| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/01/2007 | DE112005000785T5 Verfahren zur Herstellung einer Licht-absorbierenden Schicht für eine Dünnschichtsolarzelle des Chalkopyrittyps A method of manufacturing a light-absorbing layer for a thin film solar cell of the chalcopyrite |
| 03/01/2007 | DE112005000352T5 Integrierte III-Nitrid-Leistungsanordnungen Integrated III-nitride power devices |
| 03/01/2007 | DE10335182B4 Anordnung zur Verbesserung der Modulzuverlässigkeit Arrangement for improving the reliability module |
| 03/01/2007 | DE10328842B4 Suszeptor für eine chemische Gasphasenabscheidung, Verfahren zur Bearbeitung einer Halbleiterscheibe durch chemische Gasphasenabscheidung und nach dem Verfahren bearbeitete Halbleiterscheibe Susceptor for a chemical vapor deposition method for processing a semiconductor wafer by chemical vapor deposition and by the process machined wafer |
| 03/01/2007 | DE10308842B4 Vorrichtung zum Greifen einer Vielzahl von Substraten Device for gripping a plurality of substrates |
| 03/01/2007 | DE10258420B4 Verfahren zur Herstellung einer Halbleiterspeichereinrichtung mit Charge-trapping-Speicherzellen und vergrabenen Bitleitungen A method of manufacturing a semiconductor memory device with charge-trapping memory cells and bit lines buried |
| 03/01/2007 | DE10208904B4 Verfahren zur Herstellung unterschiedlicher Silicidbereiche auf verschiedenen Silicium enthaltenden Gebieten in einem Halbleiterelement A process for the production of different silicide containing silicon in various areas in a semiconductor element |
| 03/01/2007 | DE10208754B4 Polymermaterial mit niedriger Glastemperatur für die Anwendung in chemisch verstärkten Fotoresists für die Halbleiterfertigung Polymer material having a low glass transition temperature for use in chemically amplified resists for semiconductor fabrication |
| 03/01/2007 | DE102006042634A1 Method of increasing transmission of an optical element applies dummy radiation until a temporarily reduced transmission increases again and applies dummy radiation again until there is no linear increase |
| 03/01/2007 | DE102006032730A1 Production unit for semiconductor device and devices has chip test section, information memory, template printer and print head and chip coordinate recognition section and control section |
| 03/01/2007 | DE102006030633A1 Sockel für ein Prüfgerät Socket for a testing device |
| 03/01/2007 | DE102006021758A1 Thin film transistor array and electrostatic discharge (ESD) protection unit and production method has substrate with display and peripheral regions with image points and top gate thin film transistors |
| 03/01/2007 | DE102005044142B3 Production of electroconductive filling in trench in a semiconductor substrate or layer and a trench capacitor fills trench with silicon and phosphorus and deposits an arsenic monolayer |
| 03/01/2007 | DE102005043557B4 Verfahren zur Herstellung eines Halbleiterbauteils mit Durchkontakten zwischen Oberseite und Rückseite A process for producing a semiconductor device with vias between the upper side and back |
| 03/01/2007 | DE102005041643A1 Semiconductor method for producing an isolated semiconductor substrate uses a masking layer with holes and an output layer |
| 03/01/2007 | DE102005041322A1 Trench transistor structure, with a field electrode array in the trenches, has a potential fixed for the field electrodes through semiconductor zones |
| 03/01/2007 | DE102005041313A1 Monitoring a metal layer in a semiconductor component automatically runs a sequence of actions during an initial time window |
| 03/01/2007 | DE102005041283A1 Monitoring method for production of linkage structures and contacts in a semiconductor component forms contact lead-throughs in a dielectric layer to link to a test surface |
| 03/01/2007 | DE102005041257A1 Trench transistor structure has trenches of transistor field separated by mesa region and voltage divider electrically connected to a field electrode |
| 03/01/2007 | DE102005041256A1 Trench transistor, e.g. for a semiconductor, has a semiconductor body, a trench structure, an electrode structure, a gate electrode structure and a field electrode structure |
| 03/01/2007 | DE102005041024A1 Vorrichtung und Verfahren zum kontinuierlichen Erzeugen einer fehlerfreien Trägerbahn Apparatus and method for continuously producing a defect-free carrier web |
| 03/01/2007 | DE102005040847A1 Single-poly EPROM chip and production process has source and drain and floating and control gates and an additional gate electrically connected to the control gate but insulated from the floating gate |
| 03/01/2007 | DE102005040557A1 Integrated memory circuit for storing information has a memory cell to link to a read-write unit, a reference potential and a resistive connection |
| 03/01/2007 | DE102005040343A1 Wire saw for cutting glass has device for presetting water content of gas surrounding at least part of slurry |
| 03/01/2007 | DE102005039667A1 Producing a low aspect ratio structure and buried strap for a trench DRAM forms and fills trench in semiconductor substrate with initial and sacrificial layers and selectively removes especially at sidewalls |
| 03/01/2007 | DE102005039394A1 Verfahren zum Suchen potentieller Fehler eines Layouts einer integrierten Schaltung Method for searching potential failure of a layout of an integrated circuit |
| 03/01/2007 | DE102005038939A1 Halbleiterspeicherbauelement und Herstellungsverfahren The semiconductor memory device and manufacturing method |
| 03/01/2007 | DE102005016519B3 Device for individualizing separating and transporting break sensitive disc substrates arranged in a holder has movable splitter and carrier and a transporter for separated substrates |
| 03/01/2007 | DE102005011708B3 Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages Polyvinylammonium and processes for their preparation and containing this compound acidic solution and method for electrolytically depositing a copper deposit |
| 03/01/2007 | DE102004031111B4 Verfahren zum Herstellen sublithografischer Gate-Strukturen eines Feldeffekttransistoren A method for producing sublithographic gate structures of field effect transistors |
| 03/01/2007 | DE10152202B4 Optimierte Dünnfilmdiffusionssperre aus TaCN für Kupfermetallisierung Optimized thin film diffusion barrier for copper metallization of TaCN |
| 03/01/2007 | DE10116059B4 Lithograph mit bewegter Linse und Verfahren zum Herstellen digitaler Hologramme in einem Speichermedium Lithograph by moving lens and method for producing digital holograms in a storage medium |
| 03/01/2007 | DE10110566B4 Bondinsel mit Stützstruktur in Halbleiterchip Bond island with support structure in semiconductor chip |
| 03/01/2007 | DE10106346B4 Elektronisches Bauteil Electronic component |
| 02/28/2007 | EP1758435A2 Electric outfit room in microwave oven |
| 02/28/2007 | EP1758181A2 Multilayer coatings for environmentally sensitive devices including a plasma protective layer |
| 02/28/2007 | EP1758180A1 Epitaxial wafer having a gallium nitride epitaxial layer deposited on semiconductor substrate |
| 02/28/2007 | EP1758169A2 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same |
| 02/28/2007 | EP1758168A1 Soi substrate and method for producing same |
| 02/28/2007 | EP1758166A2 Interposer and method for producing the same and electronic device |
| 02/28/2007 | EP1758162A1 Adhering apparatus and adhering method |
| 02/28/2007 | EP1758161A1 Substrate storage container and method of positioning the container |
| 02/28/2007 | EP1758160A1 Installation of modular construction for the working of flat substrates |
| 02/28/2007 | EP1758159A2 Process for producing silicon wafer |
| 02/28/2007 | EP1758158A2 Silicon wafer surface defect evaluation method |
| 02/28/2007 | EP1758157A1 Resin paste for die bonding and its use |
| 02/28/2007 | EP1758156A2 Thin film transistor and method of fabricating the same |
| 02/28/2007 | EP1758155A1 Polysilicon thin film transistor and method of fabricating the same |
| 02/28/2007 | EP1758154A1 Silicon wafer manufacturing method and silicon wafer |
| 02/28/2007 | EP1758153A2 Perovskite type capacitor and method of manufacturing the same |
| 02/28/2007 | EP1758152A2 Capacitor and manufacturing method thereof |
| 02/28/2007 | EP1758151A2 Capacitor and manufacturing method thereof |
| 02/28/2007 | EP1758150A2 Capacitor, method of manufacturing the same and its use |
| 02/28/2007 | EP1758126A2 Nanoscale selection circuit |
| 02/28/2007 | EP1757990A1 Resin composition for forming fine pattern and method for forming fine pattern |
| 02/28/2007 | EP1757989A1 Water-soluble resin composition and method of forming pattern therewith |
| 02/28/2007 | EP1757987A1 Antireflective film-forming composition containing vinyl ether compound |
| 02/28/2007 | EP1757986A1 Antireflection film for semiconductor containing condensation type polymer |
| 02/28/2007 | EP1757985A1 Antireflective film containing sulfur atom |
| 02/28/2007 | EP1757717A1 Method to deposit ZnO-based crystalline layer and substrate for it |
| 02/28/2007 | EP1757665A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices |
| 02/28/2007 | EP1757628A1 Lactone copolymer and radiation-sensitive resin composition |
| 02/28/2007 | EP1757371A1 Substrate processing unit and substrate processing apparatus |
| 02/28/2007 | EP1757175A1 Method and apparatus for accurately applying structures to a substrate |
| 02/28/2007 | EP1756949A2 Semiconductor device and method of forming the same |
| 02/28/2007 | EP1756879A2 Power light emitting die package with reflecting lens and the method of making the same |
| 02/28/2007 | EP1756870A1 Transparent contact and method for the production thereof |
| 02/28/2007 | EP1756867A1 Method and system for stacking integrated circuits |
| 02/28/2007 | EP1756866A1 Improved etch method |
| 02/28/2007 | EP1756864A1 Method for making chips and associated support |
| 02/28/2007 | EP1756863A1 Soi disks comprising mems structures and filled isolating trenches having a defined cross-section |
| 02/28/2007 | EP1756862A1 Method for forming suspended transmission line structures in back end of line processing |
| 02/28/2007 | EP1756861A2 Microfabricated miniature grids |
| 02/28/2007 | EP1756860A2 Method of semiconductor fabrication in corporating disposable spacer into elevated source/drain processing |
| 02/28/2007 | EP1756859A2 Metallic air-bridges |
| 02/28/2007 | EP1756858A1 Reduction of cracking in low-k spin-on-dielectric films |
| 02/28/2007 | EP1756857A1 Production method of compound semiconductor device wafer |
| 02/28/2007 | EP1756856A2 PE-ALD OF TaN DIFFUSION BARRIER REGION ON LOW-K MATERIALS |
| 02/28/2007 | EP1756855A1 Manganese doped magnetic semiconductors |
| 02/28/2007 | EP1756854A1 Gallium nitride-based semiconductor stacked structure, production method thereof, and compound semiconductor and light-emitting device each using the stacked structure |
| 02/28/2007 | EP1756817A1 Method for producing a multilayer storage media |
| 02/28/2007 | EP1756627A2 Lens array and method for making same |
| 02/28/2007 | EP1756328A2 System and method for forming multi-component dielectric films |
| 02/28/2007 | EP1756327A1 Methods of making gold nitride |
| 02/28/2007 | EP1756244A1 Cerium oxide abrasive and slurry containing the same |
| 02/28/2007 | EP1673782A4 Mram array with segmented word and bit lines |
| 02/28/2007 | EP1595280B8 Buffer structure for heteroepitaxy on a silicon substrate |
| 02/28/2007 | EP1560949A4 Integrated plating and planarization process and apparatus therefor |
| 02/28/2007 | EP1559133B1 Forced convection assisted rapid thermal furnace |
| 02/28/2007 | EP1532658A4 Conductive etch stop for etching a sacrificial layer |
| 02/28/2007 | EP1520208B1 Mask and manufacturing method using mask |
| 02/28/2007 | EP1470351B1 Gate valve seal assembly |
| 02/28/2007 | EP1454368B1 Method for the production of light emitting diodes |
| 02/28/2007 | EP1404797B1 Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
| 02/28/2007 | EP1393127A4 Backside alignment system and method |
| 02/28/2007 | EP1378002B1 Metal-insulator-metal capacitor in copper |
| 02/28/2007 | EP1371755B1 Method of electroless plating and apparatus for electroless plating |
| 02/28/2007 | EP1368874A4 Electrostatic discharge protection structures for high speed technologies with mixed and ultra-low voltage supplies |
| 02/28/2007 | EP1339496B1 Sample delivery system with laminar mixing for microvolume biosensing |
| 02/28/2007 | EP1303866A4 System and method for improving thin films by gas cluster ion be am processing |