Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/04/2007US20070227450 Plasma Cvd Equipment
10/04/2007US20070227440 Arsenic dopants for pulling of silicon single crystal, process for producing thereof and process for producing silicon single crystal using thereof
10/04/2007US20070227032 Substrate processing apparatus
10/04/2007US20070226996 Hybrid integrated circuit device and method of manufacturing the same
10/04/2007US20070226973 Diffusion bonded fluid flow manifold with partially integrated inter-active component
10/04/2007US20070226972 Common carrier
10/04/2007DE19963587B4 Projektions-Belichtungsanlage Projection exposure apparatus
10/04/2007DE19911977B4 Verfahren zum Einbringen von Isolationsbereichen in ein Substrat und Feldisolationsstruktur in einem Halbleitersubstrat Method for introducing isolation regions in a substrate, and field isolation structure in a semiconductor substrate,
10/04/2007DE19745243B4 Verfahren zum Herstellen eines mit Harz verschlossenen Halbleiterbauelements und Prägevorrichtung dafür A method for manufacturing a resin-sealed semiconductor device and embossing apparatus therefor
10/04/2007DE112005002630T5 Verfahren zum Herstellen einer vollständig silizidierten Gateelektrode A method for producing a fully silicided gate electrode
10/04/2007DE10334575B4 Elektronisches Bauteil und Nutzen sowie Verfahren zur Herstellung derselben Electronic component and benefits as well as methods for making same
10/04/2007DE10300711B4 Verfahren zur Passivierung eines Halbleiterchipstapels A method for passivation of a semiconductor chip stack
10/04/2007DE10258787B4 Verfahren zum Herstellen eines selbstausgerichteten potenzialfreien Gates in einer Flashspeicherzelle A method of manufacturing a self-aligned floating gates in a flash memory cell
10/04/2007DE10257870B4 Halbleiterstruktur mit einer integrierten Abschirmung Semiconductor structure with an integrated shield
10/04/2007DE10249633B4 Source-Down-Leistungstransistor und Verfahren zu dessen Herstellung Source-down power transistor and method of producing the
10/04/2007DE10227551B4 Speicherlöschverfahren Memory erasing method
10/04/2007DE102006029335A1 Composition, useful to prepare insulating films for a semiconductor device, comprises a silicon compound containing silicon-methyl-bond, and an organic solvent for dissolving the silicon compound
10/04/2007DE102006018234A1 Charge-trapping-Bauelement und Verfahren zum Herstellen eines Charge-trapping-Bauelementes Charge-trapping device and method of manufacturing a charge-trapping component
10/04/2007DE102006015539A1 Coolant, useful for preparing and/or treating ingots and/or wafers used in semiconductor industry and micro mechanical- and electronic devices, comprises at least a surfactant e.g. organosilicon compounds
10/04/2007DE102006015142A1 Semiconductor wafer breaking device for manufacturing e.g. integrated circuit, has two counter supports which are provided and turned towards top side of semiconductor wafer, where supports are positioned at sides of preset break line
10/04/2007DE102006015141A1 Semiconductor wafer breaking device for e.g. integrated circuit chip, has wedge arranged at lower side of wafer premarked in starting area of break line, and arranged opposite to wafer plane such that pressure is exerted at wedge sides
10/04/2007DE102006013853A1 Leistungshalbleiterbauelement mit großflächigen Außenkontakten sowie Verfahren zur Herstellung desselben Power semiconductor component thereof with outer contacts, as well as large-scale process for preparing
10/04/2007DE102006013245A1 Mold layer forming method, involves forming mold layer on one of surface sections of substrate after forming template, and removing template after applying mold layer, where opening is formed in mold layer via another surface section
10/04/2007DE102006009789B3 Verfahren zur Herstellung eines Halbleiterbauteils aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse A method for manufacturing a semiconductor device of a composite plate with semiconductor chips and plastic housing composition
10/04/2007DE102006008948B3 Verfahren zum Aufbringen und elektrischen Kontaktieren von elektronischen Bauteilen auf eine Substratbahn A method for applying and electrically contacting electronic components on a substrate web
10/04/2007DE102006002367B3 Vorrichtung und Verfahren zur Übertragung einer Mehrzahl von Chips von einem Wafer auf ein Substrat Apparatus and method for transmitting a plurality of chips from a wafer to a substrate
10/04/2007DE102005055838B4 Verfahren und Vorrichtung zum ermöglichen tiefliegender Halbleiterkontakte Method and apparatus for enabling low-lying semiconductor contacts
10/04/2007DE102005046978B4 Technik zum Erzeugen einer unterschiedlichen mechanischen Verformung durch Bilden eines Kontaktätzstoppschichtstapels mit unterschiedlich modifizierter innerer Verspannung Technique for generating a different mechanical deformation by forming a Kontaktätzstoppschichtstapels with differently modified internal stress
10/04/2007DE10144704B4 Verfahren zum Verbinden eines Bauelements mit einem Träger A method for connecting a component with a carrier
10/04/2007CA2643655A1 Aluminum - boron solar cell contacts
10/03/2007EP1840979A2 Semiconductor layer, process for forming the same, and semiconductor light emitting device
10/03/2007EP1840960A1 Semiconductor device
10/03/2007EP1840959A1 Hybrid ionized physical vapor deposition of via and trench liners
10/03/2007EP1840958A1 Method of producing simox wafer
10/03/2007EP1840957A1 Method of producing simox wafer
10/03/2007EP1840956A1 Method of producing simox wafer
10/03/2007EP1840955A1 Method for fabricating a compound material and method for choosing a wafer
10/03/2007EP1840954A1 Pod cramping unit, load port equipped with pod cramping unit and mini-environment system including pod and load port
10/03/2007EP1840953A1 Semiconductor device
10/03/2007EP1840952A1 Devices with microjetted polymer standoffs
10/03/2007EP1840951A2 A gettering method and a wafer using the same
10/03/2007EP1840950A1 Plasma processing method
10/03/2007EP1840949A2 Roughness reducing film at an interface between a wiring line and a dielectric, materials for forming the roughness reducing film, and method for manufacturing a semiconductor device
10/03/2007EP1840948A1 Fine treatment agent and fine treatment method using same
10/03/2007EP1840947A2 Nonvolatile semiconductor memory device
10/03/2007EP1840946A1 Method for cleaning of semiconductor processing apparatus and method for ethching silicon substrate
10/03/2007EP1840945A1 Method of adjusting lighting optical device, lighting optical device, exposure system, and exposure method
10/03/2007EP1840944A1 Exposure method and apparatus, and electronic device manufacturing method
10/03/2007EP1840943A1 Mobile body system, exposure apparatus, and method of producing device
10/03/2007EP1840942A2 Liquid processing apparatus and liquid processing method
10/03/2007EP1840940A1 Apparatus and process for coating micro or nanostructured substrates
10/03/2007EP1840659A2 Composition for cleaning microelectronic substrates containing halogen oxygen acids and derivatives thereof
10/03/2007EP1840655A1 Material for forming resist protection films and method for resist pattern formation with the same
10/03/2007EP1840649A2 Device for holding an imprint lithography template
10/03/2007EP1840647A1 Phase shift mask, phase shift mask manufacturing method, and semiconductor element manufacturing method
10/03/2007EP1840541A1 Method and apparatus for evaluating solar cell and use thereof
10/03/2007EP1840503A1 A component placement unit as well as a component placement device comprising such a component placement unit
10/03/2007EP1840502A1 Optical interferometer for measuring changes in thickness
10/03/2007EP1840243A2 Susceptor for epitaxial growth and epitaxial growth method
10/03/2007EP1840241A2 Atomic deposition layer methods
10/03/2007EP1840149A1 Curable resin composition and interlayer insulating film
10/03/2007EP1840054A1 Board material storing method and apparatus
10/03/2007EP1839812A2 Substrate holding apparatus, polishing apparatus, and polishing method
10/03/2007EP1839340A2 Method for forming a one mask hyperabrupt junction varactor using a compensated cathode contact
10/03/2007EP1839335A1 Semiconductor device
10/03/2007EP1839333A2 Manufacturing method for semiconductor chips and semiconductor wafer
10/03/2007EP1839332A2 Formation and treatment of a sige structure
10/03/2007EP1839331A2 Electrical determination of the connection quality of a bonded wafer connection
10/03/2007EP1839330A2 Cleaning methods for silicon electrode assembly surface contamination removal
10/03/2007EP1839329A2 Mtj elements with high spin polarization layers configured for spin-transfer switching and spintronics devices using the magnetic elements
10/03/2007EP1839091A1 Support structure and lithographic apparatus
10/03/2007EP1838897A2 Method for depositing palladium layers and palladium bath therefor
10/03/2007EP1838795A2 Engineered non-polymeric organic particles for chemical mechanical planarization
10/03/2007EP1784859A4 Semiconductor transistor having structural elements of differing materials and method of formation
10/03/2007EP1751794A4 Method for enhancing field oxide and integrated circuit with enhanced field oxide
10/03/2007EP1714294A4 Nonvolatile memory
10/03/2007EP1636855A4 Gallium arsenide hbt having increased performance and method for its fabrication
10/03/2007EP1563535B1 Method of manufacturing semiconductor device by a plasma processing method
10/03/2007EP1549780A4 Substrate processing apparatus and related systems and methods
10/03/2007EP1482361B1 Acid-degradable resin compositions containing ketene-aldehyde copolymer
10/03/2007EP1451619A4 Structures and methods for reducing aberration in optical systems
10/03/2007EP1423758B1 A zoom system, in particular, a zoom system for an illumination device of a microlithographic projection system
10/03/2007EP1423244B9 Devices for detaching substrates and the associated methods
10/03/2007EP1378009B1 Field-effect transistor structure and method of manufacture
10/03/2007EP1342270B1 Flash-eeprom storage device and corresponding production method
10/03/2007EP1316108B9 Fabrication process of a semiconductor device comprising an intermediate low-dielectric silicon nitride film
10/03/2007EP1279070B1 Apparatus for providing a purged optical path in a projection photolithography system and a corresponding method
10/03/2007EP1213749B1 Plasma processing apparatus and method of plasma processing
10/03/2007EP1177451B1 Method for measuring acceleration with a plurality of operating modes
10/03/2007EP1142001B1 Fast heating and cooling apparatus for semiconductor wafers
10/03/2007EP1122767B1 Wafer polishing method and cleaning method using a protection film
10/03/2007EP1080664B1 Cleaning rotary brush
10/03/2007EP1026283B1 Method for preparing high purity ruthenium sputtering target
10/03/2007EP1021833B1 Device with security integrated circuit and method for making same
10/03/2007EP0990059B1 Low temperature chemical vapor deposition process for forming bismuth-containing ceramic thin films useful in ferroelectric memory devices
10/03/2007EP0888701B1 Thin film fabrication technique for implantable electrodes
10/03/2007EP0821406B1 An integrated circuit on an ultra-flexible substrate and a method of wire bonding an integrated circuit to an ultra-flexible substrate
10/03/2007CN200956115Y Semiconductor wafer rapid cooling control device
10/03/2007CN200955074Y Steel-band clamping mechanism on integrated circuit electric-plating production line
10/03/2007CN101048883A Methods and structures for electrical communication with an overlying electrode for a semiconductor element
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