Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/02/2007US7276418 Memory cell and method for forming the same
10/02/2007US7276417 Hybrid STI stressor with selective re-oxidation anneal
10/02/2007US7276416 Method of forming a vertical transistor
10/02/2007US7276415 Contactless nonvolatile memory device and method of forming the same
10/02/2007US7276414 NAND memory arrays and methods
10/02/2007US7276413 NROM flash memory devices on ultrathin silicon
10/02/2007US7276412 MIM capacitor of semiconductor device and manufacturing method thereof
10/02/2007US7276411 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same
10/02/2007US7276410 Semiconductor device with omega gate and method for fabricating a semiconductor device
10/02/2007US7276409 Method of forming a capacitor
10/02/2007US7276408 Reduction of dopant loss in a gate structure
10/02/2007US7276407 Method for fabricating semiconductor device
10/02/2007US7276406 Transistor structure with dual trench for optimized stress effect and method therefor
10/02/2007US7276405 Power semiconductor device having high breakdown voltage, low on-resistance and small switching loss and method of forming the same
10/02/2007US7276404 Methods of forming SRAM cells having landing pad in contact with upper and lower cell gate patterns
10/02/2007US7276403 Selective oxidation of silicon in diode, TFT, and monolithic three dimensional memory arrays
10/02/2007US7276402 Semiconductor device and manufacturing method thereof
10/02/2007US7276401 Adhesion by plasma conditioning of semiconductor chip surfaces
10/02/2007US7276400 Methods of making microelectronic packages with conductive elastomeric posts
10/02/2007US7276399 Method of designing a module-based flip chip substrate design
10/02/2007US7276398 System and method for hermetically sealing a package
10/02/2007US7276397 Integrated circuit package separator methods
10/02/2007US7276396 Die handling system
10/02/2007US7276394 Large area flat image sensor assembly
10/02/2007US7276393 Microelectronic imaging units and methods of manufacturing microelectronic imaging units
10/02/2007US7276392 Floating body germanium phototransistor with photo absorption threshold bias region
10/02/2007US7276391 Manufacture of a semiconductor device
10/02/2007US7276390 Long wavelength indium arsenide phosphide (InAsP) quantum well active region and method for producing same
10/02/2007US7276389 Article comprising metal oxide nanostructures and method for fabricating such nanostructures
10/02/2007US7276388 Method, system, and apparatus for authenticating devices during assembly
10/02/2007US7276387 Castellation wafer level packaging of integrated circuit chips
10/02/2007US7276386 Semiconductor device and method of manufacturing the same
10/02/2007US7276385 Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods
10/02/2007US7276384 Magnetic tunnel junctions with improved tunneling magneto-resistance
10/02/2007US7276327 Silicon-containing compositions for spin-on arc/hardmask materials
10/02/2007US7276323 Photoresists, polymers and processes for microlithography
10/02/2007US7276317 Polycrystalline silicon thin film having uniform crystallization characteristics
10/02/2007US7276300 comprising metal-oxide-containing layer, which is a ferroelectric or a paraelectsic which is covered by a hydrogen barrier layer, characterized in that the hydrogen barrier provides improved protection of a hydrogen-sensitive dielectric against hydrogen contamination
10/02/2007US7276285 Structure having a substrate, patterned metal layer and a catalyst island formed on the metal layer, surface of the substrate upon which the metal layer is formed may be oxidized, to support the successful growth of nanotubes on a resulting structure for a reliable electrical connection to the nanotubes
10/02/2007US7276277 Micromechanical component, in particular a sensor element, having a stabilized membrane and a method of producing such a component
10/02/2007US7276222 Diamondoid-containing thermally conductive materials
10/02/2007US7276219 Activation laser; crystallization from melt
10/02/2007US7276185 Easily ensure the conductivity at the same level as an Ag bulk by a low temperature treatment
10/02/2007US7276180 Chemical mechanical polishing composition and process
10/02/2007US7276175 Semiconductor device fabrication method
10/02/2007US7276168 Method for supply of constant-concentration ozonated water
10/02/2007US7276125 Barrel type susceptor
10/02/2007US7276124 Reactor having a movable shutter
10/02/2007US7276123 Semiconductor-processing apparatus provided with susceptor and placing block
10/02/2007US7276122 Multi-workpiece processing chamber
10/02/2007US7276118 Spin-coating apparatus for use in manufacturing semiconductor devices
10/02/2007US7276097 Load-lock system, exposure processing system, and device manufacturing method
10/02/2007US7275905 Method and device for controlling position of cassette in semiconductor manufacturing equipment
10/02/2007US7275749 Substrate supporting apparatus
10/02/2007US7275696 Non-contact ID card and the like and method for manufacturing same
10/02/2007US7275676 Apparatus for locating conductive spheres utilizing screen and hopper of solder balls
10/02/2007US7275627 Active vibration suppression apparatus, control method therefor, and exposure apparatus having active vibration suppression apparatus
10/02/2007US7275553 Liquid processing apparatus and liquid processing method
10/02/2007US7275316 Method of embedding passive component within via
10/02/2007US7275314 Electronic component mounting apparatus and electronic component mounting method
10/02/2007US7275312 Apparatus for precise alignment of packaging caps on a substrate
10/02/2007US7275309 Method of manufacturing electrical resistance heating element
10/02/2007CA2173365C Varactor diode having a stepped capacitance-voltage profile
09/2007
09/27/2007WO2007109613A1 Ultra low pin count interface for die testing
09/27/2007WO2007109522A2 Methods for etching a dielectric barrier layer with high selectivity
09/27/2007WO2007109491A2 Selective deposition
09/27/2007WO2007109487A2 Semiconductor device incorporating fluorine into gate dielectric
09/27/2007WO2007109486A2 Carrierless chip package for integrated circuit devices, and methods of making same
09/27/2007WO2007109485A2 Method for forming ultra thin low leakage multigate devices
09/27/2007WO2007109478A1 Self-vacuum arrangement for pneumatic equipment
09/27/2007WO2007109464A2 Methods for etching a bottom anti-reflective coating layer in dual damascene application
09/27/2007WO2007109463A1 Method of forming trench contacts for mos transistors
09/27/2007WO2007109448A2 Apparatus and method for carrying substrates
09/27/2007WO2007109394A2 Integrated multi-wavelength fabry-perot filter and method of fabrication
09/27/2007WO2007109356A2 Device and method for etching flash memory gate stacks comprising high-k dielectric
09/27/2007WO2007109346A2 Mass pulse sensor and process-gas system and mehthod
09/27/2007WO2007109326A2 Methods and materials useful for chip stacking, chip and wafer bonding
09/27/2007WO2007109265A2 Iii-nitrite power semiconductor device
09/27/2007WO2007109179A1 Vertical eeprom device
09/27/2007WO2007109117A2 Dry etch stop process for eliminating electrical shorting in mram device structures
09/27/2007WO2007109116A2 Street smart wafer breaking mechanism
09/27/2007WO2007109090A2 Packaging of mems devices
09/27/2007WO2007108961A2 Thermal chuck and processes for manufacturing the thermal chuck
09/27/2007WO2007108932A2 Technique for preparing precursor films and compound layers for thin film solar cell fabrication and apparatus corresponding thereto
09/27/2007WO2007108925A2 Oxidation-stabilized cmp compositions and methods
09/27/2007WO2007108886A2 Semiconductor surface processing
09/27/2007WO2007108549A1 Plasma processing apparatus and plasma processing method
09/27/2007WO2007108548A1 Method for manufacturing ceramic covering member for semiconductor processing apparatus
09/27/2007WO2007108546A1 Ceramic coating member for semiconductor processing apparatus
09/27/2007WO2007108494A1 Process for producing semiconductor device
09/27/2007WO2007108481A1 Substrate cleaning method and substrate cleaning apparatus
09/27/2007WO2007108477A1 Substrate support, substrate processing unit and substrate supporting method
09/27/2007WO2007108470A1 Substrate processing device system
09/27/2007WO2007108462A1 Etching method
09/27/2007WO2007108456A1 Semiconductor device having igbt cells and diode cells, and its designing method
09/27/2007WO2007108445A1 Method of forming continuous thin film and linear glass substrate with thin film
09/27/2007WO2007108439A1 Power semiconductor device
09/27/2007WO2007108415A1 Exposure apparatus and device manufacturing method
09/27/2007WO2007108414A1 Exposure apparatus and device production method
09/27/2007WO2007108404A1 Semiconductor field effect transistor and method for fabricating the same
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