Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/04/2007US20070232030 Semiconductor-wafer processing method using fluid-like layer
10/04/2007US20070232029 Method of Three-Dimensional Microfabrication and High-Density Three-Dimensional Fine Structure
10/04/2007US20070232028 Method of manufacturing silicon nanowires using porous glass template and device comprising silicon nanowires formed by the same
10/04/2007US20070232027 Lead cutter and method of fabricating semiconductor device
10/04/2007US20070232026 Methods and materials useful for chip stacking, chip and wafer bonding
10/04/2007US20070232025 Process for the transfer of a thin film
10/04/2007US20070232024 Singulating Surface-Mountable Semiconductor Devices and Fitting External Contacts to Said Devices
10/04/2007US20070232023 Room temperature metal direct bonding
10/04/2007US20070232022 Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
10/04/2007US20070232021 Method for Forming Isolation Layer in Semiconductor Device
10/04/2007US20070232020 Hybrid-orientation technology buried n-well design
10/04/2007US20070232019 Method for forming isolation structure in nonvolatile memory device
10/04/2007US20070232018 Method for Manufacturing Compound Semiconductor Substrated with Pn Junction
10/04/2007US20070232017 Thin film capacitor and fabrication method thereof
10/04/2007US20070232016 Semiconductor device and manufacturing method of the same
10/04/2007US20070232015 Contact for memory cell
10/04/2007US20070232014 Method of fabricating a planar MIM capacitor
10/04/2007US20070232013 Methods of forming semiconductor constructions
10/04/2007US20070232012 Solid electrolytic capacitor
10/04/2007US20070232011 Method of forming an active semiconductor device over a passive device and semiconductor component thereof
10/04/2007US20070232010 Method for fabricating a junction varactor with high q factor
10/04/2007US20070232009 System and method for wafer handling in semiconductor process tools
10/04/2007US20070232008 Semiconductor device and hetero-junction bipolar transistor
10/04/2007US20070232007 Nanowire transistor with surrounding gate
10/04/2007US20070232006 Method for forming embedded strained drain/source regions based on a combined spacer and cavity etch process
10/04/2007US20070232005 Semiconductor device and manufacturing method thereof
10/04/2007US20070232004 Semiconductor device and manufacturing method thereof
10/04/2007US20070232003 Planar Dual Gate Semiconductor Device
10/04/2007US20070232002 Static random access memory using independent double gate transistors
10/04/2007US20070232001 Method for fabricating high voltage semiconductor device
10/04/2007US20070232000 Fabricating method of a non-volatile memory
10/04/2007US20070231999 High performance transistor with a highly stressed channel
10/04/2007US20070231998 Method for preparing a capacitor structure of a semiconductor memory
10/04/2007US20070231997 Stacked multi-gate transistor design and method of fabrication
10/04/2007US20070231996 Plasma display panel
10/04/2007US20070231995 Terraced film stack
10/04/2007US20070231994 Semiconductor device and fabrication method therefor
10/04/2007US20070231993 Damascene interconnection having porous low k layer with a hard mask reduced in thickness
10/04/2007US20070231992 Method of removing residue from a substrate
10/04/2007US20070231991 Semiconductor memory device and method of operating a semiconductor memory device
10/04/2007US20070231990 Cmos (complementary metal oxide semiconductor) technology
10/04/2007US20070231989 Methods of fabricating nonvolatile memory devices
10/04/2007US20070231988 Method of fabricating nanowire memory device and system of controlling nanowire formation used in the same
10/04/2007US20070231987 Fin device with capacitor integrated under gate electrode
10/04/2007US20070231986 Method of manufacturing flash memory device
10/04/2007US20070231985 Grown nanofin transistors
10/04/2007US20070231984 Uniform silicide metal on epitaxially grown source and drain regions of three-dimensional transistors
10/04/2007US20070231983 Epitaxial silicon germanium for reduced contact resistance in field-effect transistors
10/04/2007US20070231982 Thin film transistor substrate and manufacturing method thereof
10/04/2007US20070231981 Patterning a Plurality of Fields on a Substrate to Compensate for Differing Evaporation Times
10/04/2007US20070231980 Etched nanofin transistors
10/04/2007US20070231979 Silicon device on si: c-oi and sgoi and method of manufacture
10/04/2007US20070231978 Nitride semiconductor device and manufacturing method thereof
10/04/2007US20070231977 Method of fabricating thin film transistor
10/04/2007US20070231976 Method for fabricating a semiconductor device
10/04/2007US20070231975 Reflow method, pattern generating method, and fabrication method for TFT for LCD
10/04/2007US20070231974 Thin film transistor having copper line and fabricating method thereof
10/04/2007US20070231973 Reverse conducting IGBT with vertical carrier lifetime adjustment
10/04/2007US20070231972 Manufacture of programmable crossbar signal processor
10/04/2007US20070231971 Methods of Packaging Using Fluid Resin
10/04/2007US20070231970 Cured mold compound spacer for stacked-die package
10/04/2007US20070231969 Covered devices in a semicoductor package
10/04/2007US20070231968 Method for Producing an Electronic Circuit
10/04/2007US20070231967 Coated thermal interface in integrated circuit die
10/04/2007US20070231966 Semiconductor device fabricating method
10/04/2007US20070231965 Capillary underfill of stacked wafers
10/04/2007US20070231964 Methods of forming semiconductor assemblies
10/04/2007US20070231963 Method for handling a semiconductor wafer assembly
10/04/2007US20070231962 Manufacturing method of wiring substrate and manufacturing method of semiconductor device
10/04/2007US20070231961 Semiconductor device manufacturing method
10/04/2007US20070231960 Process for fabricating a semiconductor package
10/04/2007US20070231959 Method for making a wedge wedge wire loop
10/04/2007US20070231958 Method of manufacturing a composite electronic part, and composite electronic part
10/04/2007US20070231957 Method of manufacturing semiconductor device
10/04/2007US20070231956 Mold for resin molding, resin molding apparatus, and semiconductor device manufacture method
10/04/2007US20070231955 Method For Packaging Flash Memory Cards
10/04/2007US20070231954 Gold/silicon eutectic die bonding method
10/04/2007US20070231953 Flexible interconnect pattern on semiconductor package
10/04/2007US20070231952 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
10/04/2007US20070231951 Reducing layer count in semiconductor packages
10/04/2007US20070231950 Barrier for use in 3-d integration of circuits
10/04/2007US20070231949 Functional blocks for assembly and method of manufacture
10/04/2007US20070231948 Semiconductor device and method of manufacturing the same
10/04/2007US20070231945 Fabrication method of complementary metal oxide semiconductor image sensor
10/04/2007US20070231944 Electromagnetic Micro-Generator and Method for Manufacturing the Same
10/04/2007US20070231943 Protection capsule for mems devices
10/04/2007US20070231942 Micromechanical flow sensor with tensile coating
10/04/2007US20070231941 Method of Manufacturing Organic Device Element
10/04/2007US20070231940 Composition and method of dyeing keratin fibers comprising luminescent semiconductive nanoparticles
10/04/2007US20070231939 Manufacturing method of a transparent conductive film, a manufacturing method of a transparent electrode of an organic electroluminescence device, an organic electroluminescence device and the manufacturing method
10/04/2007US20070231938 Manufacturing Method
10/04/2007US20070231937 Electronic apparatus and method of manufacturing electronic apparatus
10/04/2007US20070231936 Fabrication Method of Semiconductor Integrated Circuit Device
10/04/2007US20070231935 Novel critical dimension (cd) control by spectrum metrology
10/04/2007US20070231934 Classification apparatus for semiconductor substrate, classification method of semiconductor substrate, and manufacturing method of semiconductor device
10/04/2007US20070231933 Using reverse arrangement for trend test in statistical process control for manufacture of semiconductor integrated circuits
10/04/2007US20070231932 Method of revealing crystalline defects in a bulk substrate
10/04/2007US20070231931 Method for fabricating a compound-material and method for choosing a wafer
10/04/2007US20070231930 Dynamic metrology sampling for a dual damascene process
10/04/2007US20070231929 Processing method for wafer
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