Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2014
05/07/2014CN102471879B 成膜装置 Film forming apparatus
05/07/2014CN102468233B 用激光切割半导体晶圆的制作方法 Laser cutting method of manufacturing a semiconductor wafer
05/07/2014CN102456740B P型场效应晶体管及其制作方法 P-type field effect transistor and manufacturing method thereof
05/07/2014CN102456648B 封装基板的制法 Preparation method of the package substrate
05/07/2014CN102437114B 薄膜晶体管基板的制造方法 The method of manufacturing a thin film transistor substrate
05/07/2014CN102428545B 等离子体处理装置以及器件的制造方法 The method of manufacturing a plasma processing apparatus and the device
05/07/2014CN102414783B 具整合混合阀的安瓿 Ampoules with the integration of the mixing valve
05/07/2014CN102412207B 电子可擦除可编程只读存储器单元 Electronically erasable programmable read-only memory cell
05/07/2014CN102404891B 微波照射装置以及微波照射方法 The microwave irradiation apparatus and microwave irradiation method
05/07/2014CN102402709B 记忆卡封装结构及其制造方法 Memory card packaging structure and manufacturing method
05/07/2014CN102396069B 碳化硅肖特基二极管的制造方法 The method of manufacturing a silicon carbide Schottky diode
05/07/2014CN102388445B 晶片输送方法和晶片输送装置 Wafer transport method and the wafer transport apparatus
05/07/2014CN102388441B 增强型GaN高电子迁移率晶体管器件及其制备方法 Enhanced GaN high electron mobility transistor device and its preparation method
05/07/2014CN102386157B 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/07/2014CN102386095B 半导体结构的制造方法 The method of manufacturing a semiconductor structure
05/07/2014CN102376592B 芯片尺寸封装件及其制法 Chip size package Jiqizhifa
05/07/2014CN102371534B 晶圆表面的化学机械研磨方法 The chemical mechanical polishing method of the wafer surface
05/07/2014CN102356457B 光检测装置以及用于在光检测装置中检测光的方法 Light detecting means for detecting light and a method of light detection means
05/07/2014CN102347271B 利用微研磨颗粒流形成半导体元件的方法 Using micro-abrasive particles flow method of forming a semiconductor device
05/07/2014CN102347250B 凸块结构的形成方法及装置 The method for forming bump structure and apparatus
05/07/2014CN102347230B 等离子体处理方法以及等离子体处理装置 The plasma processing method and a plasma processing apparatus
05/07/2014CN102347213B 薄化晶片的方法 Wafer thinning method
05/07/2014CN102339761B 封装结构的制作方法 The method of making a package structure
05/07/2014CN102332470B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN102326457B 等离子装置 Plasma devices
05/07/2014CN102326242B 超声波焊接用铝带材 Ultrasonic welding aluminum strip
05/07/2014CN102326234B 基板的处理装置以及处理方法 Processing apparatus and a substrate processing method
05/07/2014CN102322968B 沟槽式多晶硅二极管 Trench polysilicon diode
05/07/2014CN102318041B 用于电沉积铜的工艺，在穿硅通孔(tsv)中的芯片间、芯片到晶片间和晶片间的互连 Process for the electrodeposition of copper, between the through silicon vias (tsv) the chip and chip-to-chip inter-wafer interconnect
05/07/2014CN102315183B 具有应力松弛机制的包括通孔的半导体器件 A semiconductor device having a stress relaxation mechanism comprises a through-hole
05/07/2014CN102310410B 夹持装置、输送装置、处理装置和电子设备的制造方法 Method of manufacturing a clamping device, transmission means, processing means and electronic equipment
05/07/2014CN102308031B 碳化硅单晶制造用坩埚、以及碳化硅单晶的制造装置和制造方法 Crucible for producing a silicon carbide single crystal, and a manufacturing apparatus and manufacturing method for a silicon carbide single crystal
05/07/2014CN102290394B 散热型电子封装结构及其制备方法 Cooling electronic packaging structure and preparation method
05/07/2014CN102272934B 场效应晶体管、场效应晶体管的制造方法以及生物传感器 A field effect transistor, a field effect transistor, and a method of manufacturing a biosensor
05/07/2014CN102272904B 制造沟道式电容器的方法 The method of manufacturing a trench capacitor
05/07/2014CN102272234B 酞菁纳米线、含有它的油墨组合物及电子元件、以及酞菁纳米线的制造方法 Phthalocyanine nanowires, the ink composition containing it and the electronic components, and a method of manufacturing a phthalocyanine nanowires
05/07/2014CN102246607B 电极连接结构、用于电极连接结构的导电粘合剂、以及电子装置 Electrode connection structure, the conductive adhesive used for an electrode connection structure, and an electronic device
05/07/2014CN102246308B 具有增大的击穿电压特性的基于沟槽的功率半导体器件 Trench-based power semiconductor device having an increased breakdown voltage characteristics of
05/07/2014CN102226272B 用于多个基板的固持器和具有该固持器的腔室 Holder for a plurality of substrates having the holder of the chamber
05/07/2014CN102224589B 具有交互连接侧翼的整合电容器 Interactive integrated capacitor connected flanking
05/07/2014CN102222610B 半导体装置的制造方法 The method of manufacturing a semiconductor device
05/07/2014CN102194744B 具有荧光粉层的发光二极管晶片的制作方法 Method of preparing a phosphor layer of the light emitting diode chips
05/07/2014CN102177584B 具有可调电阻的硅基纳米级电阻器件 With adjustable resistance silicon based nano-level resistance device
05/07/2014CN102176466B 双端开关装置及其制造方法 Two-terminal switch devices and its manufacturing method
05/07/2014CN102176465B 可印刷半导体结构以及相关制造和组装方法 Printable semiconductor structure and the associated manufacturing and assembly methods
05/07/2014CN102172857B 一种锑化铟晶片的磨削方法 An indium antimonide wafer grinding method
05/07/2014CN102171794B 用于应变半导体器件的渐变高锗化合物膜 Graded strained semiconductor device for high germanium compound film
05/07/2014CN102169897B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN102165851B 用于恶劣环境的印刷电路板 For harsh environment printed circuit board
05/07/2014CN102157427B 载置台构造和处理装置 Stage configuration and processing means
05/07/2014CN102148136B 晶片烘干系统 Wafer drying system
05/07/2014CN102138210B 具有气隙的浅沟槽隔离结构、采用该浅沟槽隔离结构的互补金属氧化物半导体图像传感器及其制造方法 A shallow trench isolation structure having an air gap, the use of complementary metal-oxide semiconductor image sensor and a method of manufacturing a shallow trench isolation structure
05/07/2014CN102124560B 用于制造电子组件的方法 The method for manufacturing an electronic component
05/07/2014CN102117770B 支撑与握持半导体晶片的支撑结构的形成方法 The method for forming the support and holding the semiconductor wafer support structure
05/07/2014CN102112655B 原子层淀积设备和装载方法 Atomic layer deposition equipment and loading method
05/07/2014CN102105966B 离子植入设备、多模式离子源及多模式中的离子植入方法 Ion implantation devices, multi-mode and multi-mode ion source in the ion implantation method
05/07/2014CN102099699B 具有销顶端部的清洁机构的基板检查装置 The substrate inspection device of the cleaning mechanism has a distal end portion of the pin
05/07/2014CN102097385B 双位快闪存储器的制作方法 Production methods dual bit flash memory
05/07/2014CN102077331B 薄膜晶体管 The thin film transistor
05/07/2014CN102067301B 气体轴承静电夹具及用于夹持工件的方法 Gas bearing the electrostatic chuck and a method for clamping a workpiece
05/07/2014CN102066043B 抑制缩孔的无铅焊料合金 Lead-free solder alloy shrinkage suppression
05/07/2014CN102057000B 绝缘膜形成用油墨组合物、由该油墨组合物形成的绝缘膜 Forming an insulating film of the ink composition, an insulating film made of the ink composition is formed
05/07/2014CN102046338B 输送装置、位置示教方法以及传感器夹具 Conveying means, position teaching method, and a sensor jig
05/07/2014CN102034701B 一种形成介质层的方法以及抛光方法 A method of forming a dielectric layer, and a polishing method
05/07/2014CN102017055B 用于制造具有离子刻蚀表面的工件的方法 Ion etching method for producing a workpiece having a surface for
05/07/2014CN102005453B 三维结构存储器 Three-dimensional structure of the memory
05/07/2014CN101960583B 半导体装置、基本单元以及半导体集成电路 The semiconductor device, the basic unit, and the semiconductor integrated circuit
05/07/2014CN101952484B 蚀刻方法 Etching method
05/07/2014CN101944479B 基座、成膜装置及成膜方法 Base film forming apparatus and film forming method
05/07/2014CN101932750B 真空处理装置及真空处理装置的运转方法 The vacuum processing apparatus and method of operating a vacuum processing apparatus
05/07/2014CN101919045B 在半导体装置中通过使用在双应力衬层上方的额外层而获得的n沟道晶体管的增进的晶体管效能 Enhancing the efficiency of the transistor in the semiconductor device by using an extra layer of two-layer stress is obtained above the n-channel transistor
05/07/2014CN101916591B 半导体集成电路器件 The semiconductor integrated circuit device
05/07/2014CN101889325B 用于衬底的两侧溅射蚀刻的系统和方法 System and method for sputter etching on both sides of the substrate
05/07/2014CN101872740B Soi衬底的制造方法 The method of manufacturing a substrate Soi
05/07/2014CN101855074B 具有优良tcc的聚合物-陶瓷复合材料 The polymer has excellent tcc - ceramic composite
05/07/2014CN101847649B 有机发光显示装置及其制造方法 The organic light emitting display device and its manufacturing method
05/07/2014CN101828250B 定位装置、贴合装置、层叠基板制造装置、曝光装置及定位方法 Positioning means, the device, the laminated substrate manufacturing apparatus, exposure apparatus and method for positioning the bonded
05/07/2014CN101807537B 位置对准机构、加工装置以及位置对准方法 The positioning mechanism, the processing device and positioning method
05/07/2014CN101779269B 多工件处理室以及包括该多工件处理室的工件处理系统 Multi-piece, including the multi-processing chamber and the processing chamber workpiece workpiece handling system
05/07/2014CN101764091B 半导体设备及其制造方法 Semiconductor device and manufacturing method thereof
05/07/2014CN101740439B 用于传输和处理衬底的装置和方法 Apparatus and method for transmitting and processing of the substrate
05/07/2014CN101728406B 固态成像装置及其制造方法和成像设备 The solid-state imaging device and its manufacturing method and an image forming apparatus
05/07/2014CN101675509B 使用多相溶液进行基片清洁的技术 Using a heterogeneous solution of the substrate cleaning techniques
05/07/2014CN101661948B 有机发光二极管显示器及其制造方法 The organic light emitting diode display and method of manufacturing
05/07/2014CN101645427B 切割/芯片接合薄膜 Cutting / die-bonding film
05/07/2014CN101521183B 半导体发光器件及其制造方法 The semiconductor light emitting device and its manufacturing method
05/07/2014CN101499450B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/07/2014CN101387754B 投影机曝光装置、曝光方法以及元件制造方法 Projector exposure apparatus, exposure method and device manufacturing method
05/07/2014CN101354917B 包括叠置nand型电阻存储器单元串的非易失性存储器件及其制造方法 Include stacked nand resistor string of memory cells of non-volatile memory device and manufacturing method thereof
05/07/2014CN101345261B 薄膜晶体管及其制造方法 A thin film transistor and its manufacturing method
05/07/2014CN101156164B 非接触型信息存储介质及其制造方法 A non-contact type information storage medium and its manufacturing method
05/06/2014USRE44878 Current switched magnetoresistive memory cell
05/06/2014US8719595 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method
05/06/2014US8718972 Electron beam writing apparatus and position displacement amount correcting method
05/06/2014US8717772 Printed circuit board
05/06/2014US8717530 Array substrate for transreflective liquid crystal display, manufacturing method thereof and liquid crystal display
05/06/2014US8717522 Method for fabricating liquid crystal display panel using the same
05/06/2014US8717262 Display device and method for fabricating the same
05/06/2014US8716875 Window ball grid array (BGA) semiconductor packages
05/06/2014US8716871 Big via structure
1 ... 255 256 257 258 259 260 261 262 263 264 265 266 267 268 269 270 271 272 273 274 275 ... 6590