Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/14/2007EP1753109A2 Electrostatic discharge protection circuit
02/14/2007EP1753032A1 Semiconductor substrate for solar cell, method for manufacturing the same, and solar cell
02/14/2007EP1753030A2 Flat panel display and method of manufacturing the same
02/14/2007EP1753022A1 Semiconductor power device with multiple drain and corresponding manufacturing process
02/14/2007EP1753021A1 Semiconductor device and method for manufacturing same
02/14/2007EP1753020A1 Semiconductor device and method for fabricating the same
02/14/2007EP1753019A1 Impurity introducing method and electronic element using it
02/14/2007EP1753018A2 Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device
02/14/2007EP1753017A1 Analysis method, exposing equipment and exposing equipment system
02/14/2007EP1753016A1 Exposure apparatus and device producing method
02/14/2007EP1753015A2 Silicon wafer cleaning method
02/14/2007EP1753014A1 Heating element
02/14/2007EP1753009A1 Charge neutralizing device
02/14/2007EP1752912A2 Fingerprint detection device and method of its manufacture, and apparatus for f orming a projective film
02/14/2007EP1752897A1 Mechanismus for making and inspecting reticles
02/14/2007EP1752828A1 Rinse solution for lithography
02/14/2007EP1752827A1 Rinsing fluid for lithography
02/14/2007EP1752826A1 Resist pattern forming method and composite rinse agent
02/14/2007EP1752725A1 Vertical heat treatment equipment and method for transferring object to be treated
02/14/2007EP1752567A1 Process for producing wafer of silicon carbide single-crystal
02/14/2007EP1752565A1 Apparatus for measuring semiconductor physical characteristics
02/14/2007EP1752023A2 Triarylamine compounds for use as charge transport materials
02/14/2007EP1751806A2 Optoelectronic semiconductor component and housing base for such a component
02/14/2007EP1751805A1 Artificial amorphous semiconductors and applications to solar cells
02/14/2007EP1751801A2 Method and process intermediate for electrostatic discharge protection in flat panel imaging detctors
02/14/2007EP1751794A2 Method for enhancing field oxide and integrated circuit with enhanced field oxide
02/14/2007EP1751793A2 Packaged integrated circuit devices
02/14/2007EP1751792A1 Semiconductor package with transparent lid
02/14/2007EP1751791A2 Method for making a semiconductor structure using silicon germanium
02/14/2007EP1751790A2 Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
02/14/2007EP1751789A1 Flexible electro-optical apparatus and method for manufacturing the same
02/14/2007EP1751788A1 Flexible single-crystal film and method of manufacturing the same
02/14/2007EP1751333A2 Spin-coatable liquid for formation of high purity nanotube films
02/14/2007EP1751325A2 Controlled vapor deposition of multilayered coatings adhered by an oxide layer
02/14/2007EP1751243A1 Cmp porous pad with component-filled pores
02/14/2007EP1750894A1 Laser machining of a workpiece
02/14/2007EP1634296A4 Non-volatile electromechanical field effect devices and circuits using same and methods of forming same
02/14/2007EP1573820B1 Fin field effect transistor memory cell, fin field effect transistor memory cell arrangement, and method for the production of a fin field effect transistor memory cell
02/14/2007EP1556455B1 Polishing composition containing conducting polymer
02/14/2007EP1547216B1 High power semiconductor laser diode and method for making such a diode
02/14/2007EP1472789B1 Integrated circuit and battery powered electronic device
02/14/2007EP1458520B1 Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article
02/14/2007EP1445995B1 Method of mounting an electronic component on a circuit board and system for carrying out the method
02/14/2007EP1402566B1 Megasonic cleaner and dryer system
02/14/2007EP1347025B1 Use of a wafer processing adhesive tape
02/14/2007EP1324851A4 Polymer collar for solder bumps
02/14/2007EP1266412B1 Method and device for transferring spin-polarized charge carriers
02/14/2007EP1261984B1 Substrate thermal management system
02/14/2007EP1240662B1 Bowl, spin, rinse, and dry module, and method for loading a semiconductor wafer into a spin, rinse, and dry module
02/14/2007EP1235262B1 Heat treatment device
02/14/2007EP1125002A4 Systems and methods for two-sided etch of a semiconductor substrate
02/14/2007EP1108257B1 An mram cell requiring low switching field
02/14/2007EP1100096B1 Electronic device and manufacture thereof
02/14/2007EP1053566B1 Method and composition for dry photoresist stripping in semiconductor fabrication
02/14/2007EP1008186B1 Power transistor cell
02/14/2007EP0914496A4 Microwave applicator for an electron cyclotron resonance plasma source
02/14/2007CN2870388Y Circuit-board bending machine
02/14/2007CN2870171Y Chip bearing device
02/14/2007CN2870170Y Transverse PNP transistor and motor stabilizing circuit adopting same
02/14/2007CN2868552Y Retainer ring fixed by magnetic mode
02/14/2007CN1914963A Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
02/14/2007CN1914787A Switching power supply and semiconductor integrated circuit
02/14/2007CN1914786A Semiconductor device and module using the same
02/14/2007CN1914745A Method for fabricating piezoelectric element
02/14/2007CN1914739A NOR-type channel-program channel-erase contactless flash memory on soi
02/14/2007CN1914737A Semiconductor element and its manufacturing method and liquid-crystal display device and its manufacturing method
02/14/2007CN1914736A 半导体装置 Semiconductor device
02/14/2007CN1914735A Method for manufacturing thin-film semiconductor circuit, and element substrate
02/14/2007CN1914734A Semiconductor device and process for fabricating the same
02/14/2007CN1914732A 半导体器件 Semiconductor devices
02/14/2007CN1914730A Apparatus incorporating small-feature-size and large-feature-size components and method for making same
02/14/2007CN1914728A 半导体器件 Semiconductor devices
02/14/2007CN1914725A Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
02/14/2007CN1914723A Method of packaging an optical sensor
02/14/2007CN1914722A Method for fabricating strained silicon-on-insulator strucutures and strained silicon-on-insulator strucutres formed thereby
02/14/2007CN1914721A Formation of patterned silicon-on-insulator (soi)/silicon-on-nothing (son) composite structure by porous si engineering
02/14/2007CN1914720A Semiconductor package with contact support layer and method to produce the package
02/14/2007CN1914719A Flipchip QFN package and method therefor
02/14/2007CN1914718A Method for forming a semiconductor device with local semiconductor-on-insulator
02/14/2007CN1914717A Stress-tuned, single-layer silicon nitride film and deposition method thereof
02/14/2007CN1914716A Method for cleaning process chamber of substrate processing apparatus, substrate processing apparatus, and method for processing substrate
02/14/2007CN1914715A Techniques for the use of amorphous carbon(apf) for various etch and litho integration scheme
02/14/2007CN1914714A Substrate processing system and process for fabricating semiconductor device
02/14/2007CN1914713A Schedule control method in spin etching and spin etching system
02/14/2007CN1914712A Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
02/14/2007CN1914711A Polishing apparatus and substrate processing apparatus
02/14/2007CN1914710A System and method for selective etching of silicon nitride during substrate processing
02/14/2007CN1914709A Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
02/14/2007CN1914626A 半导体器件 Semiconductor devices
02/14/2007CN1914614A Method of automatically generating the structures from mask layout
02/14/2007CN1914552A Electronic device, semiconductor device and its manufacturing method
02/14/2007CN1914525A Polarization conversion element, lighting optical device, exposure system, and exposure method
02/14/2007CN1914150A Alkoxide compound, raw material for thin film formation and process for producing thin film
02/14/2007CN1914115A Integrated getter area for wafer level encapsulated microelectromechanical systems
02/14/2007CN1914094A Marker clip for IC tray
02/14/2007CN1914004A Multi-step pad conditioning system and method for chemical planarization
02/14/2007CN1914001A Soldering flux and soldering method
02/14/2007CN1913801A Methods and apparatus for installing a scrubber brush on a mandrel
02/14/2007CN1913741A Control method of plasma treatment device and plasma treatment device
02/14/2007CN1913191A Method of fabricating a resistance based memory device and the memory device