Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/27/2007US20070224795 Dummy vias for damascene process
09/27/2007US20070224794 Single passivation layer scheme for forming a fuse
09/27/2007US20070224793 Temperature-controlled metallic dry-fill process
09/27/2007US20070224792 Manufacturing method of semiconductor device and etching solution
09/27/2007US20070224791 Wiring material, semiconductor device provided with a wiring using the wiring material and method of manufacturing thereof
09/27/2007US20070224790 Zn ion implanting method of nitride semiconductor
09/27/2007US20070224789 Methods of fabricating silicon-on-insulator substrates having a laser-formed single crystalline film
09/27/2007US20070224788 Fabrication of large grain polycrystalline silicon film by nano aluminum-induced crystallization of amorphous silicon
09/27/2007US20070224787 Relaxed heteroepitaxial layers
09/27/2007US20070224786 Epitaxial semiconductor deposition methods and structures
09/27/2007US20070224785 Strain-inducing film formation by liquid-phase epitaxial re-growth
09/27/2007US20070224784 Semiconductor material having an epitaxial layer formed thereon and methods of making same
09/27/2007US20070224783 Process for forming low defect density, ideal oxygen precipitating silicon
09/27/2007US20070224782 Gettering method and a wafer using the same
09/27/2007US20070224781 Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
09/27/2007US20070224780 Method for dicing a wafer
09/27/2007US20070224779 Method for fabricating a BGA device and BGA device
09/27/2007US20070224778 Method of producing SIMOX wafer
09/27/2007US20070224777 Substrate Holder Having a Fluid Gap and Method of Fabricating the Substrate Holder
09/27/2007US20070224776 Method for forming a 3D interconnect and resulting structures
09/27/2007US20070224775 Trench isolation structure having an expanded portion thereof
09/27/2007US20070224774 Method of producing SIMOX wafer
09/27/2007US20070224773 Method of producing simox wafer
09/27/2007US20070224772 Method for forming a stressor structure
09/27/2007US20070224771 Semiconductor device having fuse and capacitor at the same level and method of fabricating the same
09/27/2007US20070224770 Systems and methods for fabricating self-aligned memory cell
09/27/2007US20070224769 Semiconductor device and manufacturing method thereof
09/27/2007US20070224768 Method and apparatus for delivery of pulsed laser radiation
09/27/2007US20070224767 Semiconductor Device with Recessed Trench and Method of Fabricating the Same
09/27/2007US20070224766 Selective etch for patterning a semiconductor film deposited non-selectively
09/27/2007US20070224765 Methods of fabricating semiconductor devices having a double metal salicide layer
09/27/2007US20070224764 Method for manufacturing insulated-gate type field effect transistor
09/27/2007US20070224763 Semiconductor device and method of manufacturing the same
09/27/2007US20070224762 Method for manufacturing semiconductor device
09/27/2007US20070224761 Semiconductor device and method for fabricating the same
09/27/2007US20070224760 Method for manufacturing semiconductor device
09/27/2007US20070224759 Method for forming an integrated memory device and memory device
09/27/2007US20070224758 Semiconductor memory device and related fabrication method
09/27/2007US20070224757 Offset vertical device
09/27/2007US20070224756 Method for fabricating recessed gate mos transistor device
09/27/2007US20070224755 Semiconductor device manufacturing method including oblique ion implantation process and reticle pattern forming method
09/27/2007US20070224754 Structure and method of three dimensional hybrid orientation technology
09/27/2007US20070224753 Vertical wrap-around-gate field-effect-transistor for high density, low voltage logic and memory array
09/27/2007US20070224752 Laterally diffused metal oxide semiconductor device and method of forming the same
09/27/2007US20070224751 Embedded Non-Volatile Memory Cell With Charge-Trapping Sidewall Spacers
09/27/2007US20070224750 Covert transformation of transistor properties as a circuit protection method
09/27/2007US20070224749 Semiconductor device fabrication method
09/27/2007US20070224748 Semiconductor body comprising a transistor structure and method for producing a transistor structure
09/27/2007US20070224747 System and method for producing a semiconductor circuit arrangement
09/27/2007US20070224746 Method and apparatus providing different gate oxides for different transitors in an integrated circuit
09/27/2007US20070224745 Semiconductor device and fabricating method thereof
09/27/2007US20070224744 Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
09/27/2007US20070224743 Thermal dissipation structures for finfets
09/27/2007US20070224742 E-ink display and method for repairing the same
09/27/2007US20070224741 Semiconductor element, semiconductor device, and method of manufacturing the same
09/27/2007US20070224740 Thin-film transistor and method of fabricating the same
09/27/2007US20070224739 Method for making semiconductor insulated-gate field-effect transistor having multilayer deposited metal source(s) and/or drain(s)
09/27/2007US20070224738 Semiconductor device with a multi-plate isolation structure
09/27/2007US20070224737 Method for creating and tuning Electromagnetic Bandgap structure and device
09/27/2007US20070224736 Nonvolatile semiconductor memory and fabrication method therefor
09/27/2007US20070224735 Optical transmission channel board, board with built-in optical transmission channel, and data processing apparatus
09/27/2007US20070224734 Method for bonding heatsink and semiconductor device with heatsink
09/27/2007US20070224733 Die Bonding
09/27/2007US20070224732 Manufacturing method of a package structure
09/27/2007US20070224731 Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film
09/27/2007US20070224730 Hillock-free aluminum layer and method of forming the same
09/27/2007US20070224729 Method for manufacturing a flip-chip package, substrate for manufacturing and flip-chip assembly
09/27/2007US20070224728 Method for wafer level package of sensor chip
09/27/2007US20070224727 Methods of forming a diamond micro-channel structure and resulting devices
09/27/2007US20070224726 Thin film plate phase change ram circuit and manufacturing method
09/27/2007US20070224725 Substrate processing method and apparatus fabrication process of a semiconductor device
09/27/2007US20070224724 Self aligned memory element and wordline
09/27/2007US20070224723 Solid state imaging device and method for manufacturing solid state imaging device
09/27/2007US20070224722 Indium features on multi-contact chips
09/27/2007US20070224721 Interband cascade detectors
09/27/2007US20070224720 Manufacturing method of suspended microstructure
09/27/2007US20070224719 Method of manufacturing MEMS device package
09/27/2007US20070224718 MEMS fabrication method
09/27/2007US20070224717 Apparatus and method for manufacturing a display device substrate
09/27/2007US20070224716 Methods of coating semiconductor light emitting elements by evaporating solvent from a suspension
09/27/2007US20070224715 Nitride semiconductor based light-emitting device and manufacturing method thereof
09/27/2007US20070224714 Method of Fabricating Light Emitting Device and Thus-Fabricated Light Emitting Device
09/27/2007US20070224713 Method of manufacturing display device using LED chips
09/27/2007US20070224712 Method of monitoring a semiconductor processing system using a wireless sensor network
09/27/2007US20070224711 Doping apparatus, doping method, and method for fabricating thin film transistor
09/27/2007US20070224710 Methods to shape the electric field in electron devices, passivate dislocations and point defects, and enhance the luminescence efficiency of optical devices
09/27/2007US20070224709 Plasma processing method and apparatus, control program and storage medium
09/27/2007US20070224708 Mass pulse sensor and process-gas system and method
09/27/2007US20070224707 Magnetic random access memory, magnetic random access memory manufacturing method, and magnetic random access memory write method
09/27/2007US20070224706 Method of producing semiconductor device and semiconductor device
09/27/2007US20070224550 Photosensitive composition and method for forming pattern using same
09/27/2007US20070224549 Forming a photosensitive layer on a substrate, selectively irradiating the photosensitive layer with at least one of an ultraviolet ray and an ionizing radiation; heat treatment; developing the photosensitive layer to remove irradiated area
09/27/2007US20070224523 a substrate, a reflective layer formed on the substrate, an absorption pattern formed on the reflective layer and over a first portion of the substrate, a compensatory portion which is thinner than pattern, formed over the second portion of the substrate, second portion is adjacent to the first portion
09/27/2007US20070224521 Photomask for forming a resist pattern and manufacturing method thereof, and resist-pattern forming method using the photomask
09/27/2007US20070224511 Wiring parts are formed by utilizing such a conductor formulation, ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
09/27/2007US20070224364 Plasma processing apparatus, plasma processing method, plasma film deposition apparatus, and plasma film deposition method
09/27/2007US20070224103 Supercritical Treatment Method and Apparatus to be Used in the Same
09/27/2007US20070224101 Semiconductor Polishing Composition
09/27/2007US20070223543 Laterally Implanted Electroabsorption Modulated Laser
09/27/2007US20070223342 Substrate Processing Method and Substrate Processing Apparatus