Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/08/2014US20140127832 Forming method of an annular storage unit of a magneto-resistive memory
05/08/2014US20140126987 Substrate transport apparatus
05/08/2014US20140126290 Memory arrays with a memory cell adjacent to a smaller size of a pillar having a greater channel length than a memory cell adjacent to a larger size of the pillar and methods
05/08/2014US20140126286 Single-level cell endurance improvement with pre-defined blocks
05/08/2014US20140126105 Capacitor structure and process for fabricating the same
05/08/2014US20140126091 Protection Device And Related Fabrication Methods
05/08/2014US20140125421 Semiconductor device and manufacturing method thereof
05/08/2014US20140124962 Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
05/08/2014US20140124960 Packaged semiconductor assemblies and methods for manufacturing such assemblies
05/08/2014US20140124955 Package-on-package structure including a thermal isolation material and method of forming the same
05/08/2014US20140124954 Method and structure of forming backside through silicon via connections
05/08/2014US20140124950 Semiconductor substrate and fabrication method thereof
05/08/2014US20140124949 Semiconductor device and method of manufacturing semiconductor device
05/08/2014US20140124947 Methods and Apparatus for Flip Chip Substrate with Guard Rings Outside of a Die Attach Region
05/08/2014US20140124946 Enhanced capture pads for through semiconductor vias
05/08/2014US20140124945 Semiconductor structure and manufacturing method of the same
05/08/2014US20140124943 Integrated decoupling capacitor utilizing through-silicon via
05/08/2014US20140124940 Flexible routing for chip on board applications
05/08/2014US20140124939 Discrete device mounted on substrate
05/08/2014US20140124938 Stress relief for plastic encapsulated devices
05/08/2014US20140124937 Contoured Package-on-Package Joint
05/08/2014US20140124936 Power semiconductor module and method of manufacturing same
05/08/2014US20140124935 Sputter and surface modification etch processing for metal patterning in integrated circuits
05/08/2014US20140124933 Copper interconnect structures and methods of making same
05/08/2014US20140124932 Integrated circuit device having a copper interconnect
05/08/2014US20140124928 Semiconductor packaging structure and method for forming the same
05/08/2014US20140124927 Semiconductor ic packaging methods and structures
05/08/2014US20140124926 Method And System For A Chaser Pellet In A Semiconductor Package Mold Process
05/08/2014US20140124920 Stud bump structure and method for manufacturing the same
05/08/2014US20140124919 Semiconductor device and semiconductor process
05/08/2014US20140124918 Thermal improvement of integrated circuit packages
05/08/2014US20140124917 Method and system for controlling chip inclination during flip-chip mounting
05/08/2014US20140124916 Molded Underfilling for Package on Package Devices
05/08/2014US20140124906 Semiconductor package and method of manufacturing the same
05/08/2014US20140124904 Epitaxial layer and method of forming the same
05/08/2014US20140124903 Structures, methods and applications for electrical pulse anneal processes
05/08/2014US20140124900 Through-silicon via (tsv) die and method to control warpage
05/08/2014US20140124899 Integrated bondline spacers for wafer level packaged circuit devices
05/08/2014US20140124898 Cvd-free, scalable processes for the production of silicon micro- and nanostructures
05/08/2014US20140124895 Radiation induced diode structure
05/08/2014US20140124893 Varactor Diode, Electrical Device and Method for Manufacturing Same
05/08/2014US20140124891 Fuse device
05/08/2014US20140124889 Die seal ring for integrated circuit system with stacked device wafers
05/08/2014US20140124877 Conductive interconnect including an inorganic collar
05/08/2014US20140124876 Metal gate structure for midgap semiconductor device and method of making same
05/08/2014US20140124874 Metal-Gate MOS Transistor and Method of Forming the Transistor with Reduced Gate-to-Source and Gate-to-Drain Overlap Capacitance
05/08/2014US20140124873 Robust replacement gate integration
05/08/2014US20140124869 Semiconductor Device and Method of Forming the Same
05/08/2014US20140124865 Semiconductor device including low-k dielectric cap layer for gate electrodes and related methods
05/08/2014US20140124863 Method and structure for forming a localized soi finfet
05/08/2014US20140124860 Method and structure for forming a localized soi finfet
05/08/2014US20140124859 Semiconductor structure and method for manufacturing the same
05/08/2014US20140124858 Semiconductor device and fabricating method thereof
05/08/2014US20140124856 Semiconductor device and fabricating method thereof
05/08/2014US20140124849 B4-flash device and the manufacturing method therof
05/08/2014US20140124847 Semiconductor devices and methods for manufacturing the same
05/08/2014US20140124842 Contact Structure of Semiconductor Device
05/08/2014US20140124841 Methods of forming replacement gate structures on semiconductor devices and the resulting device
05/08/2014US20140124840 Prevention of fin erosion for semiconductor devices
05/08/2014US20140124838 High speed sige hbt and manufacturing method thereof
05/08/2014US20140124837 Nitride semiconductor device and method for manufacturing same
05/08/2014US20140124834 Method of fabricating semiconductor device
05/08/2014US20140124826 Method of surface treatment of group iii nitride crystal film, group iii nitride crystal substrate, group iii nitride crystal substrate with epitaxial layer, and semiconductor device
05/08/2014US20140124817 Contact Layers
05/08/2014US20140124794 Fabrication of reverse shallow trench isolation structures with super-steep retrograde wells
05/08/2014US20140124792 Ni-rich schottky contact
05/08/2014US20140124788 Chemical Vapor Deposition System
05/08/2014US20140124787 Thin film transistor and manufacturing method thereof and display device
05/08/2014US20140124777 Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package
05/08/2014US20140124776 Metal oxide film and method for forming metal oxide film
05/08/2014US20140124745 Organic light emitting display apparatus and method of inspecting the same
05/08/2014US20140124741 Devices containing organic polymeric multi-metallic composites
05/08/2014US20140124712 Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases
05/08/2014US20140124669 Waveguide end-coupled infrared detector
05/08/2014US20140123997 Gigasonic Brush for Cleaning Surfaces
05/08/2014DE112012003409T5 Epitaktischer Lift-Off mit hohem Durchsatz für flexible Elektronik Epitaxial lift-off high throughput for flexible electronics
05/08/2014DE112012003344T5 Ingotzuchtvorrichtung und Verfahren zur Herstellung eines Ingots Ingotzuchtvorrichtung and method for producing an ingot
05/08/2014DE112012003297T5 Deckschichten für verbesserte Kristallisation Layers for improved crystallization
05/08/2014DE112012003228T5 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
05/08/2014DE112012003035T5 Siliziumkarbidsubstrat, Halbleitervorrichtung und Verfahren zum Herstellen derselben Silicon carbide substrate, semiconductor device, and method for manufacturing the same
05/08/2014DE112012001986T5 Bipolares Punch-Through-Halbleiterbauelement und Verfahren zur Herstellung eines derartigen Halbleiterbauelements Bipolar punch-through semiconductor device and method of manufacturing such a semiconductor device
05/08/2014DE112006000261B4 Verfahren zur Herstellung eines kapazitiven Elements mittels Ätzverfahren A method of manufacturing a capacitance element by means of etching
05/08/2014DE102013222224A1 Varaktordiode, elektrisches bauelement und herstellungsverfahren Varactor diode, electric-device and manufacturing processes
05/08/2014DE102013222147A1 Spannungsentlastung für in Kunststoff verkapselte Bauelemente Stress relief for encapsulated in plastic components
05/08/2014DE102013221950A1 Mehrfach-Ladungsträgerteilchenstrahl-Schreibverfahren und Mehrfach-Ladungsträgerteilchenstrahl-Schreibvorrichtung Multiple charged particle beam writing method and multiple charged particle recording device
05/08/2014DE102013218604A1 System, Verfahren und Computerprogrammprodukt zum Testen eines integrierten Schaltkreises aus einer Befehlszeile System, method and computer program product for testing an integrated circuit from a command line
05/08/2014DE102013112215A1 Gekapselte nanostrukturierte Komponente und Verfahren zum Herstellen einer gekapselten nanostrukturierten Komponente Encapsulated nanostructured component and method of manufacturing an encapsulated nanostructured component
05/08/2014DE102013112143A1 Einstellbarer Aufnehmerkopf und Verfahren zum Herstellen einer Vorrichtung Adjustable pick-up head and method of manufacturing a device
05/08/2014DE102013111581A1 Halbleiterpackages mit integrierter Antenne und Verfahren zu deren Herstellung Semiconductor packages with an integrated antenna and processes for their preparation
05/08/2014DE102013107065A1 Bolzenkontakthügelstruktur und Verfahren zum Herstellen derselben Stud bump structure and methods for manufacturing the same
05/08/2014DE102013018381A1 Ohne Lotmaske definierte Kupferanschlussflächen und eingebettete Kupferanschlussflächen zur Reduzierung der Gehäusesystemhöhe Without solder mask defined pads and embedded copper copper pads to reduce the housing system height
05/08/2014DE102013018258A1 Weiches und konditionierbares chemisch-mechanisches Polierkissen Soft and konditionierbares chemical mechanical polishing pad
05/08/2014DE102013018192A1 Vergrabene, für Entkopplungskondensatoren verwendete TSV Buried, used for decoupling capacitors TSV
05/08/2014DE102013018191A1 Offene Lotmaske und oder offenes Dielektrikum zur Vergrösserung einer Dicke einer Abdeckung oder eines Rings und einer Kontaktfläche zur Verbesserung einer Gehäuseebenheit Open and solder mask or open dielectric to enlarge a thickness of a cover or a ring and a contact surface for improving housing flatness
05/08/2014DE102012220345A1 Method for processing a semiconductor wafer device e.g. optical wafer device, involves diluting wafer device on predetermined thickness by grinding and polishing rear surface of wafer device secured at carrier wafer with adhesive agent
05/08/2014DE102012220323A1 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
05/08/2014DE102012211424B4 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation
05/08/2014DE102012113217A1 Halbleitervorrichtung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
05/08/2014DE102012110581A1 Shuttle system for transporting article e.g. wafer in clean room used for manufacturing semiconductor circuit, has clean space shuttle which is provided with three steerable wheels that are in contact with track
05/08/2014DE102012107496B4 Metallgate-FINFET-Bauelement und Verfahren zu seiner Herstellung Metal gate FinFET device and process for its preparation
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