Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/07/2008US20080188073 Methods of forming a span comprising silicon dioxide
08/07/2008US20080188072 Apparatus and method for semiconductor wafer bumping via injection molded solder
08/07/2008US20080188071 Low fabrication cost, fine pitch and high reliability solder bump
08/07/2008US20080188070 Apparatus and method for semiconductor wafer bumping via injection molded solder
08/07/2008US20080188069 Apparatus and method for semiconductor wafer bumping via injection molded solder
08/07/2008US20080188068 Method of forming a semiconductor device having a removable sidewall spacer
08/07/2008US20080188067 Process of forming an electronic device including forming a gate electrode layer and forming a patterned masking layer
08/07/2008US20080188066 Method for fabricating a semiconductor device
08/07/2008US20080188065 Preparation method of a coating of gallium nitride
08/07/2008US20080188064 Nanostructures and methods for manufacturing the same
08/07/2008US20080188063 GRADED CORE/SHELL SEMICONDUCTOR NANORODS and NANOROD BARCODES
08/07/2008US20080188062 Method of forming microcrystalline silicon film
08/07/2008US20080188061 Method of protecting front surface structure of wafer and method of wafer dividing
08/07/2008US20080188060 Process for fabricating a substrate of the silicon-on-insulator type with thin surface layer
08/07/2008US20080188059 Integrated sensor and circuitry and process therefor
08/07/2008US20080188058 Semiconductor device and manufacturing method thereof
08/07/2008US20080188057 Trench isolation type semiconductor device which prevents a recess from being formed in a field region and method of fabricating the same
08/07/2008US20080188056 Method for forming capacitor of semiconductor device
08/07/2008US20080188055 Metal-insulator-metal structure and method of forming the same
08/07/2008US20080188054 Fabricating resistors
08/07/2008US20080188053 Method for forming fully silicided gate electrodes and unsilicided poly resistors
08/07/2008US20080188052 Split-gate thin film storage NVM cell with reduced load-up/trap-up effects
08/07/2008US20080188051 Methods of forming one or more covered voids in a semiconductor substrate, methods of forming field effect transistors, methods of forming semiconductor-on-insulator substrates, methods of forming a span comprising silicon dioxide, methods of cooling semiconductor devices, methods of forming electromagnetic radiation emitters and conduits, methods of forming imager systems, methods of forming nanofluidic channels, fluorimetry methods, and integrated circuitry
08/07/2008US20080188050 Semiconductor device and method for manufacturing the same
08/07/2008US20080188049 Methods of Manufacturing Non-Volatile Memory Devices Including Charge-Trapping Layers
08/07/2008US20080188048 Semiconductor device
08/07/2008US20080188047 Electrostatic discharge protection device and method of fabricating the same
08/07/2008US20080188046 Method and Apparatus For Manufacturing A Semiconductor
08/07/2008US20080188045 Methods for operating and fabricating a semiconductor device having a buried guard ring structure
08/07/2008US20080188044 Semiconductor devices with dual-metal gate structures and fabrication methods thereof
08/07/2008US20080188043 Method of manufacturing a semiconductor device
08/07/2008US20080188042 Method of manufacturing thin film transistor panel
08/07/2008US20080188041 Lateral undercut of metal gate in SOI device
08/07/2008US20080188040 Method of manufacturing semiconductor device
08/07/2008US20080188039 Method of fabricating chip package structure
08/07/2008US20080188038 Integrated circuit edge protection method and apparatus
08/07/2008US20080188037 Method of manufacturing semiconductor chip assembly with sacrificial metal-based core carrier
08/07/2008US20080188036 Method, system, program product for bonding two circuitry-including substrates and related stage
08/07/2008US20080188035 System and method for sealing a mems device
08/07/2008US20080188034 Assemblies displaying differential negative resistance, semiconductor constructions, and methods of forming assemblies displaying differential negative resistance
08/07/2008US20080188029 Pinned photodiode structure and method of formation
08/07/2008US20080188027 Semiconductor device having impurity-doped resistor element
08/07/2008US20080188026 Method for manufacturing a semiconductor package structure having micro-electro-mechanical systems
08/07/2008US20080188025 Semiconductor device manufacturing method
08/07/2008US20080188024 Method of fabricating micro mechanical moving member and metal interconnects thereof
08/07/2008US20080188023 Forming thin film transistors on a substrate and connecting to pixel electrodes which are connected to a voltage-receiving pad, depositing an inorganic alignment layer covering the organic pattern on the first substrate, and then removing; simplified process over photolithography
08/07/2008US20080188022 Semiconductor Display Devices
08/07/2008US20080188021 Light emitting diode and method making the same
08/07/2008US20080188020 Method of LED packaging on transparent flexible film
08/07/2008US20080188019 Methods of forming electromagnetic radiation emitters and conduits, methods of forming imager systems, methods of forming nanofluidic channels, fluorimetry methods
08/07/2008US20080188018 Method of manufacturing ink jet circuit board with heaters and electrodes constructed to reduce corrosion
08/07/2008US20080188017 Method of sorting dies using discrimination region
08/07/2008US20080188016 Die detection and reference die wafermap alignment
08/07/2008US20080188015 Testing and burn-in using a strip socket
08/07/2008US20080188014 Feed forward silicide control scheme based on spacer height controlling preclean time
08/07/2008US20080188013 In-situ dose monitoring using optical emission spectroscopy
08/07/2008US20080188012 Manufacturing method of display device
08/07/2008US20080188011 Apparatus and method of temperature conrol during cleaving processes of thick film materials
08/07/2008US20080187870 Using a slit mask or a half-tone mask in order to form a channel of the thin film transistor; reduced manufacturing costs
08/07/2008US20080187869 Better exposure profiles for the resulting integrated circuits; improved chip yield; increased throughput by reducing the need to alter settings or switch reticles between exposures
08/07/2008US20080187859 Radiation-Sensitive Resin Composition
08/07/2008US20080187843 Preventing damage of moisture resistant ring pattern by static electricity
08/07/2008US20080187757 Method of room temperature covalent bonding
08/07/2008US20080187747 Dielectric Film and Method of Forming the Same
08/07/2008US20080187736 Semiconductor wafers of silicon and method for their production
08/07/2008US20080187731 Techniques for Patterning Features in Semiconductor Devices
08/07/2008US20080187613 Method of manufacturing wafer-level chip-size package and molding apparatus used in the method
08/07/2008US20080187430 Semiconductor process chamber
08/07/2008US20080187429 Efficient Delivery and Placement Systems For Switch Contacts
08/07/2008US20080187420 Mounting device
08/07/2008US20080187419 Calibration of high speed loader to substrate transport system
08/07/2008US20080187418 Semiconductor wafer handling and transport
08/07/2008US20080187417 Semiconductor wafer handling and transport
08/07/2008US20080187416 Semiconductor processing system
08/07/2008US20080187414 Method and apparatus for supplying substrates to a processing tool
08/07/2008US20080187413 Vacuum processing apparatus and method, and storage medium for executing the method
08/07/2008US20080187212 Defect Image Classifying Method and Apparatus and a Semiconductor Device Manufacturing Process Based on the Method and Apparatus
08/07/2008US20080187024 On chip temperature measuring and monitoring method
08/07/2008US20080187018 Distributed feedback lasers formed via aspect ratio trapping
08/07/2008US20080187016 Thick Pseudomorphic Nitride Epitaxial Layers
08/07/2008US20080186777 Relaxed metal pitch memory architectures
08/07/2008US20080186773 One or multiple-times programmable device
08/07/2008US20080186772 Non-volatile memory devices having floating-gates fets with different source-gate and drain-gate border lengths
08/07/2008US20080186760 Programmable fuse/non-volatile memory structures using externally heated phase change material
08/07/2008US20080186756 Nanotube-Based Switching Elements with Multiple Controls
08/07/2008US20080186704 LED Light in Sealed Fixture with Heat Transfer Agent
08/07/2008US20080186649 Capacitance for Decoupling Intermediate Level Power Rails
08/07/2008US20080186647 Electrostatic chuck and method of manufacturing the same
08/07/2008US20080186511 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, CMP polisher, and method of manufacturing semiconductor device
08/07/2008US20080186509 Measurement apparatus, exposure apparatus, and device fabrication method
08/07/2008US20080186497 Method and Apparatus for Inspecting Defects on Mask
08/07/2008US20080186469 Polarization rotator and a crystalline-quartz plate for use in an optical imaging system
08/07/2008US20080186463 Exposure apparatus and device manufacturing method
08/07/2008US20080186442 Display device and manufacturing method thereof
08/07/2008US20080186356 Nozzle plate, method of manufacturing nozzle plate, and image forming apparatus
08/07/2008US20080186035 On chip temperature measuring and monitoring method
08/07/2008US20080185740 Semiconductor and Method For Producing the Same
08/07/2008US20080185739 Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same
08/07/2008US20080185738 Semiconductor device and method of manufacturing the same
08/07/2008US20080185736 Multiple selectable function integrated circuit module
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