Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/25/2007US7272888 Method of fabricating semiconductor chip assemblies
09/25/2007CA2414325C Method of fabricating gan semiconductor structures using laser-assisted epitaxial liftoff
09/20/2007WO2007106836A2 Additives for stable nanotube coatings
09/20/2007WO2007106814A2 Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer
09/20/2007WO2007106780A2 Dielectric components and method of manufacture
09/20/2007WO2007106764A2 Methods of performance improvement of hvmos devices
09/20/2007WO2007106665A2 Carbon nanotube deposition with a stencil
09/20/2007WO2007106660A2 Method and apparatus for fabricating a high dielectric constant transistor gate using a low energy plasma system
09/20/2007WO2007106647A2 Silicided nonvolatile memory and method of making same
09/20/2007WO2007106634A2 Semiconductor device packaging
09/20/2007WO2007106627A2 Silicon deposition over dual surface orientation substrates to promote uniform polishing
09/20/2007WO2007106625A2 Perforated embedded plane package and method
09/20/2007WO2007106363A2 Improved multi-layer device
09/20/2007WO2007106258A2 A technique for efficiently and dynamically maintaining bidirectional forwarding detection on a bundle of links
09/20/2007WO2007106189A2 Method and system to position carbon nanotubes using ac dielectrophoresis
09/20/2007WO2007106101A2 Process for making contained layers and devices made with same
09/20/2007WO2007106076A2 Apparatus and method for large area multi-layer atomic layer chemical vapor processing of thin films
09/20/2007WO2007105958A1 Method for separating wafers from a stack of wafers
09/20/2007WO2007105939A1 Lithography system and projection method
09/20/2007WO2007105877A1 Susceptor and semiconductor manufacturing apparatus including the same
09/20/2007WO2007105832A1 Semiconductor substrate, electronic device, optical device, and production methods therefor
09/20/2007WO2007105820A1 Process and equipment for production of wash water containing dissolved gas, and cleaning equipment
09/20/2007WO2007105798A1 Heat shield plate for substrate annealing apparatus
09/20/2007WO2007105782A1 Method for manufacturing group 3-5 nitride semiconductor substrate
09/20/2007WO2007105776A1 Composition for forming lower layer film and pattern forming method
09/20/2007WO2007105763A1 Circuit board, electronic circuit device, and display
09/20/2007WO2007105727A1 Plasma etching method
09/20/2007WO2007105676A1 Microchip and soi substrate for manufacturing microchip
09/20/2007WO2007105675A1 Method for manufacturing substrate for photoelectric conversion element
09/20/2007WO2007105645A1 Exposure apparatus, maintenance method, exposure method and device manufacturing method
09/20/2007WO2007105611A1 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure, semiconductor wafer grinding method using such semiconductor wafer protecting structure, and semiconductor chip manufacturing method
09/20/2007WO2007105538A1 Composition for resist underlayer film, and resist underlayer film using the same
09/20/2007WO2007105537A1 Laser processing method and laser processing system
09/20/2007WO2007105535A1 Electronic part mounting structure and its manufacturing method
09/20/2007WO2007105474A1 Imprinting method and imprinting apparatus
09/20/2007WO2007105455A1 Stage device
09/20/2007WO2007105431A1 Substrate processing apparatus and substrate processing method
09/20/2007WO2007105426A1 Method for repairing semiconductor device and apparatus for repairing semiconductor device
09/20/2007WO2007105413A1 Semiconductor device
09/20/2007WO2007105412A1 Method of seasoning film-forming apparatus
09/20/2007WO2007105411A1 Plasma generator and method of generating plasma using the same
09/20/2007WO2007105406A1 Projection optical system, aligner and method for fabricating semiconductor device
09/20/2007WO2007105405A1 Method and device for mounting anisotropically-shaped member, method of manufacturing electronic device, electronic device, and display
09/20/2007WO2007105387A1 Semiconductor inspecting system
09/20/2007WO2007105384A1 Insulated gate-type semiconductor device and manufacturing method thereof
09/20/2007WO2007105361A1 Electronic component module
09/20/2007WO2007105310A1 Transfer robot
09/20/2007WO2007105281A1 Process for producing compound semiconductor device and etchant
09/20/2007WO2007105275A1 Semiconductor device and process for producing the same
09/20/2007WO2007105263A1 Layout method for analog circuit, and data processing system
09/20/2007WO2007105261A1 Method of dry etching of interlayer insulation film
09/20/2007WO2007105157A2 Source and drain formation
09/20/2007WO2007105155A1 Method of manufacturing a bipolar transistor
09/20/2007WO2007104799A1 Interconnection of electronic devices with raised leads
09/20/2007WO2007104767A1 Method for making a structure comprising at least one thin layer in an amorphous material obtained by epitaxy on a supporting substrate and structure obtained according to said method
09/20/2007WO2007104444A1 Method for producing an integrated circuit
09/20/2007WO2007104443A1 Method for producing an integrated circuit
09/20/2007WO2007089377A3 Method of filling a high aspect ratio trench isolation region and resulting structure
09/20/2007WO2007088058A3 Support for wafer singulation
09/20/2007WO2007081528A3 Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
09/20/2007WO2007068714A3 Method of making a contact in a semiconductor device
09/20/2007WO2007037906A3 Methods for synthesis of metal nanowires
09/20/2007WO2007031298A8 Flip-chip module and method for the production thereof
09/20/2007WO2007014034A3 Programmable structure including nanocrystal storage elements in a trench
09/20/2007WO2007009035A3 Lateral growth method for defect reduction of semipolar nitride films
09/20/2007WO2006089026A3 Printed conductive connectors
09/20/2007US20070220477 Circuit-pattern-data correction method and semiconductor-device manufacturing method
09/20/2007US20070219664 Device Processing System, Information Display Method, Program, and Recording Medium
09/20/2007US20070219660 Substrate transporting and processing apparatus, fault management method for substrate transport and processing apparatus, and storage medium storing fault management program
09/20/2007US20070218817 Loading device for chemical mechanical polisher of semiconductor wafer
09/20/2007US20070218811 Cmp polishing slurry and method of polishing substrate
09/20/2007US20070218797 Production apparatus and method of producing a light-emitting device by using the same apparatus
09/20/2007US20070218707 Electronic device including semiconductor islands of different thicknesses over an insulating layer and a process of forming the same
09/20/2007US20070218706 Heat treating apparatus, heat treating method, and storage medium
09/20/2007US20070218705 Method of forming a carbon polymer film using plasma CVD
09/20/2007US20070218704 Method of light enhanced atomic layer deposition
09/20/2007US20070218703 Method for improved growth of semipolar (Al,In,Ga,B)N
09/20/2007US20070218702 Semiconductor-processing apparatus with rotating susceptor
09/20/2007US20070218701 Semiconductor-processing apparatus with rotating susceptor
09/20/2007US20070218700 Etching solution comprising hydrofluoric acid
09/20/2007US20070218699 Plasma etching method and computer-readable storage medium
09/20/2007US20070218698 Plasma etching method, plasma etching apparatus, and computer-readable storage medium
09/20/2007US20070218697 Method for removing polymer from wafer and method for removing polymer in interconnect process
09/20/2007US20070218696 Dry etching method
09/20/2007US20070218695 Metal pattern forming method
09/20/2007US20070218694 Method of reducing particle count inside a furnace and method of operating the furnace
09/20/2007US20070218692 Copper-based metal polishing compositions and polishing processes
09/20/2007US20070218691 Plasma etching method, plasma etching apparatus and computer-readable storage medium
09/20/2007US20070218690 Fabrication method for semiconductor interconnections
09/20/2007US20070218689 Stacked integrated circuit package-in-package system
09/20/2007US20070218688 Method for depositing tungsten-containing layers by vapor deposition techniques
09/20/2007US20070218687 Process for producing materials for electronic device
09/20/2007US20070218686 Alluminum base conductor for via fill interconnect
09/20/2007US20070218685 Method of forming trench contacts for MOS transistors
09/20/2007US20070218684 Method for fabricating storage node contact plug of semiconductor device
09/20/2007US20070218682 Semiconductor device
09/20/2007US20070218681 Plasma etching method and computer-readable storage medium
09/20/2007US20070218680 Method for fabricating semiconductor device and method for fabricating magnetic head
09/20/2007US20070218679 Organic BARC etch process capable of use in the formation of low k dual damascene integrated circuits
09/20/2007US20070218678 Method of manufacturing wafer level stack package