Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/28/2007EP1290454B1 Microcontactor probe and electric probe unit
02/28/2007EP1272410A4 Modular sorter
02/28/2007EP1264520A4 Packaging structure and method
02/28/2007EP1247433A4 Enhanced etching/smoothing of dielectric surfaces
02/28/2007EP1226604B1 Fabrication process of a semiconductor device
02/28/2007EP1200980B1 Adaptive gas cluster ion beam for smoothing surfaces
02/28/2007EP1181400B1 Electrochemical etching installation and method for etching a body to be etched
02/28/2007EP1169896B1 Low stress die attachment
02/28/2007EP1164629B1 Exposure apparatus and proces for producing it
02/28/2007EP1159465B1 Method of atomic layer deposition
02/28/2007EP1153267B1 Tuning fork gyroscope
02/28/2007EP1076911B1 Method and apparatus for ionized physical vapor deposition
02/28/2007EP1040292B1 Gas panel
02/28/2007EP0998592B1 Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
02/28/2007CN2874773Y Laminated equipment conveyer of solar cell moudle
02/28/2007CN2874768Y Press holder of wafer pick up mechanism
02/28/2007CN2874524Y Thyrester tube core parameter detection mould
02/28/2007CN2874502Y Adhesive sheet element detection clamp
02/28/2007CN1922941A Screen printing apparatus and screen printing method
02/28/2007CN1922772A Nitride compound semiconductor device and process for producing the same
02/28/2007CN1922735A Transistor gate electrode having conductor material layer
02/28/2007CN1922734A Low crosstalk substrate for mixed-signal integrated circuits
02/28/2007CN1922731A Semiconductor device and its manufacturing method
02/28/2007CN1922730A System comprising an electrical component and an electrical connecting lead for said component, and method for the production of said system
02/28/2007CN1922727A Manufacturing method of semiconductor device, integrated circuit card, ic tag, rfid, transponder, bill, negotiable securities, passport, electronic apparatus, bag, and clothing
02/28/2007CN1922726A Methods of fabricating interconnects for semiconductor components
02/28/2007CN1922725A Equipment and method for processing semiconductor
02/28/2007CN1922724A Contaminant reducing substrate transport and support system
02/28/2007CN1922723A Method and apparatus for maintaining parallelism of layers and/or achieving desired thicknesses of layers during the electrochemical fabrication of structures
02/28/2007CN1922722A Reduction of feature critical dimensions
02/28/2007CN1922721A Semiconductor apparatus
02/28/2007CN1922720A Semiconductor nano-wire, and semiconductor device provided with that nano-wire
02/28/2007CN1922719A Semiconductor device and method of manufacturing a semiconductor device
02/28/2007CN1922718A Device manufacturing method and substrate
02/28/2007CN1922717A Gate electrode dopant activation method for semiconductor manufacturing
02/28/2007CN1922716A Vapor-phase growth method
02/28/2007CN1922715A Exposure apparatus, exposure method, and device fabricating method
02/28/2007CN1922546A Bilayer laminated film for bump formation and method for forming bump
02/28/2007CN1922541A Double layer transparent conductor scheme having improved etching properties for transparent electrodes in electro-optic displays
02/28/2007CN1922472A Establishing correspondence and traceability between wafers and solar cells
02/28/2007CN1922463A Method and apparatus for measuring film thickness by means of coupled eddy sensors
02/28/2007CN1922457A Backside rapid thermal processing of patterned wafers
02/28/2007CN1922344A Apparatus for electroless deposition
02/28/2007CN1922339A Vapor deposition source with minimized condensation effects
02/28/2007CN1922216A Styrene derivative, styrene polymer, photosensitive resin composition, and method for forming pattern
02/28/2007CN1922123A Polyacene compound and organic semiconductor thin film
02/28/2007CN1922087A Base plate output-input device and base plate output-input method
02/28/2007CN1922011A Multilayer body
02/28/2007CN1921955A Substrate processing apparatus and method
02/28/2007CN1921154A Installing method for light-emitting diode chip
02/28/2007CN1921149A A portable information terminal and a camera
02/28/2007CN1921145A Bipolar transistor and and method of manufacture
02/28/2007CN1921144A Gate pattern of semiconductor device and method for fabricating the same
02/28/2007CN1921142A Organic illuminated display device and and method for making same
02/28/2007CN1921140A Organic light emitting display and method for fabricating the same
02/28/2007CN1921136A Organic electroluminescent device, and electronic devices therewith
02/28/2007CN1921132A CMOS image sensor and method for fabricating the same
02/28/2007CN1921131A CMOS image sensor and method for fabricating the same
02/28/2007CN1921129A Image sensor pixel having a lateral doping profile formed with indium doping
02/28/2007CN1921125A Packaging structure for optical sensing assembly and method of manufacture
02/28/2007CN1921124A Flat display device and CMOS
02/28/2007CN1921123A Semiconductor memory device and manufacturing method thereof, and information rewriting method
02/28/2007CN1921122A Semiconductor device and method for manufacturing the same
02/28/2007CN1921121A Asymmetric floating grid NAND flash memory
02/28/2007CN1921120A Quickflashing memory device and its forming method
02/28/2007CN1921119A Semiconductor structure of high-pressure side driver and manufacturing method thereof
02/28/2007CN1921116A Semiconductor structures and methods for forming such semiconductor structures
02/28/2007CN1921114A Semiconductor device and method for fabricating the same
02/28/2007CN1921112A Dielectric film capacitor and method of manufacturing the same
02/28/2007CN1921108A Semiconductor package and manufacturing method thereof
02/28/2007CN1921107A Image sensor module, method of manufacturing the same, and camera module using the same
02/28/2007CN1921106A Opto-electronic package, and methods and systems for making and using same
02/28/2007CN1921102A Copper interconnect structures and fabrication method thereof, semiconductor device
02/28/2007CN1921100A Winding for thin film coating crystal package and its constitution and manufacturing method
02/28/2007CN1921097A Board having electronic parts mounted by using under-fill material and method for producing the same
02/28/2007CN1921095A Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same
02/28/2007CN1921090A Low-temperature polycrystalline silicon liquid crystal display structure and method for manufacturing same
02/28/2007CN1921089A Manufacturing method of driving components array substrate
02/28/2007CN1921088A Method for producing a structure with a low aspect ratio
02/28/2007CN1921087A Producing method for strain source leakage CMOS using multilayer film as hard mask and anti-reflecting layer
02/28/2007CN1921086A Integrated producing method for strain CMOS
02/28/2007CN1921085A Circuitry component and method for forming the same
02/28/2007CN1921084A Oxide film filled structure, oxide film filling method, semiconductor device
02/28/2007CN1921083A Method for fabricating semiconductor device
02/28/2007CN1921082A Gate valve and substrate-treating apparatus including the same
02/28/2007CN1921081A Test base board and its chassis
02/28/2007CN1921080A Component mounting method and component-mounted body
02/28/2007CN1921079A Method of manufacturing a wiring board
02/28/2007CN1921078A Packaging method for optical sensing semiconductor assembly and its packaging structure
02/28/2007CN1921077A Producing method for GaAs radical enhancing/depletion type fakement matching high electron mobility transistor gate
02/28/2007CN1921076A Manufacturing method of thin film transistor
02/28/2007CN1921075A Semiconductor device and method for modifying body-contacted silicon on insulation (SOI) field effect transistors
02/28/2007CN1921074A Methods of forming charge-trapping dielectric layers for semiconductor memory devices
02/28/2007CN1921073A Selective ion implantation pre-amorphous method for metal silicide production
02/28/2007CN1921072A Method for etching high dielectric constant materials
02/28/2007CN1921071A Semiconductor device manufacturing apparatus, semiconductor device manufacturing method and semiconductor device
02/28/2007CN1921070A Method for fabricating semiconductor device and semiconductor device
02/28/2007CN1921069A Laser processing apparatus utilizing laser beam to irradiate semiconductor layer
02/28/2007CN1921068A Particle sticking prevention apparatus and plasma processing apparatus
02/28/2007CN1921067A Method for forming a layer, method for manufacturing an active matrix substrate, and method for manufacturing a multilayered wiring substrate