Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2007
10/03/2007CN101048874A Iusulated gate semiconductor device and method for producing the same
10/03/2007CN101048873A Versatile system for triple-gated transistors with engineered corners
10/03/2007CN101048868A Method for manufacturing semiconductor device having three-dimensional multilayer structure
10/03/2007CN101048862A SOI substrate materials and method to form Si-containing SOI and underlying substrate with different orientations
10/03/2007CN101048861A Elevator-based tool loading and buffering system
10/03/2007CN101048860A Vertical-type electric contactor and manufacture method thereof
10/03/2007CN101048859A Method for improved alignment tolerance in a bipolar transistor and related structure
10/03/2007CN101048858A 绝缘膜形成方法及基板处理方法 An insulating film formation method and substrate processing method
10/03/2007CN101048857A Recovery of hydrophobicity of low-K and ultra low-K organosilicate films used as inter metal dielectrics
10/03/2007CN101048856A Yttria insulator ring for use inside a plasma chamber
10/03/2007CN101048855A Light emitting device processes
10/03/2007CN101048854A Exposure apparatus and device producing method
10/03/2007CN101048853A Precursor for film formation and method for forming ruthenium-containing film
10/03/2007CN101048852A Substrate carrier for parallel wafer processing reactor
10/03/2007CN101048851A Magnetoresistive random access memory device structures and methods for fabricating the same
10/03/2007CN101048705A Lower layer film-forming composition for lithography containing cyclodextrin compound
10/03/2007CN101048703A Positive photosensitive insulating resin composition and cured product of the same
10/03/2007CN101048690A Optical system, lens barrel, exposure system, and production method for device
10/03/2007CN101048327A Carrying system, substrate treating device, and carrying method
10/03/2007CN101048285A Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
10/03/2007CN101048040A Method for fabricating a PCB
10/03/2007CN101048029A Microwave plasma processing apparatus, method for manufacturing microwave plasma processing apparatus and plasma processing method
10/03/2007CN101047221A LED package structure and method for manufacturing the same
10/03/2007CN101047215A Diamond substrate and manufacturing method thereof
10/03/2007CN101047214A Package method for high power LED
10/03/2007CN101047208A Nonvolatile semiconductor memory device and manufacturing method thereof
10/03/2007CN101047207A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047206A Semiconductor device with increased channel area and fabrication method thereof
10/03/2007CN101047205A Design method for injection efficiency controlled gate-commutated thyristor IEC-GCT
10/03/2007CN101047202A Manufacturing method for luminescent device, luminescent device and electric device
10/03/2007CN101047201A Luminescent device, manufacturing method thereof and electric device
10/03/2007CN101047200A Organic electroluminescent display device and fabrication methods thereof
10/03/2007CN101047199A Organic electroluminescent display device and fabrication methods thereof
10/03/2007CN101047198A Structure and method for improving contact resistance of organic LED integral color filter
10/03/2007CN101047196A Integrated crystal silicon solar battery and its manufacturing method
10/03/2007CN101047195A Semiconductor imaging device and method for manufacturing the same
10/03/2007CN101047194A Picture element and its forming method, storage capacitor, display panel and photoelectric device
10/03/2007CN101047193A Semiconductor storage device and method of fabrication thereof
10/03/2007CN101047190A Nonvolatile semiconductor storage device and method for manufacturing the same
10/03/2007CN101047189A Ferroelectric capacitor and ferroelectric field effect tube and manufacturing method thereof
10/03/2007CN101047187A 存储器及其制造方法 Memory and manufacturing method thereof
10/03/2007CN101047184A 电容结构及其制作方法 Capacitor structure and method of making
10/03/2007CN101047183A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047182A Semiconductor structure and its forming method
10/03/2007CN101047176A Semiconductor chip and its manufacturing method
10/03/2007CN101047173A Manufacturing method of metal-isolating layer-metal capacitor
10/03/2007CN101047170A Semiconductor device and manufacturing method thereof
10/03/2007CN101047164A Roughness reducing film at interface, materials for forming roughness reducing film at interface, wiring layer and semiconductor device prepared by the same, and method for manufacturing semiconductor
10/03/2007CN101047163A Semiconductor device and method for manufacturing the same
10/03/2007CN101047161A Design of low inductance embedded capacitor layer connections
10/03/2007CN101047160A Semiconductor connection line packaging structure and its method of connection with IC
10/03/2007CN101047159A Multilayer interconnection substrate, semiconductor device, and solder resist
10/03/2007CN101047158A Semiconductor device and fabrication process thereof
10/03/2007CN101047156A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047155A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
10/03/2007CN101047154A 半导体装置及其形成方法 Semiconductor device and method of forming
10/03/2007CN101047153A 半导体集成电路芯片及其形成方法 And method of forming a semiconductor integrated circuit chip
10/03/2007CN101047152A Semiconductor device and a method of manufacturing the same
10/03/2007CN101047151A Method for forming isolation structure in nonvolatile memory device
10/03/2007CN101047150A Method of manufacturing flash memory device
10/03/2007CN101047149A Manufacturing method for non-refrigeration infrared focal plane array based on silicon substrate without sacrifice layer
10/03/2007CN101047148A Manufacturing method of semiconductor device and semiconductor device corresponding to loop back test
10/03/2007CN101047147A IC structure and its making method
10/03/2007CN101047146A Method of manufacturing semiconductor device
10/03/2007CN101047145A Method for preparing metal wire in active drive TFT matrix
10/03/2007CN101047144A Method for fabricating a compound-material and method for choosing a wafer
10/03/2007CN101047143A Basal plate carrying table and basal plate processing device
10/03/2007CN101047142A Static electricity suction cup
10/03/2007CN101047141A Level adjustment systems and adjustable pin chuck thereof
10/03/2007CN101047140A Substrate transferring apparatus, substrate processing apparatus, and substrate processing method
10/03/2007CN101047139A Method for handling and transferring a wafer case, and holding part used therefor
10/03/2007CN101047138A Chip transport box and operation method of chip transport box
10/03/2007CN101047137A Method of correcting bonding coordinates using reference bond pads
10/03/2007CN101047136A Manufacturing method of mobile storage equipment
10/03/2007CN101047135A Gold/silicon eutectic die bonding method
10/03/2007CN101047134A Method of chip grade packaging
10/03/2007CN101047133A Manufacturing method for LED module
10/03/2007CN101047132A Method of etching low dielectric constant films
10/03/2007CN101047131A Method for manufacturing insulated-gate type field effect transistor
10/03/2007CN101047130A Top-gate thin-film transistors using nanoparticles and method of manufacturing the same
10/03/2007CN101047129A Semiconductor structure and method for forming N type MOS transistor
10/03/2007CN101047128A A gettering method and a wafer using the same
10/03/2007CN101047127A Plasma etching method, etching device, storage medium
10/03/2007CN101047126A Method of repairing damaged film having low dielectric constant, semiconductor fabricating device and storage medium
10/03/2007CN101047125A Removal profile tuning by adjusting conditioning sweep profile on a conductive pad
10/03/2007CN101047124A Method for manufacturing semiconductor device
10/03/2007CN101047123A Semiconductor element, semiconductor device, and method of manufacturing the same
10/03/2007CN101047122A Manufacturing method for cilicon epitaxial wafer for 6'' VDMOS tube
10/03/2007CN101047121A Reflow method, pattern generating method, and fabrication method for tft element for LCD
10/03/2007CN101047120A Reflow method, pattern generating method, and fabrication method for TFT element for LCD
10/03/2007CN101047119A Method for fabricating semiconductor device having bulb-shaped recess gate
10/03/2007CN101047118A Plasma processing apparatus and plasma processing method
10/03/2007CN101047117A Substrate processing apparatus
10/03/2007CN101047116A Substrate processing apparatus
10/03/2007CN101047115A Substrate processing apparatus and substrate transferring method
10/03/2007CN101047114A Plasma processing apparatus and plasma processing method
10/03/2007CN101047113A Plasma processing apparatus and plasma processing method
10/03/2007CN101047112A Plasma processing method and plasma processing apparatus
10/03/2007CN101047111A Laser annealing apparatus
10/03/2007CN101047110A Substrate processing apparatus and substrate processing method