Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/25/2007US7274068 Ballistic direct injection NROM cell on strained silicon structures
09/25/2007US7274067 Service programmable logic arrays with low tunnel barrier interpoly insulators
09/25/2007US7274065 Source lines for NAND memory devices
09/25/2007US7274063 Nonvolatile memory cell with multiple floating gates formed after the select gate and having upward protrusions
09/25/2007US7274061 Capacitor constructions
09/25/2007US7274060 Memory cell array and method of forming the same
09/25/2007US7274059 Capacitor constructions
09/25/2007US7274056 Semiconductor constructions
09/25/2007US7274055 Method for improving transistor performance through reducing the salicide interface resistance
09/25/2007US7274049 Semiconductor assemblies
09/25/2007US7274048 Substrate based ESD network protection for a flip chip
09/25/2007US7274046 Tri-gate low power device and method for manufacturing the same
09/25/2007US7274039 Dual panel type organic electroluminescent display device and method of fabricating the same
09/25/2007US7274038 Silicon nitride film, a semiconductor device, a display device and a method for manufacturing a silicon nitride film
09/25/2007US7274035 Memory devices based on electric field programmable films
09/25/2007US7274017 Electron beam apparatus and high-voltage discharge prevention method
09/25/2007US7274004 Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support
09/25/2007US7273904 Complex of crosslinked ligands to core; narrow particle size distribution
09/25/2007US7273824 Semiconductor structure and fabrication therefor
09/25/2007US7273823 Situ oxide cap layer development
09/25/2007US7273822 Methods and apparatus for forming thin films for semiconductor devices
09/25/2007US7273821 Method for producing a porous coating
09/25/2007US7273820 Method for fabricating semiconductor device
09/25/2007US7273819 Method and apparatus for processing semiconductor substrates
09/25/2007US7273818 Film formation method and apparatus for semiconductor process
09/25/2007US7273817 Conditioning of a reaction chamber
09/25/2007US7273816 Methods for removal of organic materials
09/25/2007US7273815 Etch features with reduced line edge roughness
09/25/2007US7273814 Method for forming a ruthenium metal layer on a patterned substrate
09/25/2007US7273813 Wafer cleaning solution for cobalt electroless application
09/25/2007US7273812 Microprobe tips and methods for making
09/25/2007US7273811 Method for chemical vapor deposition in high aspect ratio spaces
09/25/2007US7273810 Semiconductor apparatus and method of fabricating the same
09/25/2007US7273809 Method of fabricating a conductive path in a semiconductor device
09/25/2007US7273808 Reactive barrier/seed preclean process for damascene process
09/25/2007US7273807 Method for fabricating semiconductor device by forming damascene interconnections
09/25/2007US7273806 Forming of high aspect ratio conductive structure using injection molded solder
09/25/2007US7273805 Redistribution layer with microstrips
09/25/2007US7273804 Internally reinforced bond pads
09/25/2007US7273803 Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure
09/25/2007US7273802 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads
09/25/2007US7273801 Method of forming thin film patterning substrate including formation of banks
09/25/2007US7273800 Hetero-integrated strained silicon n- and p-MOSFETs
09/25/2007US7273799 Deposition over mixed substrates
09/25/2007US7273798 Gallium nitride device substrate containing a lattice parameter altering element
09/25/2007US7273797 Methods of forming semiconductor-on-insulator constructions
09/25/2007US7273796 Methods of forming trench isolation in the fabrication of integrated circuitry and methods of fabricating integrated circuitry
09/25/2007US7273795 Method for forming a trench element separation region in a semiconductor substrate
09/25/2007US7273794 Shallow trench isolation fill by liquid phase deposition of SiO2
09/25/2007US7273793 Methods of filling gaps using high density plasma chemical vapor deposition
09/25/2007US7273792 Semiconductor device and fabricating method thereof
09/25/2007US7273791 Methods for forming a conductive structure using oxygen diffusion through one metal layer to oxidize a second metal layer
09/25/2007US7273790 Method for fabricating trench capacitor with insulation collar electrically connected to substrate through buried contact, in particular, for a semiconductor memory cell
09/25/2007US7273789 Method of fabricating heterojunction bipolar transistor
09/25/2007US7273788 Ultra-thin semiconductors bonded on glass substrates
09/25/2007US7273787 Method for manufacturing gate dielectric layer
09/25/2007US7273786 Method for fabricating a semiconductor memory cell
09/25/2007US7273785 Method to control device threshold of SOI MOSFET's
09/25/2007US7273784 Scalable high density non-volatile memory cells in a contactless memory array
09/25/2007US7273783 Methods for reducing void formation in semiconductor devices
09/25/2007US7273782 Method for manufacturing and operating a non-volatile memory
09/25/2007US7273781 Method of forming a capacitor in a semiconductor device without wet etchant damage to the capacitor parts
09/25/2007US7273780 Semiconductor device having box-shaped cylindrical storage nodes and fabrication method thereof
09/25/2007US7273779 Method of forming a double-sided capacitor
09/25/2007US7273778 Method of electroplating a substance over a semiconductor substrate
09/25/2007US7273777 Formation of fully silicided (FUSI) gate using a dual silicide process
09/25/2007US7273776 Methods of forming a P-well in an integrated circuit device
09/25/2007US7273775 Reliable and scalable virtual ground memory array formed with reduced thermal cycle
09/25/2007US7273774 Method for making thin-film semiconductor device
09/25/2007US7273773 Display device, method for manufacturing thereof, and television device
09/25/2007US7273772 Method for manufacturing thin film transistor array panel
09/25/2007US7273771 Common MOSFET process for plural devices
09/25/2007US7273770 Compliant passivated edge seal for low-k interconnect structures
09/25/2007US7273769 Method and apparatus for removing encapsulating material from a packaged microelectronic device
09/25/2007US7273768 Wafer-level package and IC module assembly method for the wafer-level package
09/25/2007US7273767 Method of manufacturing a cavity package
09/25/2007US7273766 Variable density and variable persistent organic memory devices, methods, and fabrication
09/25/2007US7273765 Solid-state imaging device and method for producing the same
09/25/2007US7273764 Sensor with at least one micromechanical structure, and method for producing it
09/25/2007US7273763 Method of producing a micro-electromechanical element
09/25/2007US7273762 Microelectromechanical (MEM) device including a spring release bridge and method of making the same
09/25/2007US7273761 Box-in-box field-to-field alignment structure
09/25/2007US7273760 Semiconductor device and method of manufacturing the same
09/25/2007US7273732 Systems and methods for nanowire growth and harvesting
09/25/2007US7273664 Preparation method of a coating of gallium nitride
09/25/2007US7273660 Mixed composition interface layer and method of forming
09/25/2007US7273657 Electronics, opto-electronic, magneto-electronics and magneto-optics devices, single crystal, integrated circuits
09/25/2007US7273647 Silicon annealed wafer and silicon epitaxial wafer
09/25/2007US7273638 High density plasma oxidation
09/25/2007US7273636 Patterning of solid state features by direct write nanolithographic printing
09/25/2007US7273598 Diamondoid-containing materials for passivating layers in integrated circuit devices
09/25/2007US7273566 Etchant composed of a carrier gas; CH2F2; CF4; and C4F6 and/or C5F8; good selectivity to both nitrides and field oxides; integrated circuits produced using these etchants are less likely to be defective due to photoresist mask misalignment
09/25/2007US7273565 Method for manufacturing a photonic device and a photonic device
09/25/2007US7273564 Method and apparatus for fabricating flat panel display
09/25/2007US7273533 Plasma processing system with locally-efficient inductive plasma coupling
09/25/2007US7273526 Thin-film deposition apparatus
09/25/2007US7273525 Methods for forming phosphorus- and/or boron-containing silica layers on substrates
09/25/2007US7273407 Transparent polishing pad
09/25/2007US7273385 Holding device for holding a tested electronic module
09/25/2007US7273339 Powder transport method and apparatus
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