Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/07/2014CN103779421A 薄膜晶体管结构及其制作方法 Thin-film transistor structure and fabrication method thereof
05/07/2014CN103779418A 一种新型结构的遂穿场效应晶体管及其制备方法 Tunneling field effect transistor and method for preparing a new structure
05/07/2014CN103779417A 一种基于复合漏极的高压器件及其制作方法 A high-pressure device and fabrication method based on a composite drain
05/07/2014CN103779416A 一种低vf的功率mosfet器件及其制造方法 A power mosfet device and manufacturing method of a low-vf
05/07/2014CN103779415A 平面型功率mos器件及其制造方法 Planar type power mos device and manufacturing method
05/07/2014CN103779414A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
05/07/2014CN103779413A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779412A 一种基于耗尽型高压器件及其制作方法 A high-voltage depletion mode device and fabrication method based on
05/07/2014CN103779411A 基于超结槽栅的高压器件及其制作方法 Ultra-high-voltage junction grooved gate device and its production method based on
05/07/2014CN103779410A 基于超结漏场板的槽栅高压器件及其制作方法 Trench-gate ultra-high-voltage device and fabrication method based on junction leakage field plate
05/07/2014CN103779409A 基于耗尽型AlGaN/GaN HEMT器件结构及其制作方法 Based depletion mode AlGaN / GaN HEMT device structure and manufacturing method thereof
05/07/2014CN103779408A 基于耗尽型槽栅AlGaN/GaN HEMT器件结构及其制作方法 Based depletion type trench gate AlGaN / GaN HEMT device structure and manufacturing method thereof
05/07/2014CN103779407A 加源场板耗尽型AlGaN/GaN HEMT器件结构及其制作方法 Plus source field plate depletion mode AlGaN / GaN HEMT device structure and manufacturing method thereof
05/07/2014CN103779406A 加源场板耗尽型绝缘栅AlGaN/GaN器件结构及其制作方法 Plus source depletion type insulated gate field plate AlGaN / GaN device structure and manufacturing method thereof
05/07/2014CN103779405A GaAs衬底上生长赝配高电子迁移晶体管材料及方法 Grown on a GaAs substrate pseudomorphic high electron mobility transistor material and methods
05/07/2014CN103779402A 半导体结构与其制造方法 Semiconductor structure and its manufacturing method
05/07/2014CN103779401A 栅极结构及其制造方法 The gate structure and manufacturing method
05/07/2014CN103779400A 一种复合电极及其制备方法 A composite electrode and its preparation method
05/07/2014CN103779398A 带源场板槽栅AlGaN/GaN HEMT器件结构及其制作方法 With source field plate trench-gate AlGaN / GaN HEMT device structure and manufacturing method thereof
05/07/2014CN103779397A InAlN/InGaN异质结材料结构及其生长方法 InAlN / InGaN heterojunction material structure and its growth method
05/07/2014CN103779396A 石墨烯基复合结构及其制备方法 Graphene-based composite structure and a method for preparing
05/07/2014CN103779395A 一种具有阈开关效应的多铁陶瓷半导体及其制备的方法 The method of preparation of a ceramic semiconductor and having a threshold switching effect of multiferroic
05/07/2014CN103779394A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779393A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779391A 一种具有搭桥晶粒结构的多晶硅薄膜及其制备方法 Polysilicon thin film preparation method thereof having bypass grain structure
05/07/2014CN103779382A 有机发光显示装置及其测试方法 The organic light emitting display device and test methods
05/07/2014CN103779380A 有机发光装置及其制造方法 The organic light emitting device and manufacturing method
05/07/2014CN103779377A 有机发光显示器及其制作方法 Organic light emitting display and production methods
05/07/2014CN103779376A 集成电路及其制造方法 And a method of manufacturing an integrated circuit
05/07/2014CN103779360A 显示基板及其制作方法、显示装置 Display substrate and its production method, a display device
05/07/2014CN103779359A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779358A 一种阵列基板及其制作方法、显示装置 One kind of array substrate and method of manufacturing a display device
05/07/2014CN103779357A 一种阵列基板、显示装置及阵列基板制造方法 One kind of array substrate, a display device and a method of manufacturing an array substrate
05/07/2014CN103779356A 一种显示面板母板及其制备方法 A panel displays the motherboard and its preparation method
05/07/2014CN103779354A 薄膜晶体管矩阵面板及其制造方法 The thin film transistor array panel and a method of manufacturing
05/07/2014CN103779353A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779352A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN103779351A 三维封装结构及其制造方法 Three-dimensional packaging structure and manufacturing method thereof
05/07/2014CN103779350A 一种肖特基二极管氢气传感器芯体及该芯体的制造方法 A method of manufacturing a Schottky diode, and the hydrogen gas sensor of the core of the core
05/07/2014CN103779340A 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
05/07/2014CN103779336A 具有集成天线的半导体封装及其形成方法 The semiconductor package with integrated antennas and method of forming
05/07/2014CN103779335A 高电阻薄膜电阻器及形成所述电阻器的方法 High resistance thin film resistor and method of forming the resistor
05/07/2014CN103779328A 一种半导体器件的测试结构及测试方法 Test structures and test method of a semiconductor device
05/07/2014CN103779324A 穿硅孔堆叠结构以及其制作方法 Through silicon holes stacked structure and its manufacturing method
05/07/2014CN103779323A 柔性嵌入式光互连结构及其制作方法 Flexible Embedded optical interconnect structure and production methods
05/07/2014CN103779322A 镶嵌间隙结构 Mosaic gap structure
05/07/2014CN103779321A 具有接触插栓的半导体结构与其形成方法 Semiconductor structure having a contact plug its formation method
05/07/2014CN103779318A 包括凹陷有源区的半导体器件及形成该半导体器件的方法 The semiconductor device includes a recessed region of the active semiconductor device and a method of forming the
05/07/2014CN103779317A 半导体结构与降低半导体结构中信号干扰的方法 The semiconductor structure of the semiconductor structure to reduce signal interference method
05/07/2014CN103779314A 封装基板及其制作方法 Package substrate and its making method
05/07/2014CN103779312A 嵌入式芯片封装及用于制造嵌入式芯片封装的方法 The embedded chip package and a method for the manufacture of embedded chip package
05/07/2014CN103779311A 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN103779309A 镀金金银钯合金单晶键合丝及其制造方法 Gold-plated and silver-palladium alloy crystal bonding wire and its manufacturing method
05/07/2014CN103779308A 金银钯合金单晶键合丝及其制造方法 Silver-palladium alloy crystal bonding wire and its manufacturing method
05/07/2014CN103779307A 一种全免清洗软钎焊功率模块及制备方法 One kind of Shipping cleaning soldering power module and preparation methods
05/07/2014CN103779306A 一种封装结构、封装方法及在封装方法中使用的模板 A package structure, packaging methods and templates used in the encapsulation method
05/07/2014CN103779304A 焊料连接结构、其制造方法、表面安装结构和安装方法 Solder connection structure, manufacturing method, surface mounting structure and installation methods
05/07/2014CN103779303A 凸点式封装及其形成方法 Bump package and method of forming
05/07/2014CN103779302A 具有大焊盘的封装集成电路及其形成方法 Packaged integrated circuit having a large pad and method of forming
05/07/2014CN103779299A 半导体封装件及其制法 The semiconductor package Jiqizhifa
05/07/2014CN103779298A 立体堆叠式封装结构及其制作方法 Three-dimensional stacked package structure and production methods
05/07/2014CN103779297A 金属凸块接合结构 Metal bump bonding structure
05/07/2014CN103779287A 超薄微型贴片微功耗声控传感器用封装芯片及其封装方法 Packaged chips and thin micro SMD packaging method micropower voice sensor
05/07/2014CN103779286A 一种封装结构、封装方法及在封装方法中使用的模板 A package structure, packaging methods and templates used in the encapsulation method
05/07/2014CN103779283A 封装器件、封装器件的制造方法以及封装方法 Packaged device manufacturing method, packaged devices and encapsulation method
05/07/2014CN103779281A 制作晶体管的方法 Production methods transistor
05/07/2014CN103779280A 高介电层金属栅器件的制造方法 The method of manufacturing the high dielectric layer metal gate devices
05/07/2014CN103779279A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/07/2014CN103779278A Cmos管的形成方法 The method for forming Cmos tube
05/07/2014CN103779277A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/07/2014CN103779276A Cmos制造方法 Cmos manufacturing method
05/07/2014CN103779275A Cmos制造方法 Cmos manufacturing method
05/07/2014CN103779274A 一种恒电流二极管单元及其制作方法 One kind of constant current diode unit and its manufacturing method
05/07/2014CN103779273A 晶片的加工方法 Wafer processing method
05/07/2014CN103779272A 晶体管阵列及其制备方法 Transistor array and its preparation method
05/07/2014CN103779271A 一种倒锥形轮廓刻蚀方法 An inverted cone-shaped contour etching method
05/07/2014CN103779270A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/07/2014CN103779269A 互连中铜表面处理的方法 The method of surface treatment of copper interconnects
05/07/2014CN103779268A 互连结构中形成图案化金属硬掩膜的方法 Metal hard mask patterned interconnect structure formed in a method
05/07/2014CN103779267A 一种半导体结构的形成方法 The method for forming a semiconductor structure
05/07/2014CN103779266A 背面穿硅通孔与金属连线制法、和背面用的光掩模制法 The back of the through silicon via hole and metal wiring manufacturing method, and the back with a photomask manufacturing method
05/07/2014CN103779265A 一种半导体器件的制造方法 A method of manufacturing a semiconductor device
05/07/2014CN103779264A 一种浅沟槽隔离结构的制造方法 A method for manufacturing a shallow trench isolation structure
05/07/2014CN103779263A 一种基于自对准双图案的半导体器件的制造方法 Based on method of manufacturing a self-aligned double patterning of a semiconductor device
05/07/2014CN103779262A 一种控制晶舟升降运动的原点定位方法 A method for locating the origin of the grain elevator motion control boat
05/07/2014CN103779261A 夹持台顶面定位模块及具有该模块的引线键合机 The top surface of the clamping station positioning module and wire bonder with this module
05/07/2014CN103779260A 夹持装置及工件输送机械手 Workpiece clamping device and the transport robot
05/07/2014CN103779259A 一种晶片传输系统的布局 A wafer transfer system layout
05/07/2014CN103779258A 一种半导体热处理设备的加热装置、维修件及维修方法 Heating apparatus of a semiconductor heat treatment equipment, repair parts and repair methods
05/07/2014CN103779257A 一种防止晶圆放置时发生漂移的热板 A hot plate to prevent the drift occurs when the wafer is placed
05/07/2014CN103779256A 一种硅基衬底扩散片的清洗方法 A method of cleaning a silicon substrate, a diffusion sheet
05/07/2014CN103779255A 暂时性粘合 Temporary bonding
05/07/2014CN103779254A 基板处理装置、基板处理系统及基板处理装置的控制方法 Control method for a substrate processing apparatus, the substrate processing system and a substrate processing apparatus
05/07/2014CN103779253A 兼容不同基板装载的装载机构 Compatible with different loading of the substrate loading mechanism
05/07/2014CN103779252A 一种用于圆片级键合中颗粒污染的在线检测结构 Online detection structure for wafer-level bonding in particle contamination
05/07/2014CN103779251A 一种cob绑定线测试方法 One kind of binding wire test method cob
05/07/2014CN103779250A 用于倒装芯片的电学测试的装置和方法 Flip-chip device and method for electrical testing
05/07/2014CN103779249A 半导体结构的测试方法 Test method for a semiconductor structure
05/07/2014CN103779248A 一种半导体器件制备过程的监控系统及方法 A method of monitoring the preparation process of the system and method of the semiconductor device
05/07/2014CN103779247A 一种将功率半导体模块端子焊接到基板的方法 A power semiconductor module to the terminal welding method of a substrate
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