Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/04/2007WO2007111168A1 Resin composition, varnish, resin film, and semiconductor device using the resin film
10/04/2007WO2007111146A1 Lighting optical system, exposure system, and device production method
10/04/2007WO2007111127A1 Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium
10/04/2007WO2007111126A1 Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium
10/04/2007WO2007111125A1 Electroless plating liquid
10/04/2007WO2007111104A1 Projection optical system, exposure apparatus and device manufacturing method
10/04/2007WO2007111097A1 Substrate holding apparatus
10/04/2007WO2007111058A1 Structural member for plasma treatment system and method for manufacture thereof
10/04/2007WO2007111045A1 Temperature treating unit and temperature treating system
10/04/2007WO2007111044A1 Liquid crystal display
10/04/2007WO2007111008A1 Method for transferring semiconductor element, method for manufacturing semiconductor device, and semiconductor device
10/04/2007WO2007110988A1 Process for producing semiconductor device
10/04/2007WO2007110961A1 Semiconductor device and method for manufacturing the same
10/04/2007WO2007110959A1 Process for producing semiconductor device
10/04/2007WO2007110950A1 Semiconductor memory device and method of manufacturing same
10/04/2007WO2007110940A1 Semiconductor device and its fabrication process
10/04/2007WO2007110936A1 Method for manufacturing semiconductor device
10/04/2007WO2007110832A2 Trench-gate semiconductor device and method of fabrication thereof
10/04/2007WO2007110719A2 Improved alkaline solutions for post cmp cleaning processes
10/04/2007WO2007110507A2 Process for fabricating a field-effect transistor with self-aligned gates
10/04/2007WO2007110192A1 Method and apparatus for electrostatic fixing of substrates with molecules which can be polarized
10/04/2007WO2007110191A1 Method and device for electrostatically fixing substrates having a conductive layer
10/04/2007WO2007092146A3 Method and apparatus for inspection of multi-junction solar cells
10/04/2007WO2007087299A3 Simultaneous formation of source/drain contacts and conductive layers on eeprom control gates
10/04/2007WO2007079206A3 Fabrication of semiconductor device for flash memory with increased select gate width
10/04/2007WO2007078714A3 Integrated capacitors in package-level structures, processes of making same, and systems containing same
10/04/2007WO2007078686A3 Method of polishing a semiconductor-on-insulator structure
10/04/2007WO2007062056A3 Silicon-germanium hydrides and methods for making and using same
10/04/2007WO2007019544A3 Pre-made cleavable substrate and devices using films provided by a layer transfer process
10/04/2007WO2007008941A3 Substrate transport apparatus with automated alignment
10/04/2007WO2007002130A3 Replacement gate field effect transistor with germanium or sige channel and manufacturing method for same using gas-cluster ion irradiation
10/04/2007WO2006121772A3 Ink jet application of carbon nanotubes
10/04/2007WO2006102180A3 Contact metallization methods and processes
10/04/2007WO2006091793A8 Microelectronic assemblies having compliancy
10/04/2007WO2006055379A3 Improved dose uniformity during scanned ion implantation
10/04/2007US20070234243 Design data creating method, design data creating program product, and manufacturing method of semiconductor device
10/04/2007US20070234242 Logic circuit, logic circuit design method, logic circuit design system, and logic circuit design program
10/04/2007US20070233427 Monitoring a single-wafer processing system
10/04/2007US20070233306 Polishing apparatus and method of controlling the same
10/04/2007US20070233302 System for controlling production of electronic devices, system and method for producing electronic devices, and computer program product
10/04/2007US20070232513 Microelectronic Cleaning Compositions Containing Ammonia-Free Fluoride Salts for Selective Photoresist Stripping and Plasma Ash Residue Cleaning
10/04/2007US20070232209 Method for polishing a semiconductor wafer
10/04/2007US20070232201 Apparatus and method for polishing semiconductor wafer
10/04/2007US20070232197 Polishing slurry and polishing method
10/04/2007US20070232193 Substrate holding apparatus, polishing apparatus, and polishing method
10/04/2007US20070232085 Method and apparatus for plasma processing
10/04/2007US20070232084 Manufacturing method for semiconductor device
10/04/2007US20070232083 Apparatus and method for manufacturing semiconductor devices
10/04/2007US20070232082 Method to improve the step coverage and pattern loading for dielectric films
10/04/2007US20070232081 Method for forming tetragonal zirconium oxide layer and method for fabricating capacitor having the same
10/04/2007US20070232080 Reflow method, pattern generating method, and fabrication method for TFT for LCD
10/04/2007US20070232079 Semiconductor device made by multiple anneal of stress inducing layer
10/04/2007US20070232078 In situ processing for ultra-thin gate oxide scaling
10/04/2007US20070232077 Method for manufacturing semiconductor device
10/04/2007US20070232076 Method of repairing damaged film having low dielectric constant, semiconductor device fabricating system and storage medium
10/04/2007US20070232075 Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device using the same, and method for manufacturing semiconductor device
10/04/2007US20070232074 Techniques for the synthesis of dense, high-quality diamond films using a dual seeding approach
10/04/2007US20070232073 Cleaning apparatus of semiconductor substrate and method of manufacturing semiconductor device
10/04/2007US20070232072 Formation of protection layer on wafer to prevent stain formation
10/04/2007US20070232071 Method to improve the step coverage and pattern loading for dielectric films
10/04/2007US20070232070 Method and device for depositing a protective layer during an etching procedure
10/04/2007US20070232069 Chemical mechanical polishing apparatus
10/04/2007US20070232068 Slurry for touch-up CMP and method of manufacturing semiconductor device
10/04/2007US20070232067 Semiconductor Fabrication Method and Etching System
10/04/2007US20070232066 Method and device for the plasma treatment of surfaces containing alkali and alkaline-earth metals
10/04/2007US20070232065 Composition Control For Photovoltaic Thin Film Manufacturing
10/04/2007US20070232064 Method of manufacturing a semiconductor element
10/04/2007US20070232063 Method for reducing polish-induced damage in a contact structure by forming a capping layer
10/04/2007US20070232062 Damascene interconnection having porous low k layer followed by a nonporous low k layer
10/04/2007US20070232061 Semiconductor device having adhesion increasing film to prevent peeling
10/04/2007US20070232060 Hybrid ionized physical vapor deposition of via and trench liners
10/04/2007US20070232059 Multilayer interconnection substrate and method of manufacturing the same
10/04/2007US20070232058 Composition for forming insulating film and method for fabricating semiconductor device
10/04/2007US20070232057 Method for forming thin film photovoltaic interconnects using self-aligned process
10/04/2007US20070232056 Semiconductor device and method for manufacturing the same
10/04/2007US20070232055 Methods and Apparatuses for Applying a Protective Material to an Interconnect Associated with a Component
10/04/2007US20070232054 Semiconductor device and manufacturing method thereof
10/04/2007US20070232053 Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
10/04/2007US20070232052 Method for Forming Passivation Layer
10/04/2007US20070232051 Method for forming metal bumps
10/04/2007US20070232050 Embedding device in substrate cavity
10/04/2007US20070232049 Method and structure for eliminating aluminum terminal pad material in semiconductor devices
10/04/2007US20070232048 Damascene interconnection having a SiCOH low k layer
10/04/2007US20070232047 Damage recovery method for low K layer in a damascene interconnection
10/04/2007US20070232046 Damascene interconnection having porous low K layer with improved mechanical properties
10/04/2007US20070232045 Damage assessment of a wafer using optical metrology
10/04/2007US20070232044 Filling narrow and high aspect ratio openings with electroless deposition
10/04/2007US20070232043 Method for forming thermal stable silicide using surface plasma treatment
10/04/2007US20070232042 Method for fabricating semiconductor device having bulb-shaped recess gate
10/04/2007US20070232041 Integrated circuit device gate structures having charge storing nano crystals in a metal oxide dielectric layer and methods of forming the same
10/04/2007US20070232040 Method for reducing carbon monoxide poisoning in a thin film deposition system
10/04/2007US20070232039 Semiconductor device having shallow B-doped region and its manufacture
10/04/2007US20070232038 Method of manufacturing plasma display panel and photomask to be used in the method
10/04/2007US20070232037 High capacitance low resistance electrode
10/04/2007US20070232036 Method of producing product including silicon wires
10/04/2007US20070232035 Electronic Device
10/04/2007US20070232034 Method for manufacturing semiconductor device
10/04/2007US20070232033 Method for forming ultra-shallow high quality junctions by a combination of solid phase epitaxy and laser annealing
10/04/2007US20070232032 Method of manufacturing semiconductor device and semiconductor device
10/04/2007US20070232031 UV assisted low temperature epitaxial growth of silicon-containing films
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