Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
09/2007
09/20/2007DE102006002753A1 Verfahren und Anordnung zur Bewertung der Unterätzung von tiefen Grabenstrukturen in SOI-Scheiben Method and apparatus for evaluating the undercutting of deep grave structures in SOI wafers
09/20/2007DE102005061248B4 Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht System carrier having embedded in plastics material surfaces, methods of manufacturing a system carrier, and use of a layer as a bonding layer
09/20/2007DE102005057255B4 Speicherkondensator und Verfahren zum Herstellen eines solchen Speicherkondensators Storage capacitor and method for manufacturing such a storage capacitor
09/20/2007DE102004063912B4 Verfahren zum versandfertigen Verpacken von Halbleiterscheiben A method for shipping the finished packaging of semiconductor wafers
09/20/2007DE102004041556B4 Laterale Schottky-Diode und Verfahren zu ihrer Herstellung Lateral Schottky diode and methods for their preparation
09/19/2007EP1835791A2 Method of laser welding, manufactoring method of control unit, and car electronic control unit
09/19/2007EP1835544A2 Semiconductor device and manufacturing method of the same
09/19/2007EP1835543A1 Method for manufacturing semiconductor device
09/19/2007EP1835542A2 Semiconductor device with trench gate
09/19/2007EP1835536A2 Integrated passive device substrate
09/19/2007EP1835535A2 1T DRAM memory on bulk silicon and method for fabricating the same
09/19/2007EP1835534A1 Method of manufacturing a thin film
09/19/2007EP1835533A1 Method for manufacturing compound material wafers and method for recycling a used donor substrate
09/19/2007EP1835532A1 A conveyance apparatus having an improved compact conveying mechanism
09/19/2007EP1835531A2 Semiconductor device
09/19/2007EP1835530A2 Non-volatile memory device and method of manufacturing the same
09/19/2007EP1835529A1 Method for manufacturing semiconductor device
09/19/2007EP1835528A2 Process for fabricating a semiconductor device with metallic gate and semiconductor device
09/19/2007EP1835527A1 Projection optical system, exposure apparatus, exposure system, and exposure method
09/19/2007EP1835346A1 Photosensitive silane coupling agent, method of forming pattern, and method of fabricating device
09/19/2007EP1835344A1 Silicon-containing photosensitive composition, method for forming thin film pattern using same, protective film for electronic device, gate insulating film and thin film transistor
09/19/2007EP1835054A2 Gallium nitride substrate and methods for testing and manufacturing it
09/19/2007EP1835047A1 Opposing target type sputter device
09/19/2007EP1834752A1 Resin-sealed mold and resin-sealed device
09/19/2007EP1834708A2 Substrate cleaning method, substrate cleaning system and program storage medium
09/19/2007EP1834357A2 Semiconductor structures utilizing thin film resistors and tungsten plug connectors and methods for making the same
09/19/2007EP1834353A1 Method for producing semiconductor chips from a wafer
09/19/2007EP1834352A1 Double-sided electronic module for hybrid smart card
09/19/2007EP1834351A1 Method for producing an electronic circuit
09/19/2007EP1834349A1 Semiconductor substrate, semiconductor device and method of manufacturing a semiconductor substrate
09/19/2007EP1834348A2 Fabrication of strained heterojunction structures
09/19/2007EP1834347A1 Electroluminescent organic light emitting device and production method thereof
09/19/2007EP1833980A2 Enzyme activity measurements using bio-layer interferometry
09/19/2007EP1833640A1 Substrate holding device and polishing apparatus
09/19/2007EP1730777B1 Improved layout of a sram memory cell
09/19/2007EP1535286B1 Contactless uniform-tunneling separate p-well (cusp) non-volatile memory array architecture, fabrication and operation
09/19/2007EP1523695B1 Nozzle assembly for applying a liquid to a substrate
09/19/2007EP1474827A4 Eliminating substrate noise by an electrically isolated high-voltage i/o transistor
09/19/2007EP1469971B1 Grooved rollers for a linear chemical mechanical planarization system
09/19/2007EP1360712B1 Post chemical-mechanical planarization (cmp) cleaning composition
09/19/2007EP1198828B1 Method for producing a semiconductor memory component
09/19/2007EP1163499B1 Determination of the substrate temperature by measuring the thickness of a copper oxide layer
09/19/2007EP1113502B1 Method of manufacturing thin-film transistor
09/19/2007EP1102525B1 Printed wiring board and method for producing the same
09/19/2007CN200950436Y Super-thin pencil for writing directly electronic/photoelectronic component
09/19/2007CN200948658Y Plastic sealing mold of plastic sealing body for processing IC package
09/19/2007CN101040573A Device with mounted electronic parts, method of producing the same, protection circuit module of secondary battery, and battery package
09/19/2007CN101040389A Method for producing planar transporting resonance heterostructures
09/19/2007CN101040386A Semiconductor device and its manufacturing method
09/19/2007CN101040379A Feeding apparatus and feeding method for semiconductor lead frame
09/19/2007CN101040377A BiCMOS compatible JFET device and method of manufacturing same
09/19/2007CN101040376A Manufacturing method for semiconductor chips
09/19/2007CN101040375A Long-term heat-treated integrated circuit arrangements and methods for producing the same
09/19/2007CN101040374A Semiconductor device having a frontside contact and vertical trench isolation and method of fabricating same
09/19/2007CN101040373A Method for encapsulating an electronic component using a plastic object, and plastic object
09/19/2007CN101040372A Au alloy bonding wire
09/19/2007CN101040371A Direct liquid injection system and method for forming multi-component dielectric films
09/19/2007CN101040370A Polishing apparatus and polishing method
09/19/2007CN101040369A Laser beam machining method
09/19/2007CN101040368A Method for fabrication of group iii nitride semiconductor
09/19/2007CN101040367A Shot shape measuring method, mask
09/19/2007CN101040366A Plasma source for uniform plasma distribution in plasma chamber
09/19/2007CN101040290A Die-level traceability mechanism for semiconductor assembly and test facility
09/19/2007CN101040235A Temperature adjusting method, heat treatment equipment and semiconductor device manufacturing method
09/19/2007CN101040221A Composition for forming bottom anti-reflective coating containing aromatic sulfonic acid ester compound and light photoacid-generating agent
09/19/2007CN101040220A Sulfur-atom-containing composition for forming of lithographic antireflection film
09/19/2007CN101040126A Bearing device and stage device, and exposure device
09/19/2007CN101040023A Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
09/19/2007CN101040021A Cmp composition with a polymer additive for polishing noble metals
09/19/2007CN101039552A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039551A Substrate with embedded element and manufacturing method thereof
09/19/2007CN101039550A Method of forming metal wiring and method of manufacturing active matrix substrate
09/19/2007CN101039544A Plasma processor with electrode simultaneously responsive to plural frequencies
09/19/2007CN101039543A Adjustable height pif probe
09/19/2007CN101038986A Adjoining apparatus and nozzle unit therefor
09/19/2007CN101038945A Package structure for solid light-emitting element and method for manufacturing same
09/19/2007CN101038943A Method for preparation of a-b orientated ZnO nanometer linear array
09/19/2007CN101038938A Thin film semiconductor device and method for manufacturing same
09/19/2007CN101038937A Thin film semiconductor device and method for manufacturing same
09/19/2007CN101038936A Semiconductor-on-insulator substrate and devices, and methods for forming the same
09/19/2007CN101038935A Thin-film transistor structure and method of manufacture thereof
09/19/2007CN101038934A 半导体器件 Semiconductor devices
09/19/2007CN101038933A Structure and method for controlling the behavior of dislocations in strained semiconductor layers
09/19/2007CN101038932A Electroluminescent device, method for manufacturing electroluminescent device, and electronic apparatus
09/19/2007CN101038928A Solid-state imaging device and method for manufacturing thereof
09/19/2007CN101038927A Image sensor with high fill factor pixels and method for forming an image sensor
09/19/2007CN101038925A Thin film transistor plate and method for fabricating the same
09/19/2007CN101038924A Semiconductor storage device and method of manufacturing same
09/19/2007CN101038923A Non-volatile memory device and method of manufacturing the same
09/19/2007CN101038920A Semiconductor structures and its forming method
09/19/2007CN101038918A Semiconductor integrated circuit device and dummy pattern arrangement method
09/19/2007CN101038915A Pixel structure and forming method thereof
09/19/2007CN101038909A Electronic subassembly, electronic assembly, and method for producing an electronic assembly
09/19/2007CN101038907A Method for forming interconnect structure and the formed interconnect structure
09/19/2007CN101038906A Interlayer connecting line structure of three-dimensional storage and method for making the same
09/19/2007CN101038905A Interconnect structure with a barrier-redundancy feature
09/19/2007CN101038904A Semiconductor device and method for manufacturing same
09/19/2007CN101038900A Heat sink, electronic device, method of manufacturing heat sink, and method of manufacturing electronic device
09/19/2007CN101038899A Heat sink mounting device and mounting method, and server blade using the same
09/19/2007CN101038898A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof