid and subsequent drying treatments on one or more wafers |
| 02/22/2007 | US20070041812 Semiconductor manufacturing equipment and semiconductor manufacturing method |
| 02/22/2007 | US20070041632 Bonding program |
| 02/22/2007 | US20070041410 Apparatus for fabricating a display device |
| 02/22/2007 | US20070041125 Magnetic tunnel junction structure having an oxidized buffer layer and method of fabricating the same |
| 02/22/2007 | US20070041024 Sensor device and stage device |
| 02/22/2007 | US20070040981 Display device |
| 02/22/2007 | US20070040980 Display device |
| 02/22/2007 | US20070040971 Liquid crystal display device and manufacturing method thereof |
| 02/22/2007 | US20070040955 Thin film transistor array substrate and fabricating method thereof |
| 02/22/2007 | US20070040549 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object |
| 02/22/2007 | US20070040548 Active matrix panel inspection device, inspection method, and active matrix oled panel manufacturing method |
| 02/22/2007 | US20070040488 Electric part |
| 02/22/2007 | US20070040455 Actuator and bonding apparatus |
| 02/22/2007 | US20070040287 Method for forming capacitor in a semiconductor device |
| 02/22/2007 | US20070040277 Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing |
| 02/22/2007 | US20070040275 Semiconductor device including diffusion barrier and method for manufacturing the same |
| 02/22/2007 | US20070040273 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods |
| 02/22/2007 | US20070040268 Device package and methods for the fabrication and testing thereof |
| 02/22/2007 | US20070040264 Underfilled semiconductor die assemblies and methods of forming the same |
| 02/22/2007 | US20070040257 Chip packages with covers |
| 02/22/2007 | US20070040251 Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly |
| 02/22/2007 | US20070040250 Semiconductor device |
| 02/22/2007 | US20070040249 Semiconductor device |
| 02/22/2007 | US20070040248 Semiconductor device |
| 02/22/2007 | US20070040242 Semiconductor Device and Method for Manufacturing the Same |
| 02/22/2007 | US20070040241 Wafer inspection device |
| 02/22/2007 | US20070040240 Polycrystalline dysprosium oxide having a luminescent dopant that emits one or more visible light wavelengths when stimulated by radiation generated by the discharge; for enclosing ceramic discharge vessels for metal halide lamps |
| 02/22/2007 | US20070040235 Dual trench isolation for CMOS with hybrid orientations |
| 02/22/2007 | US20070040227 Reducing gate dielectric material to form a metal gate electrode extension |
| 02/22/2007 | US20070040225 High performance MOSFET comprising a stressed gate metal silicide layer and method of fabricating the same |
| 02/22/2007 | US20070040219 III-V group nitride system semiconductor self-standing substrate, method of making the same and III-V group nitride system semiconductor wafer |
| 02/22/2007 | US20070040217 Power semiconductor device |
| 02/22/2007 | US20070040214 Ultra dense trench-gated power device with the reduced drain-source feedback capacitance and Miller charge |
| 02/22/2007 | US20070040213 Trench gate field effect devices |
| 02/22/2007 | US20070040208 Fabrication method and structure of semiconductor non-volatile memory device |
| 02/22/2007 | US20070040207 Electronic devices including dielectric layers with different densities of titanium |
| 02/22/2007 | US20070040202 Semiconductor memory cell array having self-aligned recessed gate MOS transistors and method for forming the same |
| 02/22/2007 | US20070040200 Trench buried bit line memory devices and methods thereof |
| 02/22/2007 | US20070040186 Power semiconductor packaging method and structure |
| 02/22/2007 | US20070040178 Thin film transistor substrate for display device and fabricating method thereof |
| 02/22/2007 | US20070040176 Semiconductor device |
| 02/22/2007 | US20070040170 Electronic devices |
| 02/22/2007 | US20070040133 Lithographic apparatus and device manufacturing method |
| 02/22/2007 | US20070039927 CMP wafer contamination reduced by insitu clean |
| 02/22/2007 | US20070039926 Abrasive-free polishing system |
| 02/22/2007 | US20070039925 Spectra based endpointing for chemical mechanical polishing |
| 02/22/2007 | US20070039924 Low-temperature oxide removal using fluorine |
| 02/22/2007 | US20070039923 Method for preventing charge-up in plasma process and semiconductor wafer manufactured using same |
| 02/22/2007 | US20070039921 Etching solutions and processes for manufacturing flexible wiring boards |
| 02/22/2007 | US20070039818 Method for fabricating a sputtering target |
| 02/22/2007 | US20070039817 Copper-containing pvd targets and methods for their manufacture |
| 02/22/2007 | US20070039686 Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| 02/22/2007 | US20070039637 Liquid immersion optical tool, method for cleaning liquid immersion optical tool, liquid immersion exposure method and method for manufacturing semiconductor device |
| 02/22/2007 | US20070039550 Pulsed mass flow delivery system and method |
| 02/22/2007 | US20070039549 Pulsed mass flow delivery system and method |
| 02/22/2007 | DE4108709B4 Empfangskomparator Receiving comparator |
| 02/22/2007 | DE20122577U1 Vertical double diffused MOS transistor (VDMOS) with polysilicon gate has triple layer with source terrace and trench and metal bridge short circuit |
| 02/22/2007 | DE112005001029T5 Halbleiterbauelement auf der Grundlage Si-Ge mit stark verspannter Beschichtung für eine verbesserte Kanalladungsträgerbeweglichkeit Semiconductor device based on Si-Ge with highly strained coating for improved channel carrier mobility |
| 02/22/2007 | DE112005000828T5 Vorrichtung und Verfahren zur Prüfung von Halbleiter-Wafern Apparatus and method for testing semiconductor wafers |
| 02/22/2007 | DE112005000724T5 In-Situ-Oberflächenbehandlung zur Bildung von Speicherzellen In-situ surface treatment for the formation of memory cells |
| 02/22/2007 | DE112005000394T5 Halbleiterbauelement mit Mehrgatestruktur und Verfahren zu seiner Herstellung A semiconductor device comprising multi-gate structure and process for its preparation |
| 02/22/2007 | DE112005000386T5 Duales Regelungssystem zum Halten der Temperatur eines IC-Chips in der Nähe eines Sollwertes Dual control system for maintaining the temperature of IC-chips near a set point |
| 02/22/2007 | DE10338967B4 Verfahren zum Kleben von Mikrobauteilen auf ein Substrat Method for bonding of micro components on a substrate |
| 02/22/2007 | DE10316429B4 TAB-Folienband für eine Halbleiterpackung TAB film tape for a semiconductor package |
| 02/22/2007 | DE10240423B4 Halbleiterelement mit einem Feldeffekttransistor und einem passiven Kondensator mit reduziertem Leckstrom und einer verbesserten Kapazität pro Einheitsfläche und Verfahren zu dessen Herstellung Semiconductor element having a field effect transistor and a passive capacitor with reduced leakage current and an improved capacity per unit area and process for its preparation |
| 02/22/2007 | DE10236200B4 Verkupferungsverfahren zum elektrolytischen Füllen von Sacklochbohrungen For electrolytic copper plating filling blind holes |
| 02/22/2007 | DE10231385B4 Halbleiterchip mit Bondkontaktstellen und zugehörige Mehrchippackung Semiconductor chip bond pads and associated multi-chip package |
| 02/22/2007 | DE10218498B4 Verfahren zur Herstellung einer Halbleiterschicht und elektronisches Bauelement A process for producing a semiconductor layer and electronic component |
| 02/22/2007 | DE102006035114A1 Semiconductor package, useful for surface mounting, comprises substrate, semiconductor chips and transparent resin layer |
| 02/22/2007 | DE102006034549A1 Vertiefungs-Photolack-Struktur einer Halbleiter-Vorrichtung und Verfahren zum Herstellen derselben Depression photoresist structure of a semiconductor device and method of manufacturing the same |
| 02/22/2007 | DE102006033646A1 Semiconductor components test-device, has write unit coupled to control unit for writing chip identification data into semiconductor elements |
| 02/22/2007 | DE102006030880A1 Laserbearbeitungsverfahren für einen Wafer A laser processing method for a wafer |
| 02/22/2007 | DE102006029281A1 Halbleiterbauelement mit einer vergrabenen Gateelektrode und Verfahren zu seiner Ausbildung A semiconductor device having a buried gate electrode and method of training |
| 02/22/2007 | DE102006003835A1 Fabrication method for semiconductor modules and components for substrates e.g. coils and antennas, involves pressing wafer on to substrate, with welding by ultrasound |
| 02/22/2007 | DE102006000405A1 Gesinterter Yttriumoxidkörper, elektrostatische Haltevorrichtung und Herstellungsverfahren für einen gesinterten Yttriumoxidkörper Sintered Yttriumoxidkörper, electrostatic holding device and manufacturing method for a sintered Yttriumoxidkörper |
| 02/22/2007 | DE102005056916A9 Verfahren zum Gestalten einer Überlagerungs-Markierung A method of designing an overlay mark |
| 02/22/2007 | DE102005051857A1 UBM-PAD, Lötkontakt und Verfahren zur Herstellung einer Lötverbindung UBM pad, solder contact and method for making a solder joint |
| 02/22/2007 | DE102005039478A1 Leistungshalbleiterbauteil mit Halbleiterchipstapel und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack and processes for preparing |
| 02/22/2007 | DE102005039323A1 Conduction path arrangement for semiconductor technology, has support paths formed between substrate and conduction paths for supporting conduction paths |
| 02/22/2007 | DE102005038752A1 Method for mounting semiconductor chips on substrate, |
| 02/22/2007 | DE102005038672A1 Thermal treatment device for semiconductor substrates, uses reflection element with high reflection capability for radiation from heating device |