Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/06/2008EP0895706B2 Method and apparatus for generating x-ray or euv radiation
08/06/2008CN201097110Y A measuring device for accurate aligning of up and down drone
08/06/2008CN201097109Y A precise motion platform
08/06/2008CN201097108Y Balanced vibration reduction precise positioning device
08/06/2008CN201097107Y Vertical micro-adjustment and gravity compensation machine
08/06/2008CN201097105Y An automatic control and monitoring device for exhaust flow
08/06/2008CN201097045Y Working platform for LCD panel
08/06/2008CN201097034Y Panel loading device
08/06/2008CN201096852Y Combined structure of testing oven
08/06/2008CN201096806Y Testing oven structure for available depth increase
08/06/2008CN101238762A Surface mounting component having magnetic layer thereon and method of forming same
08/06/2008CN101238641A Semiconductor integrated circuit
08/06/2008CN101238580A Semiconductor device and its making method
08/06/2008CN101238573A Semiconductor device and its making method
08/06/2008CN101238572A Methods of forming through-wafer interconnects and structures resulting therefrom
08/06/2008CN101238571A Semiconductor substrate and methods for the production thereof
08/06/2008CN101238570A Semiconductor device and its making method
08/06/2008CN101238569A Sheet application device and application method
08/06/2008CN101238568A Electrostatic chuck for semiconductor workpieces
08/06/2008CN101238567A Cantilever type probe and method of fabricating the same
08/06/2008CN101238566A Device recognizing method, device making method and electronic device
08/06/2008CN101238565A Gold alloy wire for use as bonding wire exhibiting high initial bonding capability, high bonding reliability, high circularity of press bonded ball, high straight advancing property and high resin flo
08/06/2008CN101238564A Gold alloy wire for use as bonding wire exhibiting high initial bonding capability, high bonding reliability, high circularity of press bonded ball, high straight advancing property, high resin flow r
08/06/2008CN101238563A Method for making electronic devices
08/06/2008CN101238562A Semiconductor package fabrication
08/06/2008CN101238561A Field effect transistor
08/06/2008CN101238560A Field effect transistor
08/06/2008CN101238559A Method of forming memory circuitry with different insulative sidewall spacers
08/06/2008CN101238558A Method of fabricating a bipolar transistor
08/06/2008CN101238557A Silicon wafer and method for producing same
08/06/2008CN101238556A Method and apparatus for producing porous silica
08/06/2008CN101238555A Interlayer insulating film and wiring structure, and process for producing the same
08/06/2008CN101238554A Pore sealing and cleaning porous low dielectric constant structures
08/06/2008CN101238553A Edge ring assembly with dielectric spacer ring
08/06/2008CN101238552A Chemical mechanical polishing apparatus
08/06/2008CN101238551A Damage-free ashing process and system for post low-k etch
08/06/2008CN101238550A Method for forming w-based film, method for forming gate electrode, and method for manufacturing semiconductor device
08/06/2008CN101238498A Mapping sensor system
08/06/2008CN101238422A 排气装置压力控制系统 Exhaust pressure control system
08/06/2008CN101238416A Exposure device and object to be exposed
08/06/2008CN101238412A Exposure mask, its manufacture method, pattern copy method, pattern forming method, and SRAM manufacture method
08/06/2008CN101238406A Aging room used for the last assembling process of LCD screen
08/06/2008CN101238376A Minute structure inspection device, inspection method, and inspection program
08/06/2008CN101238238A Remote cavity method of using sulfur fluoride from CVD/PECVD cavity for removing surface deposits
08/06/2008CN101238095A Metal-containing compound, method for producing the compound, metal-containing thin film and method for forming the thin film
08/06/2008CN101237746A Electronic board incorporating a heater wire
08/06/2008CN101237742A Plasma processing device, plasma processing method and storing medium
08/06/2008CN101237017A LED supporter processing method for LED nude core test
08/06/2008CN101237015A LED device making method
08/06/2008CN101237012A LED and its assembly method
08/06/2008CN101237006A Method of forming microcrystalline silicon film
08/06/2008CN101237005A Forming method for micro crystal silicon film
08/06/2008CN101237004A Multi-channel optical coupling device, fabrication method thereof, electronic equipment, and lead frame member
08/06/2008CN101236996A Resin-sealed semiconductor light receiving element, manufacturing method thereof and electronic device using the same
08/06/2008CN101236995A PIN diode and method for making PIN diode and forming semiconductor fin structure
08/06/2008CN101236994A Charge trap memory device with blocking insulating layer and method of manufacturing the same
08/06/2008CN101236993A Thin film transistor, method of producing the same, and display device using the thin film transistor
08/06/2008CN101236992A Thin film transistor and method of manufacturing the same
08/06/2008CN101236991A Semiconductor device and manufacturing method thereof
08/06/2008CN101236990A Semiconductor structure and its making method
08/06/2008CN101236989A Split gate with different gate materials and work functions to reduce gate resistance of ultra high density MOSFET
08/06/2008CN101236988A Semiconductor device and method for fabricating the same
08/06/2008CN101236986A High voltage transistors and its production method
08/06/2008CN101236985A Memory cell device with coplanar electrode surface and method
08/06/2008CN101236978A Sensitized chip encapsulation structure and its making method
08/06/2008CN101236976A Active part array base plate, photoelectric device and its making method
08/06/2008CN101236975A Thin film transistor array base plate and its making method
08/06/2008CN101236973A Semiconductor device and method of manufacturing the same
08/06/2008CN101236971A Thin film transistor substrate and display device therefor
08/06/2008CN101236968A MOS device and its making method
08/06/2008CN101236962A Multi-chip stacking structure and its making method
08/06/2008CN101236957A Conductive layer structure for chip encapsulation module and its making method
08/06/2008CN101236956A Method for sensing a signal in an integrated circuit complementary fuse arrangement
08/06/2008CN101236954A Wiring structures of semiconductor devices and methods of forming the same
08/06/2008CN101236953A Thin film transistor array base plate and its making method
08/06/2008CN101236952A Micro-chip connector for connecting multiple chips and its making method
08/06/2008CN101236951A Semiconductor structure and its making method
08/06/2008CN101236950A Low-temperature common burning porcelain base plate and its making method and its semiconductor encapsulation device
08/06/2008CN101236949A Printed circuit board and manufacturing method thereof
08/06/2008CN101236946A 布线板和半导体器件 Wiring boards and semiconductor devices
08/06/2008CN101236945A Electronic part with electromagnetic interference shielding action and its encapsulation method
08/06/2008CN101236944A Added layer encapsulation structure for photoelectric chip and its method
08/06/2008CN101236943A Heat-radiation no-chip board film base plate with built-in chip and its making method
08/06/2008CN101236942A IC base plate and its making method
08/06/2008CN101236941A Semiconductor device and method of manufacturing the same
08/06/2008CN101236935A Bearer with built-in part and its making method
08/06/2008CN101236933A Display panel and its method
08/06/2008CN101236932A Thin film transistor array base plate making method
08/06/2008CN101236931A Methods of manufacturing non-volatile memory devices including charge-trapping layers
08/06/2008CN101236930A Method for manufacturing semiconductor device
08/06/2008CN101236929A Storage unit cascading structure memory and its making method
08/06/2008CN101236928A Non-volatile memory making method
08/06/2008CN101236927A Contact window self-aligning and its making method
08/06/2008CN101236926A Making method for semiconductor component and enhancing the film equality
08/06/2008CN101236925A Image sensor device and its making method
08/06/2008CN101236924A Forming method for adulteration section
08/06/2008CN101236923A Integrated circuit (IC) chip with vertical plate capacitors and method of making the capacitors
08/06/2008CN101236922A Method for forming grid oxidation layer with different thickness
08/06/2008CN101236921A Making method for semiconductor component with capacitor
08/06/2008CN101236920A Semiconductor wafer with improved crack protection