| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/27/2007 | US7182996 Deposting nanowires on a substrate |
| 02/27/2007 | US7182995 Plated-polyester article and production process thereof |
| 02/27/2007 | US7182938 and/or titania particles having polysiloxane star or graft copolymer coatings, used as sunscreen agents |
| 02/27/2007 | US7182882 Method of improving chemical mechanical polish endpoint signals by use of chemical additives |
| 02/27/2007 | US7182880 Process for reducing particle formation during etching |
| 02/27/2007 | US7182879 Plasma processing method |
| 02/27/2007 | US7182876 Cantilever microstructure and fabrication method thereof |
| 02/27/2007 | US7182849 ECP polymer additives and method for reducing overburden and defects |
| 02/27/2007 | US7182821 Substrate processing method and substrate processing apparatus |
| 02/27/2007 | US7182819 Methods for cleaning a chamber of semiconductor device manufacturing equipment |
| 02/27/2007 | US7182816 Particulate reduction using temperature-controlled chamber shield |
| 02/27/2007 | US7182811 Semiconductor light emitting device and method for producing the same |
| 02/27/2007 | US7182794 Correcting device, exposure apparatus, device production method, and device produced by the device production method |
| 02/27/2007 | US7182793 System for reducing oxidation of electronic devices |
| 02/27/2007 | US7182673 Method and apparatus for post-CMP cleaning of a semiconductor work piece |
| 02/27/2007 | US7182672 Method of probe tip shaping and cleaning |
| 02/27/2007 | US7182531 Developing method and apparatus |
| 02/27/2007 | US7182241 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/27/2007 | US7182240 Solder coated lid |
| 02/27/2007 | US7182234 Substrate cutting device and method |
| 02/27/2007 | US7182203 Wafer container and door with vibration dampening latching mechanism |
| 02/27/2007 | US7182201 Wafer carrying apparatus and wafer carrying method |
| 02/27/2007 | US7182122 Heating and cooling apparatus, and vacuum processing apparatus equipped with this apparatus |
| 02/27/2007 | US7182118 Pick and place assembly for transporting a film of material |
| 02/27/2007 | US7181863 Wafer dryer and method for drying a wafer |
| 02/27/2007 | US7181835 Universal clamping mechanism |
| 02/27/2007 | US7181833 Method of mounting an electronic part |
| 02/22/2007 | WO2007022471A2 Substrate support having brazed plates and heater |
| 02/22/2007 | WO2007022370A2 A method for fabricating a semiconductor device |
| 02/22/2007 | WO2007022359A2 Vertical integrated silicon nanowire field effect transistors and methods of fabrication |
| 02/22/2007 | WO2007022326A2 Tunable light filter |
| 02/22/2007 | WO2007022316A2 Power semiconductor device with interconnected gate trenches |
| 02/22/2007 | WO2007022302A2 High throughput crystallization of thin films |
| 02/22/2007 | WO2007022277A2 Siox:si composite articles and methods of making same |
| 02/22/2007 | WO2007022234A1 Systems and methods for uniform sequential lateral solidification of thin films using high frequency lasers |
| 02/22/2007 | WO2007022226A2 Nanowires-based transparent conductors |
| 02/22/2007 | WO2007022145A2 Cleanspace fabricator support and method |
| 02/22/2007 | WO2007022075A2 Tin-silver solder bumping in electronics manufacture |
| 02/22/2007 | WO2007021855A2 Atmospheric process and system for controlled and rapid removal of polymers from high aspect ratio holes |
| 02/22/2007 | WO2007021808A1 Method of forming gate electrode structures |
| 02/22/2007 | WO2007021701A2 Structure and method for forming inter-poly dielectric in a shielded gate field effect transistor |
| 02/22/2007 | WO2007021654A2 Apparatus for developing photoresist and method for operating the same |
| 02/22/2007 | WO2007021639A2 3d ic method and device |
| 02/22/2007 | WO2007021520A2 Substrate support for increasing substrate temperature in plasma reactors |
| 02/22/2007 | WO2007021421A2 Low temperature formation of patterned epitaxial si containing films |
| 02/22/2007 | WO2007021414A1 Chemically modified polishing pad for chemical mechanical polishing |
| 02/22/2007 | WO2007021403A2 Low-temperature oxide removal using fluorine |
| 02/22/2007 | WO2007021385A2 SEQUENTIAL DEPOSITION PROCESS FOR FORMING Si-CONTAINING FILMS |
| 02/22/2007 | WO2007021130A1 Patterning method using coatings containing ionic components |
| 02/22/2007 | WO2007021112A1 Test handler |
| 02/22/2007 | WO2007021079A1 Method and apparatus for manufacturing a probe card |
| 02/22/2007 | WO2007021046A1 Method of manufacturing needle for probe card using fine processing technology, needle manufactured by the method, and probe card comprising the needle |
| 02/22/2007 | WO2007021029A2 Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| 02/22/2007 | WO2007020981A1 Mn CONTAINING COPPER ALLOY SPUTTERING TARGET WHICH GENERATES LESS PARTICLES |
| 02/22/2007 | WO2007020979A1 Composition for removing hard mask and removing method |
| 02/22/2007 | WO2007020971A1 Method for manufacture of substrate having ferroelectric layer |
| 02/22/2007 | WO2007020963A1 Nanoimprint method and apparatus |
| 02/22/2007 | WO2007020962A1 Nanoimprint method and apparatus |
| 02/22/2007 | WO2007020939A1 Polishing slurry |
| 02/22/2007 | WO2007020926A1 Method for surface treating semiconductor |
| 02/22/2007 | WO2007020901A1 Fluorine-containing adamantane derivative, fluorine-containing adamantane derivative having polymerizable group, and resin composition containing same |
| 02/22/2007 | WO2007020890A1 Plotting device, exposure device, and plotting method |
| 02/22/2007 | WO2007020878A1 Method and apparatus for producing porous silica |
| 02/22/2007 | WO2007020874A1 Thin film forming method and semiconductor device manufacturing method |
| 02/22/2007 | WO2007020872A1 Placing table structure, method for manufacturing placing table structure and heat treatment apparatus |
| 02/22/2007 | WO2007020866A1 Detection device and inspection device |
| 02/22/2007 | WO2007020859A1 Substrate polishing apparatus and substrate polishing method |
| 02/22/2007 | WO2007020833A1 Masking paste, method for producing same, and method for manufacturing solar cell using masking paste |
| 02/22/2007 | WO2007020832A1 Switching device |
| 02/22/2007 | WO2007020823A1 Magnetic memory cell, magnetic random access memory and method for reading/writing data in magnetic random access memory |
| 02/22/2007 | WO2007020822A1 Laser processing method |
| 02/22/2007 | WO2007020805A1 Manufacturing method of semiconductor device |
| 02/22/2007 | WO2007020796A1 Semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020781A1 Method for producing coating liquid for film formation |
| 02/22/2007 | WO2007020761A1 Work fixing apparatus, method for positioning such work fixing apparatus, and image forming apparatus |
| 02/22/2007 | WO2007020698A1 Device identifying method, device manufacturing method and electronic device |
| 02/22/2007 | WO2007020694A1 Semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020688A1 Semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020686A1 Semiconductor device and method for manufacturing same |
| 02/22/2007 | WO2007020684A1 Semiconductor integrated circuit device and method for manufacture thereof |
| 02/22/2007 | WO2007020351A1 Method of transferring a thin film onto a support |
| 02/22/2007 | WO2007020287A1 Dual trench isolation for cmos with hybrid orientations |
| 02/22/2007 | WO2007020273A1 Low dielectric constant silicon coating, method for the preparation and application thereof to integrated circuits |
| 02/22/2007 | WO2007020174A1 Thermode device for a multitude of semiconductor components |
| 02/22/2007 | WO2007020132A1 Sensor arrangement comprising a substrate and a housing and method for producing a sensor arrangement |
| 02/22/2007 | WO2007020016A1 Semiconductor power device with multiple drain structure and corresponding manufacturing process |
| 02/22/2007 | WO2007020008A2 Motion device having a double-sided suction bar |
| 02/22/2007 | WO2007019732A1 Surface mount component having magnetic layer thereon and method of forming same |
| 02/22/2007 | WO2007002674A3 Unsymmetrical ligand sources, reduced symmetry metal-containing compounds, and systems and methods including same |
| 02/22/2007 | WO2007002672A3 Atomic layer deposition using alkaline earth metal beta-diketiminate precursors |
| 02/22/2007 | WO2006135261A3 Nansoscale patterning and fabrication methods |
| 02/22/2007 | WO2006133380A3 Manufacturing of electronic devices using conductive polymer |
| 02/22/2007 | WO2006127291A3 Method for making a semiconductor device including a superlattice having at least one group of substantially undoped layers |
| 02/22/2007 | WO2006127225A3 Semiconductor device comprising a superlattice dielectric interface layer |
| 02/22/2007 | WO2006125062A3 System for supplying carbon dioxide |
| 02/22/2007 | WO2006125040A3 Lattice-mismatched semiconductor structures with reduced dislocation defect densities related methods for device fabrication |
| 02/22/2007 | WO2006121566A3 Ultrascalable vertical mos transistor with planar contacts |
| 02/22/2007 | WO2006107550A3 Barrier structure and nozzle device for use in tools used to process microelectronic workpieces with one or more treatment fluids |
| 02/22/2007 | WO2006071816A3 Window protector for sputter etching of metal layers |
| 02/22/2007 | WO2006058009A3 Using zeolites to improve the mechanical strenght of low-k interlayer dielectrics |