Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/26/2007EP1838141A1 Laminated body and method for producing the same
09/26/2007EP1837915A2 Semiconductors
09/26/2007EP1837913A2 Display apparatus and method of manufacturing thereof
09/26/2007EP1837910A1 Integrated-circuit chip with offset external contacts and method of manufacturing such a chip.
09/26/2007EP1837906A2 Semiconductor memory device and methods of manufacturing and operating the same
09/26/2007EP1837905A2 Interconnect structure having cavities in its dielectric portion
09/26/2007EP1837904A2 Method for manufacturing buried insulating layer type single crystal silicon carbide substrate and corresponding manufacturing device
09/26/2007EP1837903A2 Metal polishing slurry
09/26/2007EP1837902A2 Use of organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
09/26/2007EP1837901A1 Process for producing abrasive material, abrasive material produced by the same, and process for producing silicon wafer
09/26/2007EP1837900A2 Nonvolatile semiconductor memory device
09/26/2007EP1837899A2 Relaxed heteroepitaxial layers
09/26/2007EP1837898A2 Method of manufacturing fine features for thin film transistors
09/26/2007EP1837896A1 Substrate holding apparatus, exposure apparatus and device manufacturing method
09/26/2007EP1837895A1 Optical integrator, illumination optical device, photolithograph, photolithography, and method for fabricating device
09/26/2007EP1837894A1 Process liquid supply system, process liquid supply method, and storage medium
09/26/2007EP1837706A1 Resist composition, method for forming resist pattern, and semiconductor device and method for manufacturing the same
09/26/2007EP1837393A2 Cleaning solution for substrate for use in semiconductor device and cleaning method using the same
09/26/2007EP1837318A2 Aluminium nitride sintered body, member for semiconductor manufacturing device, and method of manufacturing aluminum nitride sintered body
09/26/2007EP1837317A2 Electrostatic chuck and manufacturing method thereof
09/26/2007EP1837122A2 Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control
09/26/2007EP1837086A2 Low dielectric materials and methods for making same
09/26/2007EP1836736A2 Process and photovoltaic device using an akali-containing layer
09/26/2007EP1836732A2 METHOD OF FORMING HfSiN METAL FOR n-FET APPLICATIONS
09/26/2007EP1836728A2 Systems and methods for removing operating heat from a light emitting diode
09/26/2007EP1836727A1 Thin film transistor array devices
09/26/2007EP1836726A1 Interconnect structures with encasing cap and methods of making thereof
09/26/2007EP1836725A1 Method for selective etching
09/26/2007EP1836723A2 System and methods for producing light emitting diode array
09/26/2007EP1836722A2 Electronic device including a guest material within a layer and a process for forming the same
09/26/2007EP1836535A1 Non-aqueous, non-corrosive microelectronic cleaning compositions
09/26/2007EP1836526A1 Capacitive junction modulator, capacitive junction and method for making same
09/26/2007EP1692457A4 Implantable pressure sensors
09/26/2007EP1597194A4 Templated cluster assembled wires
09/26/2007EP1540720A4 A semiconductor device and method of fabricating a semiconductor device
09/26/2007EP1535312B1 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor
09/26/2007EP1444549A4 Method of patterning electrically conductive polymers
09/26/2007EP1419521B1 Xe preamorphizing implantation
09/26/2007EP1402542B1 Passivating overcoat bilayer
09/26/2007EP1309820B1 Automatic refill system for ultra pure or contamination sensitive chemicals
09/26/2007EP1299900A4 METHOD FOR ACHIEVING IMPROVED EPITAXY QUALITY (SURFACE TEXTURE AND DEFECT DENSITY) ON FREE-STANDING (ALUMINUM, INDIUM, GALLIUM) NITRIDE ((Al,In,Ga)N) SUBSTRATES FOR OPTO-ELECTRONIC AND ELECTRONIC DEVICES
09/26/2007EP1284019B1 Semiconductor power component
09/26/2007EP1281200B1 Method of making a semiconductor device having a recessed insulating layer of varying thickness
09/26/2007EP1218264A4 Transport module with latching door
09/26/2007EP1093667B1 Method of manufacturing a semiconductor device comprising a field effect transistor
09/26/2007EP1029109B1 Long life high temperature process chamber
09/26/2007EP0999013B1 Polishing grinding wheel and substrate polishing method with this grinding wheel
09/26/2007CN200953716Y Fixing element
09/26/2007CN200953343Y Chip clamping base and applying device thereof
09/26/2007CN200953342Y Improved semiconductor machine
09/26/2007CN200953336Y Indirect heating cathode fixing device in long-life ion source
09/26/2007CN200953093Y Airflow control system
09/26/2007CN101044631A A damascene copper wiring image sensor
09/26/2007CN101044628A Method of forming a transistor having a dual layer dielectric
09/26/2007CN101044627A 半导体器件 Semiconductor devices
09/26/2007CN101044626A Method for forming gate insulating film, semiconductor device and computer recording medium
09/26/2007CN101044625A Method of forming a solution processed transistor having a multilayer dielectric
09/26/2007CN101044621A Silicon-on-insulator semiconductor device with silicon layers having different crystal orientations and method of forming the silicon-on-insulator semiconductor device
09/26/2007CN101044619A Substrate with electric contacts and method of manufacturing the same
09/26/2007CN101044618A Device and method for fabricating double-sided soi wafer scale package with through via connections
09/26/2007CN101044616A Method of grinding multilayer body and method of manufacturing solid state image pickup device
09/26/2007CN101044615A Dram cells with vertical u-shaped transistor
09/26/2007CN101044614A Semiconductor device including semiconductor regions having differently strained channel regions and a method of manufacturing the same
09/26/2007CN101044613A Manufacturing method of semiconductor devices
09/26/2007CN101044612A Electromigration control
09/26/2007CN101044611A Method for manufacturing a silicon-on-insulator (soi) wafer with an etch stop layer
09/26/2007CN101044610A Method of detaching a thin semiconductor circuit from its base
09/26/2007CN101044609A Methods of forming lead free solder bumps and related structures
09/26/2007CN101044608A Metal-oxide-semiconductor device with a doped titanate body
09/26/2007CN101044607A Self-aligned epitaxially grown bipolar transistor
09/26/2007CN101044606A Compounds for myocardial perfusion imaging
09/26/2007CN101044605A Semiconductor device and its making method
09/26/2007CN101044604A Novel polyorganosiloxane dielectric materials
09/26/2007CN101044603A 等离子体cvd装置 Plasma cvd device
09/26/2007CN101044602A Using ozone to process wafer like objects
09/26/2007CN101044601A Method and system for substrate temperature profile control
09/26/2007CN101044600A Cmp composition comprising surfactant
09/26/2007CN101044599A Method for forming a photoresist pattern
09/26/2007CN101044598A Hdp-cvd multistep gapfill process
09/26/2007CN101044597A Laser irradiation method, laser irradiation apparatus, and manufacturing method of semiconductor device
09/26/2007CN101044596A Method for integrated circuit fabrication using pitch multiplication
09/26/2007CN101044595A 掩模材料转化 Mask material transformation
09/26/2007CN101044594A Substrate processing method, exposure apparatus, and method for producing device
09/26/2007CN101044593A Exposure apparatus, exposure method, and device producing method
09/26/2007CN101044592A Packaging decie and forming method thereof
09/26/2007CN101044435A Photosensitive composition removing liquid
09/26/2007CN101044262A Remote chamber methods for removing surface deposits
09/26/2007CN101044261A Process for formation of copper-containing film
09/26/2007CN101044259A Plasma sputtering film deposition method and equipment
09/26/2007CN101044258A Plasma sputtering film deposition method and equipment
09/26/2007CN101044220A Metal ion-containing cmp composition and method for using the same
09/26/2007CN101044185A Photosensitive compositions based on polycyclic polymers
09/26/2007CN101043794A Circuit device mounting method and press device
09/26/2007CN101043784A Hybrid plasma reactor
09/26/2007CN101043767A 加热装置 Heating device
09/26/2007CN101043766A 加热装置及其制造方法 Heating device and manufacturing method
09/26/2007CN101043067A Method for fabricating a pillar-shaped phase change memory element
09/26/2007CN101043056A Nonvolatile memory device and method of forming the same
09/26/2007CN101043055A Method for producing field effect transistor and semiconductor structure
09/26/2007CN101043054A Semiconductor device and method of manufacturing the same
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