Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/20/2007US20070218577 Liquid crystal display panel and fabricating method thereof
09/20/2007US20070218576 Method for fabricating polysilicon liquid crystal display device
09/20/2007US20070218575 Method and Apparatus for Electroluminescence
09/20/2007US20070218574 Semiconductor laser manufacturing method
09/20/2007US20070218573 Semiconductor component having test pads and method and apparatus for testing same
09/20/2007US20070218572 Fabrication method of semiconductor integrated circuit device
09/20/2007US20070218571 Disabling poorly testing RFID ICs
09/20/2007US20070218570 Nitorgen doped silicon wafer and manufacturing method thereof
09/20/2007US20070218569 Method of manufacturing ferroelectric memory device
09/20/2007US20070218568 Method for manufacturing ferroelectric memory device
09/20/2007US20070218544 Three-dimensional fabrication of biocompatible structures in anatomical shapes and dimensions for tissue engineering and organ replacement
09/20/2007US20070218412 Rinse Solution For Lithography
09/20/2007US20070218399 Resist Pattern Forming Method and Composite Rinse Agent
09/20/2007US20070218373 Low-defect microparticle pattern, dot array pattern, or hole array pattern with less processing steps (no rinsing of by-products) using a silane having a secondary amino group protected by an o-nitrobenzyloxycarbonyl group; quantum dot laser; photonic crystal optical devices; single-electron devices
09/20/2007US20070217896 Substrate treatment apparatus
09/20/2007US20070217462 Nitride semiconductor laser device and method of producing the same
09/20/2007US20070217460 Nitride semiconductor device and process for producing the same
09/20/2007US20070217279 Memory having storage means
09/20/2007US20070217177 Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
09/20/2007US20070217122 Capacitor
09/20/2007US20070217119 Apparatus and Method for Carrying Substrates
09/20/2007US20070216889 Exposure Apparatus, Exposure Method, and Method for Producing Device
09/20/2007US20070216767 Electron Beam Displacement Measuring Method, Electron Beam Displacement Measuring Device, and Electron Beam Recording Apparatus
09/20/2007US20070216490 Method for fabricating quartz-based nanoresonators
09/20/2007US20070216433 Probe For Electric Test
09/20/2007US20070216300 Organic opto-electronic device with environmentally protective barrier
09/20/2007US20070216179 Substrate Holding Device
09/20/2007US20070216042 Methods for manufacturing compound-material wafers and for recycling used donor substrates
09/20/2007US20070216038 Method for producing semiconductor components
09/20/2007US20070216035 Flip-chip type semiconductor device
09/20/2007US20070216031 Formation of oxidation-resistant seed layer for interconnect applications
09/20/2007US20070216025 Device having a contacting structure
09/20/2007US20070216021 Semiconductor Device and Method of Manufacturing Thereof
09/20/2007US20070216015 Integrated Circuit Chip With Electrostatic Discharge Protection Device
09/20/2007US20070216009 Semiconductor Package With Heat Spreader
09/20/2007US20070215994 Connecting a Plurality of Bond Pads and/or Inner Leads With a Single Bond Wire
09/20/2007US20070215987 Method for forming a memory device and memory device
09/20/2007US20070215986 Hard mask layer stack and a method of patterning
09/20/2007US20070215985 Novel chip packaging structure for improving reliability
09/20/2007US20070215984 Formation of a multiple crystal orientation substrate
09/20/2007US20070215982 thick iron-doped GaN film for a semiinsulating substrate having a high resistivity formed by reacting gaseous ferrocene or dimethylferrocene with HCL gas to form an iron chloride; and reacting gaseous nitrogen with gaseous gallium in the presence of the iron chloride entrained in H2
09/20/2007US20070215978 Tuneable semiconductor device
09/20/2007US20070215976 Integrated passive device substrates
09/20/2007US20070215975 Method of fabricating semiconductor device
09/20/2007US20070215969 Electro-optical device and electronic apparatus
09/20/2007US20070215964 Capacitive micromachined ultrasonic transducer (CMUT) with varying thickness membrane
09/20/2007US20070215960 Methods for Fabrication of Positional and Compositionally Controlled Nanostructures on Substrate
09/20/2007US20070215958 Semiconductor device and method of manufacturing the same
09/20/2007US20070215951 Semiconductor devices having silicided electrodes
09/20/2007US20070215941 Semiconductor-On-Insulator Substrate Comprising A Buried Diamond-Like Carbon Layer And Method For Making Same
09/20/2007US20070215916 Semiconductor device and manufacturing method thereof
09/20/2007US20070215915 Multi-step gate structure and method for preparing the same
09/20/2007US20070215911 Magnetic tunnel junction patterning using Ta/TaN as hard mask
09/20/2007US20070215905 Compound Semiconductor Epitaxial Substrate and Process for Producing the Same
09/20/2007US20070215901 Group III-V nitride-based semiconductor substrate and method of fabricating the same
09/20/2007US20070215894 Insulation structure for high temperature conditions and manufacturing method thereof
09/20/2007US20070215886 Compound Semiconductor Light-Emitting Device And Production Method Thereof
09/20/2007US20070215877 Crystallization method, thin film transistor manufacturing method, thin film transistor, display, and semiconductor device
09/20/2007US20070215853 Multi-layer phase-changeable memory devices and methods of fabricating the same
09/20/2007US20070215852 Manufacturing method for pipe-shaped electrode phase change memory
09/20/2007US20070215820 Methods and systems for thermal-based laser processing a multi-material device
09/20/2007US20070215803 Method and an apparatus of an inspection system using an electron beam
09/20/2007US20070215572 Substrate processing method and substrate processing apparatus
09/20/2007US20070215516 Substrate Storage Container And Positioning Method Of The Same
09/20/2007US20070215481 In-situ cleaning processes for semiconductor electroplating electrodes
09/20/2007US20070215454 Method for Oxidizing Substance and Oxidation Apparatus Therefor
09/20/2007US20070215435 Production System
09/20/2007US20070215284 Plasma processing apparatus and electrode assembly for plasma processing apparatus
09/20/2007US20070215283 Lightweight, more stable formulation to suppress a blast anddispersion of a radioactive material-containing device usedin an atgreater expansion ratio tack of terrorism; cellulose ether, two anionic surfactants, foaming agent, foam stabilizer, solvent, and alcohol; logistics; expansion ratio > AFC-380
09/20/2007US20070215282 Plasma processing apparatus
09/20/2007US20070215281 Rupture resistant plasma tube
09/20/2007US20070215280 Semiconductor surface processing
09/20/2007US20070215279 Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
09/20/2007US20070215278 Plasma etching apparatus and method for forming inner wall of plasma processing chamber
09/20/2007US20070214875 Cantilever and cantilever manufacturing method
09/20/2007US20070214728 Method of polishing a tungsten-containing substrate
09/20/2007US20070214620 Substrate processing apparatus and substrate processing method
09/20/2007US20070214599 Exhaust Gas Treatment
09/20/2007DE4441542B4 SOI-Halbleitervorrichtung mit Inselbereichen und Verfahren zu deren Herstellung SOI semiconductor device having island regions and processes for their preparation
09/20/2007DE19621487B4 Verfahren zur Herstellung von T-förmigen Gate-Elektroden Process for the preparation of T-shaped gate electrode
09/20/2007DE112005002397T5 Nicht-planare Einrichtung mit verjüngtem unteren Körperabschnitt und Verfahren zur Herstellung Non-planar device having a tapered lower body portion and methods for preparing
09/20/2007DE112005002350T5 Ein Verfahren zur Herstellung eines Halbleiterbauelements mit High-k-Gate-Dielektrikumschicht und Silizid-Gate-Elektrode A method of manufacturing a semiconductor device with high-k gate dielectric layer and silicide gate electrode
09/20/2007DE10347119B4 Beschichtungsvorrichtung, Beschichtungsverfahren und beschichtetes Objekt A coating apparatus, coating method and coated object
09/20/2007DE10238797B4 Kommutierfeste Diode und Verfahren zu ihrer Herstellung Kommutierfeste diode and methods for their preparation
09/20/2007DE10202881B4 Verfahren zur Herstellung von Halbleiterchips mit einer Chipkantenschutzschicht, insondere für Wafer Level Packaging Chips Method for manufacturing semiconductor chips with a chip edge protection layer, insondere for wafer level packaging chips
09/20/2007DE102007010884A1 Semiconductor component circuit manufacturing method, involves arranging trenches in semiconductor body, and producing electrode of electrode structures and gate electrode of transistor structure by common procedure
09/20/2007DE102006056811A1 Heizvorrichtung für Halbleiterchargen Heating apparatus for semiconductor batches
09/20/2007DE102006055621A1 System zum Herstellen einer Flüssigkristalldisplaytafel sowie Flüssigkristalldisplaytafel unter Verwendung desselben Of the same system for producing a liquid crystal display panel and liquid crystal display panel using
09/20/2007DE102006043357A1 Photoempfindliche, hitzehärtbare Harzzusammensetzung, mit einem mit Resistfilm überzogene, geglättete, gedruckte Schaltungsplatine und Verfahren zu ihrer Herstellung A photosensitive thermosetting resin composition, with a resist film coated, smoothed, and printed circuit board processes for their preparation
09/20/2007DE102006012755A1 Verfahren zur Herstellung von Halbleiterbauelementen Process for the preparation of semiconductor devices
09/20/2007DE102006012738A1 Nutzen aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren und Moldform zur Herstellung desselben Of the same benefits of a composite plate with semiconductor chips and plastic housing composition and method for the production and Moldform
09/20/2007DE102006012600A1 Elektronisches Bauelement, elektronische Baugruppe sowie Verfahren zur Herstellung einer elektronischen Baugruppe An electronic component, electronic assembly and methods of making an electronic assembly
09/20/2007DE102006012447A1 Halbleiterkörper mit einer Transistorstruktur und Verfahren zur Herstellung einer Transistorstruktur Semiconductor body having a transistor structure and method of making a transistor structure
09/20/2007DE102006012369A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einer metallischen Steuerelektrode und Halbleiterbauelement A process for producing a semiconductor device having a metal gate electrode and the semiconductor component
09/20/2007DE102006011743A1 Peltier module manufacture method involves connecting Peltier components or chips to contact areas on ceramic substrates by means of terminal surfaces during production process, in which contact areas have metallic or sinter layers
09/20/2007DE102006011708A1 Polykristalliner Widerstand und Verfahren zu dessen Herstellung A polycrystalline resistor and method of manufacture
09/20/2007DE102006011706A1 Semiconductor component e.g. static RAM, testing method, involves transmitting test-signal applied to terminal of component to another terminal of component instead of switching core during test operating mode of component
09/20/2007DE102006011697A1 Integrierte Halbleiterbauelementeanordnung und Verfahren zu deren Herstellung Integrated semiconductor device assembly and method for their preparation
09/20/2007DE102006011240A1 Bipolartransistor und Verfahren zum Herstellen eines Bipolartransistors Bipolar transistor and method for producing a bipolar transistor
09/20/2007DE102006010733A1 Layer arrangement, has support layer arranged on substrate side and exhibiting top layer and balancing layer that is arranged between top layer and substrate, where top layer exhibits same coefficient of thermal expansion as substrate