Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2007
03/06/2007US7186574 CMP process metrology test structures
03/06/2007US7186573 Flip FERAM cell and method to form same
03/06/2007US7186572 Simplified bottom electrode-barrier structure for making a ferroelectric capacitor stacked on a contact plug
03/06/2007US7186571 Method of fabricating a compositionally modulated electrode in a magnetic tunnel junction device
03/06/2007US7186570 Method of manufacturing ceramic film, method of manufacturing ferroelectric capacitor, ceramic film, ferroelectric capacitor, and semiconductor device
03/06/2007US7186569 Conductive memory stack with sidewall
03/06/2007US7186496 Light absorbent agent polymer useful for organic anti-reflective coating, its preparation method and organic anti-reflective coating composition comprising the same
03/06/2007US7186488 Semiconductor device manufacturing method and semiconductor device manufacturing system
03/06/2007US7186485 Inspection method and a photomask
03/06/2007US7186484 Method for determining the relative positional accuracy of two structure elements on a wafer
03/06/2007US7186483 Method of determining alignment of a template and a substrate having a liquid disposed therebetween
03/06/2007US7186481 Flare measuring mask and flare measuring method of semiconductor aligner
03/06/2007US7186454 Formed from polymerizable composition of adamantanepolycarboxylic acid and aromatic polyamines dissolved in solvent; heat resistance; semiconductors
03/06/2007US7186448 comprises liquid crystal compounds for fixing a pad for chemical mechanical polishing of semiconductor wafers
03/06/2007US7186446 Plasma enhanced ALD of tantalum nitride and bilayer
03/06/2007US7186385 For semiconductor processing system
03/06/2007US7186380 Transistor and sensors made from molecular materials with electric dipoles
03/06/2007US7186354 Aqueous solution of a triazole compound
03/06/2007US7186349 Fluid ejection device and method of fabricating the same
03/06/2007US7186322 Methods of producing and polishing semiconductor device and polishing apparatus
03/06/2007US7186315 Plasma treatment apparatus
03/06/2007US7186314 Plasma processor and plasma processing method
03/06/2007US7186313 Plasma chamber wall segment temperature control
03/06/2007US7186302 Fabrication of nonpolar indium gallium nitride thin films, heterostructures and devices by metalorganic chemical vapor deposition
03/06/2007US7186299 Method of rinsing and drying semiconductor substrates
03/06/2007US7186298 Wafer support system
03/06/2007US7186297 Wafer holding apparatus
03/06/2007US7186295 Quartz thin film
03/06/2007US7186285 Chemical filter arrangement for a semiconductor manufacturing apparatus
03/06/2007US7186280 Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method
03/06/2007US7186168 Chemical mechanical polishing apparatus and methods for chemical mechanical polishing
03/06/2007US7185992 Lens holding technique
03/06/2007US7185799 Method of creating solder bar connections on electronic packages
03/06/2007US7185764 Wafer shipping device and storage method for preventing fluoridation in bonding pads
03/06/2007US7185760 Non-contact protective packaging for surface-sensitive articles
03/06/2007US7185661 Rotary support to support the substrate and rotate it about a first axis, and a megasonic energy transmitter extending parallel to a surface of the substrate; megasonic transducer coupled to the transmitter, and a reciprocation drive
03/06/2007US7185602 Ion implantation ion source, system and method
03/06/2007US7185428 Method of making a circuitized substrate
03/06/2007US7185426 Method of manufacturing a semiconductor package
03/06/2007US7185423 Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation
03/06/2007US7185422 Part mounting apparatus and part mounting method
03/06/2007US7185384 Wafer cleaning brush
03/06/2007CA2621924A1 Carbon nanotubes for the selective transfer of heat from electronics
03/05/2007WO2007049566A1 Adhesive composition and adhesive film
03/01/2007WO2007025277A2 Methods for dual metal gate complementary metal oxide semiconductor integration
03/01/2007WO2007025199A2 Multi-level cleanspace fabricator elevator system
03/01/2007WO2007025041A2 Microfluidic liquid stream configuration system
03/01/2007WO2007025039A2 Pulsed etching cooling
03/01/2007WO2007024984A2 High performance mosfet comprising a stressed gate metal silicide layer and method of fabricating the same
03/01/2007WO2007024969A1 Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
03/01/2007WO2007024793A2 Printed fuse devices and methods for making the same
03/01/2007WO2007024731A2 Hermetic interconnect structure and method of fabrication
03/01/2007WO2007024730A2 Wafer level hermetic bond using metal alloy
03/01/2007WO2007024720A2 Pretreatment processes within a batch ald reactor
03/01/2007WO2007024714A2 Process for modifying dielectric materials
03/01/2007WO2007024665A1 Single crystal based through the wafer connections
03/01/2007WO2007024575A2 Low-noise semiconductor photodetectors
03/01/2007WO2007024549A2 Semiconductor on glass insulator with deposited barrier layer
03/01/2007WO2007024515A1 Silicon surface preparation
03/01/2007WO2007024493A1 Nitrogen profile engineering in high-k nitridation of a gate dielectric layer
03/01/2007WO2007024470A2 Method for forming a capping layer on a semiconductor device
03/01/2007WO2007024469A2 Crack-free iii-v epitaxy on germanium on insulator (goi) substrates
03/01/2007WO2007024433A2 Method for the manufacture of a strained silicon-on-insulator structure
03/01/2007WO2007024402A2 Method and apparatus for breaking semiconductor wafers
03/01/2007WO2007024341A2 Method of preparing a film layer-by-layer using plasma enhanced atomic layer deposition
03/01/2007WO2007024332A2 An apparatus and method for non-contact assessment of a constituent in semiconductor substrates
03/01/2007WO2007024300A2 Magnetic devices and techniques for formation thereof
03/01/2007WO2007024277A2 Method of transferring a thin crystalline semiconductor layer
03/01/2007WO2007024186A2 Interconnects and heat dissipators based on nanostructures
03/01/2007WO2007024022A1 Semiconductor device manufacturing method, semiconductor device and wafer
03/01/2007WO2007024019A1 Process of making a semiconductor optical lens and a semiconductor optical lens fabricated thereby
03/01/2007WO2007023979A1 Mosfet and production memthod of semiconductor device
03/01/2007WO2007023963A1 Semiconductor device
03/01/2007WO2007023960A1 Porous polymer membrane, method for producing same, and method for manufacturing stamper used for production of same
03/01/2007WO2007023951A1 Substrate processing apparatus and substrate processing method
03/01/2007WO2007023950A1 Semiconductor device manufacturing method
03/01/2007WO2007023947A1 Semiconductor device manufacturing method and semiconductor device
03/01/2007WO2007023911A1 Process for producing semiconductor substrate
03/01/2007WO2007023909A1 DIELECTRIC FILM HAVING ABOx-TYPE PEROVSKITE CRYSTALLINE STRUCTURE, CAPACITOR USING THE DIELECTRIC FILM, AND METHOD AND SYSTEM FOR FORMATION OF DIELECTRIC FILM HAVING ABOx-TYPE PEROVSKITE CRYSTALLINE STRUCTURE
03/01/2007WO2007023908A1 Film-forming material and method of forming pattern
03/01/2007WO2007023884A1 Guide plate for probe card and method of processing the same
03/01/2007WO2007023855A1 Substrate treating device, heating device used therefor, and method of manufacturing semiconductor utilizing the devices
03/01/2007WO2007023851A1 Probe device and method of regulating contact pressure between object to be inspected and probe
03/01/2007WO2007023834A1 Adhesive composition
03/01/2007WO2007023831A1 Ceramic member, ceramic heater, substrate placing mechanism, substrate processing apparatus and method for manufacturing ceramic member
03/01/2007WO2007023813A1 Exposure apparatus, exposure method, and device manufacturing method
03/01/2007WO2007023781A1 Circuit connection structure, method for manufacturing same, and semiconductor substrate for circuit connection structure
03/01/2007WO2007023773A1 Method for manufacturing semiconductor device
03/01/2007WO2007023747A1 Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device
03/01/2007WO2007023746A1 Semiconductor wafer transfer tray
03/01/2007WO2007023743A1 Semiconductor device, method for manufacturing such semiconductor device and substrate for such semiconductor device
03/01/2007WO2007023710A1 Lithographic coated-type underlayer film forming composition containing vinylnaphthalene resin derivative
03/01/2007WO2007023692A1 Electronic component mounting device and method
03/01/2007WO2007023665A1 Projection optical system, exposure apparatus and device manufacturing method
03/01/2007WO2007023648A1 Substrate heating device, coating/development device, and method for heating substrate
03/01/2007WO2007023639A1 Substrate treating apparatus, and for the substrate treating apparatus, method of substrate delivery, program and program storing recording medium
03/01/2007WO2007023614A1 Semiconductor fabrication system, and flow rate correction method and program for semiconductor fabrication system
03/01/2007WO2007023612A1 Thin film transistor
03/01/2007WO2007023580A1 Cleaning device for substrate
03/01/2007WO2007023575A1 Mapping sensor system
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