Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/19/2007CN101038895A Gallium nitride substrate and methods for testing and manufacturing it
09/19/2007CN101038894A Method of manufacturing semiconductor device
09/19/2007CN101038893A Methods for making a nonvolatile memory device comprising a shunt silicon layer
09/19/2007CN101038892A Knife scraping method glass passivation process for silicon current rectifier
09/19/2007CN101038891A Manufacturing method of semiconductor device
09/19/2007CN101038890A Method for manufacturing compound material wafers and method for recycling a used donor substrate
09/19/2007CN101038889A Substrate table and substrate processing apparatus
09/19/2007CN101038888A Mounting apparatus
09/19/2007CN101038887A Method for manufacturing substrate of embedded element
09/19/2007CN101038886A Method for manufacturing substrate of embedded element
09/19/2007CN101038885A Method for manufacturing substrate of embedded element
09/19/2007CN101038884A Photoelectric sensor and detector terminal module therefor
09/19/2007CN101038883A Method of manufacturing wafer level stack package
09/19/2007CN101038882A Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device
09/19/2007CN101038881A Method for manufacturing substrate
09/19/2007CN101038880A Method for manufacturing substrate
09/19/2007CN101038879A Semiconductor device and method of manufacturing the same
09/19/2007CN101038878A Method for producing semiconductor device
09/19/2007CN101038877A Fully silicided extrinsic base transistor
09/19/2007CN101038876A Method for preparing NiSi/Si Schottky diode using interface oxide layer
09/19/2007CN101038875A Process for etching openings in dielectric layer
09/19/2007CN101038874A Method for forming silicon oxide film and for manufacturing capacitor and semiconductor device
09/19/2007CN101038873A Method for manufacturing semiconductor device
09/19/2007CN101038872A Plasma etching method and computer-readable storage medium
09/19/2007CN101038871A Surface treatment method of compound semiconductor substrate and fabrication method of compound semiconductor
09/19/2007CN101038870A Method for manufacturing grid structure of semiconductor device
09/19/2007CN101038869A Water-cooling plasma shower
09/19/2007CN101038868A Method for crystallizing a semiconductor thin film
09/19/2007CN101038867A Method for crystallizing a semiconductor thin film
09/19/2007CN101038866A Method for growing wide spectrum indium arsenide/aluminium gallium arsenide quantum point material
09/19/2007CN101038865A A method of fabricating a thin film
09/19/2007CN101038864A Piezoresistance element and semiconductor device having the same
09/19/2007CN101038863A Method and apparatus for processing workpiece
09/19/2007CN101038862A Light irradiation apparatus, light irradiation method, crystallization apparatus, crystallization method, and semiconductor device
09/19/2007CN101038861A Plasma etching method and computer-readable storage medium
09/19/2007CN101038860A Plasma processing apparatus and method
09/19/2007CN101038859A Plasma processing apparatus and electrode used therein
09/19/2007CN101038858A Substrate buffer device, method of buffering substrate, substrate processing apraratus and computer readable storage medium
09/19/2007CN101038857A Method for manufacturing semiconductor device
09/19/2007CN101038856A Enclosed infrared heating device for semiconductor chip
09/19/2007CN101038851A High voltage automatic discharge device for ion implanter
09/19/2007CN101038850A Ion implantation high temperature target
09/19/2007CN101038849A Plasma processing apparatus, plasma processing method and focus ring
09/19/2007CN101038797A Large power thick film circuit resistance paste of stainless steel substrate and preparing method thereof
09/19/2007CN101038448A Substrate processing method
09/19/2007CN101038446A Lithographic apparatus and device manufacturing method
09/19/2007CN101038445A Pattern forming method and gray-tone mask manufacturing method
09/19/2007CN101038444A System and method for moving a component through a setpoint profile, lithographic apparatus and device manufacturing method
09/19/2007CN101038443A Lithographic apparatus, control system and device manufacturing method
09/19/2007CN101038442A Lithographic apparatus and device manufacturing method
09/19/2007CN101038441A Projection process
09/19/2007CN101038439A Photosensitive silane coupling agent, method of modifying surface, method of forming pattern, and method of fabricating device
09/19/2007CN101038436A Photosensitive silane coupling agent, method of forming pattern, and method of fabricating device
09/19/2007CN101038435A Wafer lithography mask, its manufacturing method and wafer photolithography method
09/19/2007CN101038319A Method of inspecting quiescent power supply current in semiconductor integrated circuit and device for executing the method
09/19/2007CN101038302A Probe card, method of designing the probe card, and method of testing semiconductor chips using the probe card
09/19/2007CN101038260A 基板检查装置 Substrate inspection device
09/19/2007CN101038005A 螺栓和半导体制造装置 A bolt and a semiconductor manufacturing apparatus
09/19/2007CN101037807A Gan crystal substrate and method of manufacturing the same, and method of manufacturing semiconductor device
09/19/2007CN101037645A Aqueous clean combination for cleaning flat grinding mat of chemical machinery
09/19/2007CN101037586A Polishing fluid and method of polishing
09/19/2007CN101037585A Polishing fluid and polishing method
09/19/2007CN101037581A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037573A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037572A Adhesive, method of connecting wiring terminals and wiring structure
09/19/2007CN101037186A MEMS automatic leading interlinking equipment based on zoom microscope location
09/19/2007CN100338817C Substrate having microstrip line structure, semiconductor device having microstrip line structure, and manufacturing method of substrate having microstrip line structure
09/19/2007CN100338790C Method for preparing InGaAlN thin film on silicon bulk
09/19/2007CN100338781C Semiconductor device and its producing method
09/19/2007CN100338779C UMOSFET device and method of making the same
09/19/2007CN100338778C Field effect transistor and method of its manufacture
09/19/2007CN100338777C Magnetic storage device using ferromagnetic tunnel junction element
09/19/2007CN100338776C 铁电门器件 Rail switches devices
09/19/2007CN100338775C Nonvolatile semiconductor memory for storage multiple-valued data in single storage unit
09/19/2007CN100338773C 开关电路装置 Switching circuit device
09/19/2007CN100338768C Lead frame and method for producing semiconductor device using said lead frame
09/19/2007CN100338763C Semiconductor module and mfg. method thereof
09/19/2007CN100338762C DRAM with vertical transistor and trench capacitor memory cells and method of fabrication
09/19/2007CN100338761C Method of manufacturing a layer sequence and a method of manufacturing an integrated circuit
09/19/2007CN100338760C Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
09/19/2007CN100338759C Method for forming capacitor and capacitor
09/19/2007CN100338758C Method for mfg. selective local self-aligned silicide
09/19/2007CN100338757C Method for preparing copper conductor for plane display substrate
09/19/2007CN100338756C Method for fabricating semiconductor device
09/19/2007CN100338755C Method of preventing bridge between polycrystalline micro-scale features
09/19/2007CN100338754C Flip chip bonder and method therefor
09/19/2007CN100338753C Device and method for nondestructive inspection on semiconductor device
09/19/2007CN100338752C Wafer and method for estimating carrier concentration thereof
09/19/2007CN100338751C 半导体装置 Semiconductor device
09/19/2007CN100338750C Device with electrodes for forming wire balls at wire terminals
09/19/2007CN100338749C Method of manufacturing an electronic device, and electronic device
09/19/2007CN100338748C Tape coiling and process for making it
09/19/2007CN100338747C Vertical carbon nanotube field effect transistor
09/19/2007CN100338746C Method for forming conductive bolt
09/19/2007CN100338745C Capacitor dielectric layer structure and method for making same
09/19/2007CN100338744C Method and device for forming oxide film
09/19/2007CN100338743C Semiconductor device and mfg. method thereof
09/19/2007CN100338742C Method for increasing evenness of etching channels in semiconductor
09/19/2007CN100338741C Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
09/19/2007CN100338740C Resist removing apparatus and method of removing resist
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