Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/21/2007CN1916146A Polymer-stripping composition
02/21/2007CN1916097A Adhesive sheet and semiconductor device and process for producing the same
02/21/2007CN1915797A Single chip integration method of CMOS circuit and MEMS tiny electrodei
02/21/2007CN1915760A Chip tray
02/21/2007CN1915598A Polishing pad and method of manufacture
02/21/2007CN1915596A 透明抛光垫 Transparent polishing pad
02/21/2007CN1915572A Laser irradiation method and laser irradiation device and method of manufacturing semiconductor device
02/21/2007CN1301557C SRAM unit with multi-grid transistor and mfg method thereof
02/21/2007CN1301556C CMOS assembly and its manufacturing method
02/21/2007CN1301554C 半导体器件 Semiconductor devices
02/21/2007CN1301552C Method for controlling top size of deep trench
02/21/2007CN1301551C Storage unit manufacturing method and apparatus
02/21/2007CN1301550C Method of mfg complementary thin film transister
02/21/2007CN1301549C Method for mfg. semiconductor IC device
02/21/2007CN1301548C Semiconductor structure for avoiding polycrystalline silicon stringer formation in semiconductor production
02/21/2007CN1301547C Method for forming contact window of bit line
02/21/2007CN1301546C Method for improving dense fast flashing memory trough oxide layer edge electric avalanche utilizing shielding bird's mouth
02/21/2007CN1301545C Producer and producing method for producing object
02/21/2007CN1301544C Method of manufacturing semiconductor device
02/21/2007CN1301543C Semiconductor wafer, semiconductor device and its producing method, circuit base baord and electronic machine
02/21/2007CN1301542C Semiconductor wafer, semiconductor device and its producing method, circuit base board and electronic machine
02/21/2007CN1301541C Manufacture method of semiconductor device
02/21/2007CN1301540C Flip chip assembly process and substrate used therewith and printed screen free from being stained with solder
02/21/2007CN1301539C Method for forming Low-temperature polysilicon thin film transistor
02/21/2007CN1301538C Thin-film transistor structure and producing method thereof
02/21/2007CN1301537C Method of preparing boron-phosphor-silicon fluorine glass
02/21/2007CN1301536C Method for preventing water from micro particles dropping onto it while cutting
02/21/2007CN1301535C Method for forming polysilicon layer on base plate
02/21/2007CN1301534C Method for preventing abnormal event of semiconductor boiler tube temperature and gas flow rate
02/21/2007CN1301507C Heat stable ferroelectric body memory
02/21/2007CN1301443C Background exposure method and equipment using said method
02/21/2007CN1301436C Multiple zone vertical arrangement type liquid crystal display and its pixel electrode forming method
02/21/2007CN1301431C 液晶显示装置 The liquid crystal display device
02/21/2007CN1301409C Method and system for compensating thermally induced motion of probe cards
02/21/2007CN1301343C Vacuum exhaust system and monitoring and controlling method thereof
02/21/2007CN1301342C Application of dense plasmas generated at atmospheric pressure for treating gas effluents
02/21/2007CN1301184C Optical grinding machine and method for processing sapphire crystal substrate for semiconductor use
02/21/2007CN1301178C Ultraviolet laser ablative patterning of microstructures in semiconductors
02/20/2007US7181709 Clock delay adjusting method of semiconductor integrated circuit device and semiconductor integrated circuit device formed by the method
02/20/2007US7181707 Method of setting process parameter and method of setting process parameter and/or design rule
02/20/2007US7181663 Wireless no-touch testing of integrated circuits
02/20/2007US7181549 Semiconductor integrated circuit
02/20/2007US7181355 Automatic quality control method for production line and apparatus therefor as well as automatic quality control program
02/20/2007US7181354 Method and apparatus for data stackification for run-to-run control
02/20/2007US7181306 Enhanced plasma etch process
02/20/2007US7181296 Method of adaptive interactive learning control and a lithographic manufacturing process and apparatus employing such a method
02/20/2007US7181208 Radio-communication-adjustable apparatus, apparatus adjusting method, and apparatus adjusting system
02/20/2007US7181132 Method and system for loading substrate supports into a substrate holder
02/20/2007US7180929 Wafer-level test structure for edge-emitting semiconductor lasers
02/20/2007US7180926 Surface emitting semiconductor laser
02/20/2007US7180924 Semiconductor apparatus and a semiconductor unit, the semiconductor unit including a functional layer including a semiconductor element, and a highly conductive layer
02/20/2007US7180820 Integrated semiconductor memory comprising at least one word line and comprising a multiplicity of memory cells
02/20/2007US7180810 Method of breaking down a fuse in a semiconductor device
02/20/2007US7180802 Method of stress-testing an isolation gate in a dynamic random access memory
02/20/2007US7180796 Boosted voltage generating circuit and semiconductor memory device having the same
02/20/2007US7180789 Semiconductor memory device with MOS transistors, each having a floating gate and a control gate, and memory card including the same
02/20/2007US7180788 Nonvolatile semiconductor memory device
02/20/2007US7180774 Semiconductor integrated circuit device including first, second and third gates
02/20/2007US7180768 Semiconductor memory device including 4TSRAMs
02/20/2007US7180749 Circuit board and its manufacturing method
02/20/2007US7180745 Flip chip heat sink package and method
02/20/2007US7180706 Magnetic heads and semiconductor devices and surface planarization processes for the fabrication thereof
02/20/2007US7180667 Objective with fluoride crystal lenses
02/20/2007US7180586 System for detection of wafer defects
02/20/2007US7180574 Exposure apparatus and method
02/20/2007US7180566 Liquid crystal display device and repairing method thereof
02/20/2007US7180559 Array substrate having color filter on thin film transistor structure for LCD device and method of fabricating the same
02/20/2007US7180393 Device with hybrid microwave circuits shielded by elastic contact members
02/20/2007US7180373 High frequency power amplifier module and semiconductor integrated circuit device
02/20/2007US7180362 Semiconductor device with pump circuit
02/20/2007US7180361 Antifuse programming circuit in which one stage of transistor is interposed in a series with antifuse between power supplies during programming
02/20/2007US7180346 Duty cycle correcting circuits having a variable gain and methods of operating the same
02/20/2007US7180319 Selecting groups of dies for wafer testing
02/20/2007US7180317 High resolution analytical probe station
02/20/2007US7180315 Substrate with patterned conductive layer
02/20/2007US7180312 Probe card and method for manufacturing probe card
02/20/2007US7180283 Wafer lifting device
02/20/2007US7180237 Active matrix substrate, free of a spacer layer in a pixel region
02/20/2007US7180236 Flat panel display and fabrication method thereof
02/20/2007US7180227 Piezoelectric o-ring transducer
02/20/2007US7180198 Method of fabricating polycrystalline silicon and switching device using polycrystalline silicon
02/20/2007US7180197 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
02/20/2007US7180196 Semiconductor device mounting method, semiconductor device mounting structure, electro-optical device, electro-optical device manufacturing method and electronic device
02/20/2007US7180195 Method and apparatus for improved power routing
02/20/2007US7180194 Semiconductor device with multi-staged cut side surfaces
02/20/2007US7180193 Via recess in underlying conductive line
02/20/2007US7180192 Semiconductor device
02/20/2007US7180191 Semiconductor device and method of manufacturing a semiconductor device
02/20/2007US7180190 Electrode line structure having fine line width and method of forming the same
02/20/2007US7180188 Contact structure of semiconductor devices and method of fabricating the same
02/20/2007US7180187 Interlayer connector for preventing delamination of semiconductor device
02/20/2007US7180186 Ball grid array package
02/20/2007US7180185 Semiconductor device with connections for bump electrodes
02/20/2007US7180184 Conductive bump for semiconductor device and method for making the same
02/20/2007US7180183 Semiconductor device with reinforced under-support structure and method of fabricating the same
02/20/2007US7180182 Semiconductor component
02/20/2007US7180181 Mesh shaped dam mounted on a substrate
02/20/2007US7180180 Stacked device underfill and a method of fabrication
02/20/2007US7180178 Semiconductor heat-dissipating substrate, and manufacturing method and package therefor
02/20/2007US7180168 Stacked semiconductor chips