Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2007
02/27/2007US7183216 Methods to form oxide-filled trenches
02/27/2007US7183215 Etching with electrostatically attracted ions
02/27/2007US7183214 High-density plasma (HDP) chemical vapor deposition (CVD) methods and methods of fabricating semiconductor devices employing the same
02/27/2007US7183213 Chemical mechanical polishing pad and chemical mechanical polishing method
02/27/2007US7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
02/27/2007US7183211 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
02/27/2007US7183210 Method for preparing large-size substrate
02/27/2007US7183209 Semiconductor device and manufacturing method thereof
02/27/2007US7183208 Methods for treating pluralities of discrete semiconductor substrates
02/27/2007US7183207 Chemical vapor deposition metallization processes and chemical vapor deposition apparatus used therein
02/27/2007US7183206 Fabrication of semiconductor devices
02/27/2007US7183205 Method of pitch dimension shrinkage
02/27/2007US7183204 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same
02/27/2007US7183203 Method of plating a metal or metal compound on a semiconductor substrate that includes using the same main component in both plating and etching solutions
02/27/2007US7183202 Method of forming metal wiring in a semiconductor device
02/27/2007US7183201 Selective etching of organosilicate films over silicon oxide stop etch layers
02/27/2007US7183200 Method for fabricating a semiconductor device
02/27/2007US7183199 Method of reducing the pattern effect in the CMP process
02/27/2007US7183198 Method for forming a hardmask employing multiple independently formed layers of a capping material to reduce pinholes
02/27/2007US7183197 Water-barrier performance of an encapsulating film
02/27/2007US7183196 Multilayer interconnection board and production method thereof
02/27/2007US7183195 Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler
02/27/2007US7183194 Method of forming socket contacts
02/27/2007US7183193 Integrated device technology using a buried power buss for major device and circuit advantages
02/27/2007US7183192 Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition
02/27/2007US7183191 Method for fabricating a chip scale package using wafer level processing
02/27/2007US7183190 Semiconductor device and fabrication method therefor
02/27/2007US7183189 Semiconductor device, circuit board, and electronic instrument
02/27/2007US7183188 Method for fabricating contact-making connections
02/27/2007US7183187 Integration scheme for using silicided dual work function metal gates
02/27/2007US7183186 Atomic layer deposited ZrTiO4 films
02/27/2007US7183185 Methods of forming transistor gates; and methods of forming programmable read-only memory constructions
02/27/2007US7183184 Method for making a semiconductor device that includes a metal gate electrode
02/27/2007US7183183 Method for using ion implantation to treat the sidewalls of a feature in a low-k dielectric film
02/27/2007US7183182 Method and apparatus for fabricating CMOS field effect transistors
02/27/2007US7183181 Dynamic edge bead removal
02/27/2007US7183180 Method for simultaneous fabrication of a nanocrystal and non-nanocrystal device
02/27/2007US7183179 System and method for hydrogen exfoliation gettering
02/27/2007US7183178 Method of manufacturing semiconductor wafer
02/27/2007US7183177 Silicon-on-insulator wafer transfer method using surface activation plasma immersion ion implantation for wafer-to-wafer adhesion enhancement
02/27/2007US7183176 Method of forming through-wafer interconnects for vertical wafer level packaging
02/27/2007US7183175 Shallow trench isolation structure for strained Si on SiGe
02/27/2007US7183174 Flash memory device and method of manufacturing the same
02/27/2007US7183173 Method for forming isolation film in semiconductor device
02/27/2007US7183172 Method of forming silicon-on-insulator (SOI) semiconductor substrate and SOI semiconductor substrate formed thereby
02/27/2007US7183171 Pyramid-shaped capacitor structure
02/27/2007US7183170 Manufacturing method of semiconductor device
02/27/2007US7183169 Method and arrangement for reducing source/drain resistance with epitaxial growth
02/27/2007US7183168 Method of manufacturing a semiconductor device having a silicide film
02/27/2007US7183167 Semiconductor device having a trench isolation and method of fabricating the same
02/27/2007US7183166 Method for forming oxide on ONO structure
02/27/2007US7183165 Reliable high voltage gate dielectric layers using a dual nitridation process
02/27/2007US7183164 Methods of reducing floating body effect
02/27/2007US7183163 Method of manufacturing an isolation-less, contact-less array of bi-directional read/program non-volatile floating gate memory cells with independent controllable control gates
02/27/2007US7183162 Method of forming non-volatile memory cell using sacrificial pillar spacers and non-volatile memory cell formed according to the method
02/27/2007US7183161 Programming and erasing structure for a floating gate memory cell and method of making
02/27/2007US7183160 Manufacturing process for a flash memory and flash memory thus produced
02/27/2007US7183159 Method of forming an integrated circuit having nanocluster devices and non-nanocluster devices
02/27/2007US7183158 Method of fabricating a non-volatile memory
02/27/2007US7183157 Nonvolatile memory devices
02/27/2007US7183156 Transistor structure, memory cell, DRAM, and method for fabricating a transistor structure in a semiconductor substrate
02/27/2007US7183155 Non-volatile memory device and fabricating method thereof
02/27/2007US7183154 Nonvolatile memory cells having split gate structure and methods of fabricating the same
02/27/2007US7183153 Method of manufacturing self aligned non-volatile memory cells
02/27/2007US7183152 Epitaxially grown fin for FinFET
02/27/2007US7183151 Method for fabricating field effect transistor
02/27/2007US7183150 Resist protect oxide structure of sub-micron salicide process
02/27/2007US7183149 Method of manufacturing field effect transistor
02/27/2007US7183148 Display panel and method for manufacturing the same
02/27/2007US7183147 Light emitting device, method for manufacturing thereof and electronic appliance
02/27/2007US7183146 Method of manufacturing semiconductor device
02/27/2007US7183145 Semiconductor device and manufacturing method thereof
02/27/2007US7183144 Semiconductor device and method of manufacturing the same
02/27/2007US7183143 Method for forming nitrided tunnel oxide layer
02/27/2007US7183142 FinFETs with long gate length at high density
02/27/2007US7183141 Reversible field-programmable electric interconnects
02/27/2007US7183140 Injection molded metal bonding tray for integrated circuit device fabrication
02/27/2007US7183139 Flip-chip system and method of making same
02/27/2007US7183138 Method and apparatus for decoupling conductive portions of a microelectronic device package
02/27/2007US7183137 Method for dicing semiconductor wafers
02/27/2007US7183136 Semiconductor element and method for producing the same
02/27/2007US7183135 Method for manufacturing high-frequency module device
02/27/2007US7183134 Ultrathin leadframe BGA circuit package
02/27/2007US7183133 Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
02/27/2007US7183132 Semiconductor device in a recess of a semiconductor plate
02/27/2007US7183130 Magnetic random access memory and method of fabricating thereof
02/27/2007US7183129 Method for manufacturing CMOS image sensor using spacer etching barrier film
02/27/2007US7183128 Photo mask and semiconductor device manufacturing method
02/27/2007US7183127 Method of manufacturing a semiconductor device
02/27/2007US7183126 Method for forming an optical interfering pattern on a surface of a metal substrate, and article having an optical interfering effect
02/27/2007US7183125 Method for manufacturing surface acoustic wave device
02/27/2007US7183124 Surface mount saw device manufacturing method
02/27/2007US7183123 Method of surface preparation and imaging for integrated circuits
02/27/2007US7183122 Physical nano-machining with a scanning probe system for integrated circuit modification
02/27/2007US7183121 Process for fabrication of a ferrocapacitor
02/27/2007US7183120 Etch-stop material for improved manufacture of magnetic devices
02/27/2007US7183117 Apparatus for measuring characteristics of chemical solution, chemical solution supply apparatus, and method for measuring concentration of chemical solution
02/27/2007US7183037 Overcoating photoresists
02/27/2007US7183025 Phase difference specifying method
02/27/2007US7183007 Dicing adhesive sheet and dicing method