Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/14/2008WO2008096462A1 Damping body for packaging and package body
08/14/2008WO2008096335A2 Producing an array of nanoscale structures on a substrate surface via a self-assembled template
08/14/2008WO2008096197A1 Electronics package and manufacturing method thereof
08/14/2008WO2008096194A1 Method of fabrication of highly heat dissipative substrates
08/14/2008WO2008096168A1 Production of semiconductor devices
08/14/2008WO2008095881A1 Nonflammable compositions comprising fluorinated compounds and use of these compositions
08/14/2008WO2008095873A1 Heat reservoir and method for processing a substrate coupled to a heat reservoir
08/14/2008WO2008095865A1 Method for mounting semiconductor chips on a substrate
08/14/2008WO2008095811A1 Method of interconnecting electronic wafers
08/14/2008WO2008095755A1 Connection, method and device for the uniform coupling-in of laser beams during laser welding and laser soldering, in particular on highly reflective materials
08/14/2008WO2008095747A1 Method for producing a layered component
08/14/2008WO2008095405A1 Microelectronic element and method of manufacturing the same
08/14/2008WO2008079516A3 Clean chemistry composition, method of manufacturing same, and system making use of same
08/14/2008WO2008079239A3 Methods and apparatus for sensing substrates in carriers
08/14/2008WO2008073432A3 No flow underfill process, composition, and reflow carrier
08/14/2008WO2008068684A3 Optical electrical system in package for led based lighting systems
08/14/2008WO2008063761A2 Method of packaging a device using a dielectric layer
08/14/2008WO2008057671A3 Electronic device including a conductive structure extending through a buried insulating layer
08/14/2008WO2008054967A3 Method for providing a nanoscale, high electron mobility transistor (hemt) on insulator
08/14/2008WO2008045672A3 Method for fabricating conducting plates for a high-q mim capacitor
08/14/2008WO2008042144A3 A semiconductor device comprising isolation trenches inducing different types of strain
08/14/2008WO2008035961A3 Device for electrochemically depositing a material on a plateshaped substrate
08/14/2008WO2008020191A3 Method for anisotropically plasma etching a semiconductor wafer
08/14/2008WO2007126956A3 Damascene interconnection having porous low k layer with improved mechanical properties
08/14/2008WO2007126461A3 Method for removing damaged dielectric material
08/14/2008WO2007082396A9 Apparatus for degassing a wafer-like substrate
08/14/2008WO2007062383A8 Integration of pore sealing liner into dual-damascene methods and devices
08/14/2008US20080195988 Integrated Circuit Transformer Devices for On-Chip Millimeter-Wave Applications
08/14/2008US20080194189 Multiple Fluid Supplying Apparatus For Carrier of Semiconductor Wafer Polishing System
08/14/2008US20080194183 Planarization polishing method and method for manufacturing semiconductor device
08/14/2008US20080194182 Mechano-chemical polishing method for GaAs wafer
08/14/2008US20080194118 Trench Filling Method
08/14/2008US20080194117 Manufacturing method of semiconductor device
08/14/2008US20080194116 Treatment Solution and Method of Applying a Passivating Layer
08/14/2008US20080194115 Processing method and storage medium
08/14/2008US20080194114 Plasma etching method
08/14/2008US20080194113 Methods and apparatus for semiconductor etching including an electro static chuck
08/14/2008US20080194112 Method and system for plasma etching having improved across-wafer etch uniformity
08/14/2008US20080194111 Removal of process residues on the backside of a substrate
08/14/2008US20080194110 Methods of fabricating a semiconductor device using a dilute aqueous solution of an ammonia and peroxide mixture
08/14/2008US20080194109 Method of fabricating a semiconductor device
08/14/2008US20080194108 Methods of manufacturing semiconductor device
08/14/2008US20080194107 Method of manufacturing semiconductor device
08/14/2008US20080194106 Method of forming a titanium aluminum nitride layer and method of manufacturing a phase-change memory device using the same
08/14/2008US20080194105 Organometallic precursors for seed/barrier processes and methods thereof
08/14/2008US20080194104 Apparatus for plasma chemical vapor deposition and method for fabricating semiconductor device by using the same
08/14/2008US20080194103 Composition and methods for forming metal films on semiconductor substrates using supercritical solvents
08/14/2008US20080194102 Semiconductor device and manufacturing method thereof
08/14/2008US20080194101 Method of manufacturing a contact structure to avoid open issue
08/14/2008US20080194100 Method for forming metal silicide layer
08/14/2008US20080194099 Method for Integrating Liner Formation in Back End of Line Processing
08/14/2008US20080194098 Flash memory device and method of manufacturing the same
08/14/2008US20080194097 Method of reworking a semiconductor substrate and method of forming a pattern of a semiconductor device
08/14/2008US20080194096 Method of manufacturing semiconductor device
08/14/2008US20080194095 Undercut-free blm process for pb-free and pb-reduced c4
08/14/2008US20080194094 Tungsten-doped indium oxide structures and methods
08/14/2008US20080194093 Method for fabricating a nonvolatile memory device
08/14/2008US20080194092 Method of Fabricating a Mos Device With Non-Sio2 Gate Dielectric
08/14/2008US20080194091 Method for fabricating nitrided oxide layer
08/14/2008US20080194090 Method for manufacturing semiconductor device using a free radical assisted chemical vapor deposition nitirifying process
08/14/2008US20080194089 Method and apparatus for improving integrated circuit device performance using hybrid crystal orientations
08/14/2008US20080194088 Strontium precursor beta -diketonate, beta -diketiminate, amidinate, cyclopentadienyl, diorganoamide, carboxylate and/or alkoxide; and titanium precursor compound are reacted in a plurality of cycles to form strontium titanate; low strontium carbonate content; atomic layer deposition; high dielectrics
08/14/2008US20080194087 Polysilicon gate formation by in-situ doping
08/14/2008US20080194086 Method of Introducing Impurity
08/14/2008US20080194085 Growth of textured gallium nitride thin films and nanowires on polycrystalline substrates
08/14/2008US20080194084 Method of fabrication of highly heat dissipative substrates
08/14/2008US20080194083 Methods of Laterally Forming Single Crystalline Thin Film Regions from Seed Layers
08/14/2008US20080194082 Method for manufacturing semiconductor device
08/14/2008US20080194081 Block-Molded Semiconductor Device Singulation Methods and Systems
08/14/2008US20080194080 Method and product for dicing an optoelectronic semiconductor wafer
08/14/2008US20080194079 Method For Forming Median Crack In Substrate And Apparatus For Forming Median Crack In Substrate
08/14/2008US20080194078 Method for manufacturing semiconductor substrate
08/14/2008US20080194077 Method of low temperature wafer bonding through Au/Ag diffusion
08/14/2008US20080194076 Process For Wafer Bonding
08/14/2008US20080194075 Process of manufacturing a shallow trench isolation and process of treating bottom surface of the shallow trench for avoiding bubble defects
08/14/2008US20080194074 Annealing process of polysilizane layer and method of forming isolation layer of semiconductor device employing the same
08/14/2008US20080194073 Selective etching using a hard mask and a method for forming an isolation structure of a memory device using the same
08/14/2008US20080194072 Polysilicon gate formation by in-situ doping
08/14/2008US20080194071 Method of forming non-volatile memory cell
08/14/2008US20080194070 Metal-oxide-semiconductor transistor device, manufacturing method thereof, and method of improving drain current thereof
08/14/2008US20080194069 Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtained With Such a Method
08/14/2008US20080194068 Method of manufacturing a 3-d channel field-effect transistor and an integrated circuit
08/14/2008US20080194067 Fabrication of optical-quality facets vertical to a (001) orientation substrate by selective epitaxial growth
08/14/2008US20080194066 Methods of forming non-volatile memory cells, and methods of forming NAND cell unit string gates
08/14/2008US20080194065 Integrated circuit devices having an epitaxial pattern with a void region formed therein and methods of forming the same
08/14/2008US20080194064 Programming of laser fuse
08/14/2008US20080194063 Oxidation of copper or chromium-nickel-iron alloy metal article; reduction in hydrogen; producing macroscopically smooth surface portions and a plurality of multiply curved nanopores; coating; semiconductors
08/14/2008US20080194062 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
08/14/2008US20080194061 Methods of forming packaged semiconductor light emitting devices having multiple optical elements by compression molding
08/14/2008US20080194060 Semiconductor device and method of manufacturing the same
08/14/2008US20080194059 Method and apparatus for creating rfid devices
08/14/2008US20080194058 Method for Manufacturing Passive Device and Semiconductor Package Using Thin Metal Piece
08/14/2008US20080194057 Method of making a current sensing chip resistor
08/14/2008US20080194056 Method of Producing Plurality of Organic Transistors Using Laser Patterning
08/14/2008US20080194055 Solid-state imaging device and method for manufacturing the same
08/14/2008US20080194054 Led array package structure having silicon substrate and method of making the same
08/14/2008US20080194053 Methods for Fabricating Micro-Electro-Mechanical Devices
08/14/2008US20080194051 Die separation
08/14/2008US20080194047 Observation apparatus and method for manufacturing electronic device
08/14/2008US20080194046 Method for determining low-noise power spectral density for characterizing line edge roughness in semiconductor wafer processing
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