Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/06/2008CN100409411C Semiconductor-device manufacturing method
08/06/2008CN100409410C Method for producing a spacer structure
08/06/2008CN100409409C Semiconductor device and manufacturing method thereof
08/06/2008CN100409408C Process for producing n-type semiconductor diamond and n-type semiconductor diamond
08/06/2008CN100409407C Two layer LTO backside seal for a wafer
08/06/2008CN100409406C Process for manufacturing photosensitive flat-panel with Se allotropic P.N or N.P structure
08/06/2008CN100409405C Method and device for regulating IC component pin
08/06/2008CN100409404C Crystallization method, crystallization apparatus, processed substrate, thin film transistor and display apparatus
08/06/2008CN100409403C Temperature measurement system for quick heat treatment device
08/06/2008CN100409402C System and method of fast ambient switching for rapid thermal processing
08/06/2008CN100409401C Stripping method and method for producing semiconductor device
08/06/2008CN100409382C Method for homogeneously magnetizing an exchange-coupled layer system of a digital magnetic memory location device
08/06/2008CN100409363C Data storage device and manufacturing method thereof
08/06/2008CN100409275C Flat panel display with thin film transistor
08/06/2008CN100409273C Apparatus for manufacturing flat display
08/06/2008CN100409101C Thick film photoresists and methods for use thereof
08/06/2008CN100409091C Liquid crystal display device and method for fabricating the same
08/06/2008CN100409085C Liquid crystal display device and method of fabricating the same
08/06/2008CN100409064C Resonance assembly, double-shaft assembly and method for manufacturing double-shaft assembly and micro-system assembly
08/06/2008CN100409045C Polarization conversion element, lighting optical device, exposure system, and exposure method
08/06/2008CN100409042C Method for manufacturing a device, a device and electronic machine
08/06/2008CN100409015C Test structures for estimating dishing and erosion effects in copper damascene technology
08/06/2008CN100408988C Device for measuring amplitude of vibrating tubule end
08/06/2008CN100408902C Methods and apparatus for sealing an opening of a processing chamber
08/06/2008CN100408852C Making method of micro-electro-mechanical V-type micro valve
08/06/2008CN100408648C Selective barrier metal polishing solution
08/06/2008CN100408647C Photocurable adhesive compositions, reaction products of which have low halide ion content
08/06/2008CN100408497C High durability quartz glass, its manufacturing method unit and device using it
08/06/2008CN100408470C Microchip with thermal stress relief means
08/06/2008CN100408301C Molded parts and manufacturing method therefor
08/06/2008CN100408270C Polishing machine
08/06/2008CN100408267C Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article
08/06/2008CN100408249C Laser working machine
08/06/2008CN100408202C Electroless plating solution and process
08/05/2008US7409664 Architecture and interconnect scheme for programmable logic circuits
08/05/2008US7409648 Semiconductor integrated circuit, method for designing semiconductor integrated circuit and system for designing semiconductor integrated circuit
08/05/2008US7409306 System and method for estimating reliability of components for testing and quality optimization
08/05/2008US7409260 Substrate thickness measuring during polishing
08/05/2008US7409257 System and method for moving substrates in and out of a manufacturing process
08/05/2008US7409253 System and method for processing a substrate and program therefor
08/05/2008US7409200 Module integration integrated circuits
08/05/2008US7409081 Apparatus and computer-readable medium for assisting image classification
08/05/2008US7408812 Low-voltage single-layer polysilicon EEPROM memory cell
08/05/2008US7408803 Method for writing to magnetoresistive memory cells and magnetoresistive memory which can be written to by the method
08/05/2008US7408785 Structure for mounting electronic component on wiring board
08/05/2008US7408760 Charged particle beam application system
08/05/2008US7408621 Projection exposure system
08/05/2008US7408620 Exposure apparatus
08/05/2008US7408566 Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device
08/05/2008US7408534 Reflective type semiconductor display device
08/05/2008US7408264 SMT passive device noflow underfill methodology and structure
08/05/2008US7408259 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet
08/05/2008US7408258 Interconnection circuit and electronic module utilizing same
08/05/2008US7408251 Semiconductor packaging device comprising a semiconductor chip including a MOSFET
08/05/2008US7408242 Carrier with reinforced leads that are to be connected to a chip
08/05/2008US7408241 Semiconductor device with a recessed bond pad
08/05/2008US7408239 Capture of residual refractory metal within semiconductor device
08/05/2008US7408236 Method for non-damaging charge injection and system thereof
08/05/2008US7408233 Semiconductor device having N-channel thin film transistor with LDD regions and P-channel thin film transistor with LDD region
08/05/2008US7408232 Semiconductor device and method for fabricating the same
08/05/2008US7408231 SRAM memory semiconductor integrated circuit device
08/05/2008US7408228 Semiconductor device capable of avoiding latchup breakdown resulting from negative variation of floating offset voltage
08/05/2008US7408227 Apparatus and method of manufacture for integrated circuit and CMOS device including epitaxially grown dielectric on silicon carbide
08/05/2008US7408225 Apparatus and method for forming thin film using upstream and downstream exhaust mechanisms
08/05/2008US7408224 Vertical transistor structure for use in semiconductor device and method of forming the same
08/05/2008US7408222 Charge trapping device and method of producing the charge trapping device
08/05/2008US7408218 Semiconductor device having plural dram memory cells and a logic circuit
08/05/2008US7408216 Device, system, and method for a trench capacitor having micro-roughened semiconductor surfaces
08/05/2008US7408214 Dynamic random access memory trench capacitors
08/05/2008US7408207 Device manufacturing method and device, electro-optic device, and electronic equipment
08/05/2008US7408200 Thin film transistor array panel and manufacturing method thereof
08/05/2008US7408196 Semiconductor device and display device
08/05/2008US7408193 Semiconductor device and manufacturing method thereof
08/05/2008US7408186 Controlled alignment catalytically grown nanostructures
08/05/2008US7408144 Method for manufacturing semiconductor device including a multi-phase prism
08/05/2008US7408131 Wafer holder and semiconductor manufacturing apparatus
08/05/2008US7408011 Photoresists, fluoropolymers and processes for 157 nm microlithography
08/05/2008US7407896 CMOS-compatible light emitting aperiodic photonic structures
08/05/2008US7407895 Process for producing dielectric insulating thin film, and dielectric insulating material
08/05/2008US7407894 Compound semiconductor particles and production process therefor
08/05/2008US7407893 Liquid precursors for the CVD deposition of amorphous carbon films
08/05/2008US7407892 Deposition methods
08/05/2008US7407891 Method and apparatus for leveling a semiconductor wafer, and semiconductor wafer with improved flatness
08/05/2008US7407890 Patterning sub-lithographic features with variable widths
08/05/2008US7407889 Method of manufacturing article having uneven surface
08/05/2008US7407888 Semiconductor device and a fabrication process thereof
08/05/2008US7407886 Method for preparing a contact plug structure
08/05/2008US7407885 Methods of forming electrically conductive plugs
08/05/2008US7407884 Method for forming an aluminum contact
08/05/2008US7407883 Electronic package with improved current carrying capability and method of forming the same
08/05/2008US7407882 Semiconductor component having a contact structure and method of manufacture
08/05/2008US7407881 Semiconductor device and method for manufacturing the same
08/05/2008US7407880 Semiconductor device and manufacturing process therefore
08/05/2008US7407879 Chemical planarization performance for copper/low-k interconnect structures
08/05/2008US7407878 Method of providing solder bumps on a substrate using localized heating
08/05/2008US7407877 Self-coplanarity bumping shape for flip-chip
08/05/2008US7407876 Method of plasma enhanced atomic layer deposition of TaC and TaCN films having good adhesion to copper
08/05/2008US7407875 Low resistance contact structure and fabrication thereof
08/05/2008US7407874 Plasma doping method
08/05/2008US7407873 Method of manufacturing semiconductor device