Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/01/2007US20070048894 System and method for reduced material pileup
03/01/2007US20070048893 Laser induced thermal imaging apparatus and fabricating method of organic light emitting diode using the same
03/01/2007US20070048891 Device transferring method, and device arraying method
03/01/2007US20070048890 Semiconductor device fabrication method and semiconductor device
03/01/2007US20070048889 Method of forming a piezoresistive device capable of selecting standards and method of forming a circuit layout capable of selecting sub-circuit layouts
03/01/2007US20070048888 Electrical contact for a MEMS device and method of making
03/01/2007US20070048887 Wafer level hermetic bond using metal alloy
03/01/2007US20070048886 Electrical connection in OLED devices
03/01/2007US20070048885 Thin film led
03/01/2007US20070048884 Method and apparatus for localizing production errors in a semiconductor component part
03/01/2007US20070048883 Method and semiconductor structure for monitoring the fabrication of interconnect structures and contacts in a semiconductor device
03/01/2007US20070048882 Method to reduce plasma-induced charging damage
03/01/2007US20070048881 Memory device transistors
03/01/2007US20070048880 Capacitor, method of manufacturing the same, method of manufacturing ferroelectric memory device, method of manufacturing actuator, and method of manufacturing liquid jet head
03/01/2007US20070048879 Integrated Circuit Chip Utilizing Oriented Carbon Nanotube Conductive Layers
03/01/2007US20070048632 Photomask and method for exposing chip pattern
03/01/2007US20070048631 Mask defect repairing method and semiconductor device manufacturing method
03/01/2007US20070048492 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
03/01/2007US20070048456 Plasma enhanced chemical vapor deposition apparatus and method
03/01/2007US20070048455 Thin film forming method
03/01/2007US20070048446 Gas delivery system for semiconductor processing
03/01/2007US20070047952 Image sensor module, method of manufacturing the same, and camera module using the same
03/01/2007US20070047798 Pattern inspection apparatus, pattern inspection method, and program-recorded readable recording medium
03/01/2007US20070047381 Method for continuously blending chemical solutions
03/01/2007US20070047319 Scalable flash/NV structures and devices with extended endurance
03/01/2007US20070047302 Novel monolithic, combo nonvolatile memory allowing byte, page and block write with no disturb and divided-well in the cell array using a unified cell structure and technology with a new scheme of decoder and layout
03/01/2007US20070047170 Electrostatic chuck having textured contact surface
03/01/2007US20070047069 8-Mirror microlithography projection objective
03/01/2007US20070046919 Lithographic apparatus and device manufacturing method
03/01/2007US20070046915 Lithographic apparatus and device manufacturing method
03/01/2007US20070046912 Interferometric measuring device and projection exposure installation comprising such measuring device
03/01/2007US20070046849 Thin film transistor array substrate and repairing method of the same
03/01/2007US20070046365 Bias circuit having transistors that selectively provide current that controls generation of bias voltage
03/01/2007US20070046313 Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
03/01/2007US20070046284 Integrated Process Condition Sensing Wafer and Data Analysis System
03/01/2007US20070045874 Lithographic Type Microelectronic Spring Structures with Improved Contours
03/01/2007US20070045865 Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
03/01/2007US20070045861 Semiconductor device, and production method for manufacturing such semiconductor device
03/01/2007US20070045860 Semiconductor device and method for fabricating the same
03/01/2007US20070045858 Microfeature workpieces and methods for forming interconnects in microfeature workpieces
03/01/2007US20070045856 Mixed metal nitride and boride barrier layers
03/01/2007US20070045853 Method for forming metal line, method for manufacturing semiconductor device using the method, and semiconductor device
03/01/2007US20070045850 Metal interconnect structure for integrated circuits and a design rule therefor
03/01/2007US20070045840 Method of solder bumping a circuit component and circuit component formed thereby
03/01/2007US20070045831 Separating and assembling semiconductor strips
03/01/2007US20070045830 Wafer integrated rigid support ring
03/01/2007US20070045820 Trench plating process and apparatus for through hole vias
03/01/2007US20070045818 Land grid array semiconductor device packages, assemblies including same, and methods of fabrication
03/01/2007US20070045816 Electronic package with improved current carrying capability and method of forming the same
03/01/2007US20070045813 Printed circuit board assembly with strain-alleviating structures
03/01/2007US20070045808 Test carrier for semiconductor components having conductors defined by grooves
03/01/2007US20070045806 Structure of an ultra-thin wafer level stack package
03/01/2007US20070045799 Wafer processing method and adhesive tape used in the wafer processing method
03/01/2007US20070045782 Heat resistant ohmic electrode and method of manufacturing the same
03/01/2007US20070045781 Hermetic interconnect structure and method of manufacture
03/01/2007US20070045780 Methods of forming blind wafer interconnects, and related structures and assemblies
03/01/2007US20070045779 Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure
03/01/2007US20070045776 Semiconductor device
03/01/2007US20070045765 Semiconductor device having substrate-driven field-effect transistor and schottky diode and method of forming the same
03/01/2007US20070045753 Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
03/01/2007US20070045749 Cmos well structure and method of forming the same
03/01/2007US20070045742 Fully-depleted (FD) (SOI) MOSFET access transistor and method of fabrication
03/01/2007US20070045739 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor apparatus and photomask
03/01/2007US20070045738 Method for the manufacture of a strained silicon-on-insulator structure
03/01/2007US20070045737 Semiconductor device and method for manufacturing the same
03/01/2007US20070045733 Programmable random logic arrays using PN isolation
03/01/2007US20070045730 Semiconductor device, method of manufacturing the same, and electronic device having the same
03/01/2007US20070045717 Charge-trapping memory device and method of production
03/01/2007US20070045714 Semiconductor device including transistor with composite gate structure and transistor with single gate structure, and method for manufacturing the same
03/01/2007US20070045693 Semiconductor constructions, and methods of forming capacitor devices
03/01/2007US20070045685 Method and apparatus providing integrated color pixel with buried sub-wavelength gratings in solid state imagers
03/01/2007US20070045684 Image sensor and method for fabricating the same
03/01/2007US20070045652 Semiconductor device
03/01/2007US20070045643 Substrate-based white light diode
03/01/2007US20070045639 Semiconductor electronic device
03/01/2007US20070045624 Method for manufacturing a thin-film transistor
03/01/2007US20070045607 Algainn nitride substrate structure using tin as buffer layer and the manufacturing method thereof
03/01/2007US20070045233 Polishing liquid composition
03/01/2007US20070045232 Wafer polishing method and polished wafer
03/01/2007US20070045231 Resist removing method and resist removing apparatus
03/01/2007US20070045230 Methods for independently controlling one or more etching parameters in the manufacture of microfeature devices
03/01/2007US20070045229 System and method for the manufacture of surgical blades
03/01/2007US20070045228 Etching depth measuring device, etching apparatus, and etching depth measuring method
03/01/2007US20070045227 Method of stripping photoresist
03/01/2007US20070045226 Technique for reducing silicide defects by reducing deleterious effects of particle bombardment prior to silicidation
03/01/2007US20070045122 Building up a three-dimensional structure from a number of adhered layers by depositing a first material onto a substrate; selectively etching to a desired depth; depositing a second material at least into the voids created; at least one of the deposition processes is an electrodeposition process
03/01/2007US20070045031 Oil-hydraulic vehicle
03/01/2007US20070044914 Vacuum processing apparatus
03/01/2007US20070044913 Grooved Retaining Ring
03/01/2007US20070044720 Gate valve and substrate-treating apparatus including the same
03/01/2007US20070044719 Processing chamber configured for uniform gas flow
03/01/2007US20070044718 Wafer Holder and Semiconductor Manufacturing Apparatus
03/01/2007US20070044705 Method for crystallization of a weakly acidic and/or weakly basic compound
03/01/2007DE202005016654U1 Vorrichtung zur Überwachung der Relativposition mehrerer Einrichtungen Apparatus for monitoring the relative position of multiple devices
03/01/2007DE202005016216U1 Vorrichtung zum Temperieren eines Substrats Apparatus for controlling the temperature of a substrate
03/01/2007DE19983456B4 Heat oxidation film formation in semiconductor device manufacture - involves subjecting process object to oxidation treatment using gas-containing pure nitrogen@ and micro-dose of oxygen@
03/01/2007DE19924651B4 Verfahren zur Herstellung eines Kontakts eines Halbleiterspeicherbauelements A method for producing a contact of a semiconductor memory device
03/01/2007DE19736145B4 Verfahren zum Planieren von Halbleiterwafern Method for grading of semiconductor wafers
03/01/2007DE19728183B4 Herstellungsverfahren für leitende Drähte eines Halbleitergehäuses in Chipgrösse Manufacturing method for conductive wires of a semiconductor package in chip size
03/01/2007DE19537358B4 IC-Träger IC carrier