Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/07/2008US20080185735 Dynamic pad size to reduce solder fatigue
08/07/2008US20080185733 Lsi package provided with interface module, and transmission line header employed in the package
08/07/2008US20080185731 Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
08/07/2008US20080185730 Memory cell device with coplanar electrode surface and method
08/07/2008US20080185728 Microelectronic Circuit Structure With Layered Low Dielectric Constant Regions And Method Of Forming Same
08/07/2008US20080185727 Semiconductor device capable of selecting wiring connection mode by controlling via formation
08/07/2008US20080185721 Semiconductor device and method of manufacturing the same
08/07/2008US20080185720 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse
08/07/2008US20080185719 Integrated circuit packaging system with interposer
08/07/2008US20080185717 Semiconductor device including bump electrodes
08/07/2008US20080185716 Bump structure having a reinforcement member and manufacturing method thereof
08/07/2008US20080185715 Semiconductor device and method
08/07/2008US20080185714 Methods of forming channels on an integrated circuit die and die cooling systems including such channels
08/07/2008US20080185712 Semiconductor device and method for manufacturing the same
08/07/2008US20080185709 Semiconductor device including semiconductor elements and method of producing semiconductor device
08/07/2008US20080185706 Package and method for making the same
08/07/2008US20080185704 Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
08/07/2008US20080185703 Injection molded soldering process and arrangement for three-dimensional structures
08/07/2008US20080185701 Hermetically Sealed Package and Methods of Making the Same
08/07/2008US20080185700 Secure attachment to wafer chip from dicing through drying steps; laminated olefin polymer and polyimide; uniform thickness and shear strength; impact, moisture and heat resistance
08/07/2008US20080185699 Microelectromechanical system package and the method for manufacturing the same
08/07/2008US20080185697 Chip package structure and method of fabricating the same
08/07/2008US20080185696 Semiconductor die package including leadframe with die attach pad with folded edge
08/07/2008US20080185694 Processes of Manufacturing Portable Electronic Storage Devices Utilizing Lead Frame Connectors
08/07/2008US20080185693 Integrated circuit package system with integral inner lead and paddle
08/07/2008US20080185692 Package-level electromagnetic interference shielding
08/07/2008US20080185691 Fin Pin Diode
08/07/2008US20080185689 Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
08/07/2008US20080185687 Memory device and method for fabricating the same
08/07/2008US20080185683 Semiconductor memory device and manufacturing method thereof
08/07/2008US20080185681 Integrated Circuit Comprising a Capacitor with Metal Electrodes and Process for Fabricating Such a Capacitor
08/07/2008US20080185680 Structure and method for making on-chip capacitors with various capacitances
08/07/2008US20080185679 Inductor layout and manufacturing method thereof
08/07/2008US20080185678 Semiconductor device and method of manufacturing the same
08/07/2008US20080185676 Method for forming STI of semiconductor device
08/07/2008US20080185675 Trench Isolation Structure and a Method of Manufacture Therefor
08/07/2008US20080185674 Method of fabricating image sensor photodiodes using a multi-layer substrate and contact method and the structure thereof
08/07/2008US20080185671 Sensor semiconductor package and fabrication
08/07/2008US20080185670 Magnetic random access memory and method of manufacturing the same
08/07/2008US20080185669 Silicon Microphone
08/07/2008US20080185668 Memory device and method of fabricating the same
08/07/2008US20080185667 Thin Film Semiconductor Device and Method for Manufacturing the Same
08/07/2008US20080185666 Field effect transistors including variable width channels and methods of forming the same
08/07/2008US20080185663 Semiconductor device with increased channel length and width and method for manufacturing the same
08/07/2008US20080185662 Structure and method for forming asymmetrical overlap capacitance in field effect transistors
08/07/2008US20080185661 Semiconductor device and method for fabricating the same
08/07/2008US20080185660 Semiconductor device and method of forming the same
08/07/2008US20080185659 Semiconductor device and a method of fabricating the device
08/07/2008US20080185658 Buried Stress Isolation for High-Performance CMOS Technology
08/07/2008US20080185656 Semiconductor device and method for manufacturing the same
08/07/2008US20080185655 Smiconductor device, method for fabricating thereof and method for increasing film stress
08/07/2008US20080185654 Electronic device including a semiconductor fin having a plurality of gate electrodes and a process for forming the electronic device
08/07/2008US20080185652 Simultaneous Conditioning of a Plurality of Memory Cells Through Series Resistors
08/07/2008US20080185650 FinFET for device characterization
08/07/2008US20080185649 Substrate backgate for trigate FET
08/07/2008US20080185647 Methods of forming semiconductor-on-insulator substrates, and integrated circuitry
08/07/2008US20080185645 Semiconductor structure including stepped source/drain region
08/07/2008US20080185644 Fets with self-aligned bodies and backgate holes
08/07/2008US20080185641 Recessed transistor and method of manufacturing the same
08/07/2008US20080185639 Semiconductor device and method of manufacturing the same
08/07/2008US20080185638 Semiconductor device and method of fabricating the same
08/07/2008US20080185637 Insulated gate field effect transistor and a method of manufacturing the same
08/07/2008US20080185636 Semiconductor structure including doped silicon carbon liner layer and method for fabrication thereof
08/07/2008US20080185634 Structures for and method of silicide formation on memory array and peripheral logic devices
08/07/2008US20080185633 Charge trap memory device with blocking insulating layer having higher-dielectric constant and larger energy band-gap and method of manufacturing the same
08/07/2008US20080185631 Dielectric layer for semiconductor device and method of manufacturing the same
08/07/2008US20080185630 Stacked gate nonvolatile semiconductor memory and method for manufacturing the same
08/07/2008US20080185628 Semiconductor device and method of manufacturing the same
08/07/2008US20080185627 RFID tag having non-volatile memory device having floating-gate fets with different source-gate and drain-gate border lengths
08/07/2008US20080185623 Ferroelectric memory device and fabrication process thereof, fabrication process of a semiconductor device
08/07/2008US20080185616 Semiconductor device-based sensors and methods associated with the same
08/07/2008US20080185613 III-Nitride semiconductor device
08/07/2008US20080185612 Semiconductor device and manufacturing method
08/07/2008US20080185611 Preparation method of a coating of gallium nitride
08/07/2008US20080185610 Resin-sealed semiconductor light receiving element, manufacturing method thereof and electronic device using the same
08/07/2008US20080185608 Ohmic contacts to nitrogen polarity GaN
08/07/2008US20080185594 Method for manufacturing electronic devices integrated in a semiconductor substrate and corresponding devices
08/07/2008US20080185593 Power field effect transistor and manufacturing method thereof
08/07/2008US20080185592 Semiconductor substrate with multiple crystallographic orientations
08/07/2008US20080185590 Thin Film Transistor Array Panel and Method for Manufacturing the Same
08/07/2008US20080185589 Display substrate having the same and method of manufacturing the display substrate
08/07/2008US20080185588 Display substrate, display device and method of manufacturing the same
08/07/2008US20080185587 Display panel and method of manufacture
08/07/2008US20080185586 High performance sub-system design and assembly
08/07/2008US20080185584 Semiconductor device test structures and methods
08/07/2008US20080185583 Structure and method for monitoring and characterizing pattern density dependence on thermal absorption in a semiconductor manufacturing process
08/07/2008US20080185582 Portable memory devices
08/07/2008US20080185581 Silicon-on-insulator ("SOI") transistor test structure for measuring body-effect
08/07/2008US20080185580 EPITAXIAL GROWTH OF ZnO WITH CONTROLLED ATMOSPHERE
08/07/2008US20080185579 Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method
08/07/2008US20080185575 Manufacture method of multilevel phase-change memory and operating method thereof
08/07/2008US20080185574 Method of forming non-volatile resistance variable devices
08/07/2008US20080185573 Methods for forming resistive switching memory elements
08/07/2008US20080185572 Methods for forming resistive switching memory elements
08/07/2008US20080185569 Phase change random access memories including a word line formed of a metal material and methods of forming the same
08/07/2008US20080185568 Nonvolatile memory devices and method of manufacturing the same
08/07/2008US20080185567 Methods for forming resistive switching memory elements
08/07/2008US20080185500 Solid-state imaging device and method thereof
08/07/2008US20080185370 Heating apparatus and heating method
08/07/2008US20080185315 Integrated circuit wafer packaging system and method