Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/31/2008DE102007060694A1 Floating-Body-Speicherzelle, die Gates aufweist, welche Bereiche mit unterschiedlichem Leitfähigkeitstyp begünstigen Floating body memory cell having gates which favor areas with different conductivity type
07/31/2008DE102007059310A1 Selbsthaftende Elektroden und Verfahren zu deren Herstellung Self-adhesive electrodes and processes for their preparation
07/31/2008DE102007040587A1 Halbleitervorrichtung und Herstellungsverfahren derselben A semiconductor device and manufacturing method thereof
07/31/2008DE102007007697A1 Method for determining deformations in substrate while manufacturing semiconductor components, involves measuring characteristic by vertical distortions of substrate in multiple locations on substrate
07/31/2008DE102007005208A1 Method for testing electronic components, includes testing auxiliary components and chips, where chips are arranged on wafer and auxiliary components are arranged between chips
07/31/2008DE102007004320A1 Semiconductor component i.e. metal oxide semiconductor transistor, has dielectric layer arranged between drift zone and drift control zone, where drift zone includes varying doping and/or varying material composition based on dielectric
07/31/2008DE102007004284A1 Method for manufacturing semiconductor chips, involves providing semiconductor wafers with multiple lines and columns arranged in semiconductor chip positions, where semiconductor wafers have integrated circuits
07/31/2008DE102007004253A1 Verfahren und Vorrichtung zur Korrektur fehlerhafter Solder-Bump-Arrays Method and apparatus for correcting defective solder bump arrays
07/31/2008DE102007004043A1 Herstellungsverfahren für halbleiterbasierte optische Wellenleiterstrukturen mit speziellen geometrischen Formen Manufacturing processes for semiconductor-based optical waveguide structures with specific geometric shapes
07/31/2008DE102007003541A1 Elektronisches Bauteil Electronic component
07/31/2008DE102007003261A1 Method for crystallization of amorphous semiconductor layer applied on substrate, involves positioning and exposing of substrate on specified position before or after exposure with excimer laser
07/31/2008DE102007002962B3 Verfahren zum Herstellen einer dielektrischen Schicht und zum Herstellen eines Kondensators A method for producing a dielectric layer and for producing a capacitor
07/31/2008DE102007002961A1 Memory device for electrical devices, mobile phones and personal digital assistants, has memory pack of stored memory chips, which are displaced in relation to each other
07/31/2008DE102006060368B3 Verfahren und Anordnung zur Stabilisierung der mittleren abgegebenen Strahlungsleistung einer gepulst betriebenen Strahlungsquelle Method and apparatus for stabilizing the average emitted radiation power of a pulsed radiation source operated
07/31/2008DE102006032925B4 Elektronische Baugruppe und Verfahren zur Verkapselung elektronischer Bauelemente und integrierter Schaltungen Electronic assembly and method for encapsulating electronic devices and integrated circuits
07/31/2008DE102004040943B4 Verfahren zur selektiven Abscheidung einer Schicht mittels eines ALD-Verfahrens Process for the selective deposition of a layer by means of an ALD process
07/31/2008DE102004021240B4 Verfahren zur Herstellung einer Halbleiter-Schaltungsanordnung in BiCMOS-Technologie A method for fabricating a semiconductor circuit arrangement in BiCMOS technology
07/31/2008DE10197137B4 Verfahren zur Herstellung von Mikrostrukturen A process for the fabrication of microstructures
07/31/2008DE10196678B4 Herstellungsverfahren für einen Dünnfilmstrukturkörper Manufacturing method of a thin-film structure body
07/31/2008DE10150432B4 Arraysubstrat für eine Flüssigkristallanzeige und Verfahren zu dessen Herstellung Array substrate for a liquid crystal display and method for its production
07/31/2008DE10052411B4 Wärmebehandlungsverfahren eines Siliciumwafers und der wärmebehandelte Siliciumwafer Heat treatment method of a silicon wafer and the heat-treated silicon wafer
07/30/2008EP1950808A2 Examination apparatus for biological sample and chemical sample
07/30/2008EP1950804A2 Display device and manufacturing method of the same
07/30/2008EP1950803A1 Method for manufacturing compound material wafers and corresponding compound material wafer
07/30/2008EP1950802A1 Semiconductor device manufacturing method, semiconductor device, and wiring board
07/30/2008EP1950801A1 Electronic component mounting method
07/30/2008EP1950800A2 III-V compound semiconductor substrate manufacturing method
07/30/2008EP1950799A1 Method for production of nano-porous substrate
07/30/2008EP1950798A1 Semiconductor production apparatus and semiconductor device
07/30/2008EP1950797A1 Process for producing film using atmospheric pressure hydrogen plasma, and method and apparatus for producing purification film
07/30/2008EP1950796A2 Method of reducing excess noise in electronic devices
07/30/2008EP1950795A1 Exposure apparatus, exposure method and device manufacturing method
07/30/2008EP1950794A1 Optical characteristic measuring method, exposure method, device manufacturing method, inspecting apparatus and measuring method
07/30/2008EP1950793A1 Exposure apparatus and exposure method
07/30/2008EP1950792A1 Cleaning liquid and cleaning method for electronic material
07/30/2008EP1950791A1 Bonding machine for applying transponders and method
07/30/2008EP1950613A2 Laser drawing method and apparatus
07/30/2008EP1950612A1 Exposure apparatus and method, and method for manufacturing device
07/30/2008EP1950326A1 Method for removal of bulk metal contamination from III-V semiconductor substrates
07/30/2008EP1950263A2 Polishing composition and polishing method
07/30/2008EP1950245A1 Alloyed fluorocopolymer
07/30/2008EP1950190A1 Fluorine-containing adamantane derivative, fluorine-containing adamantane derivative having polymerizable group, and resin composition containing same
07/30/2008EP1950151A1 Packaging body
07/30/2008EP1950023A1 Molding apparatus for resin encapsulation of electronic part
07/30/2008EP1949458A1 Fabrication of semiconductor devices for light emission
07/30/2008EP1949456A2 Integrated circuit using complementary junction field effect transistor and mos transistor in silicon and silicon alloys
07/30/2008EP1949447A2 Low threshold voltage semiconductor device with dual threshold voltage control means
07/30/2008EP1949443A1 Self-aligned trench filling for narrow gap isolation regions
07/30/2008EP1949442A1 Fabrication of transistors
07/30/2008EP1949435A1 Structure and method to increase strain enhancement with spacerless fet and dual liner process
07/30/2008EP1949434A2 Electronic device including a transistor structure having an active region adjacent to a stressor layer and a process for forming the electronic device
07/30/2008EP1949433A1 Method of manufacturing a plurality of semiconductor devices and carrier substrate
07/30/2008EP1949432A2 Producing a covered through substrate via using a temporary cap layer
07/30/2008EP1949431A1 Amine-free deposition of metal-nitride films
07/30/2008EP1949430A1 Treating a germanium layer bonded to a substrate
07/30/2008EP1949429A1 Rotational shear stress for charge carrier mobility modification
07/30/2008EP1949428A2 Method of manufacturing flash memory cards
07/30/2008EP1949427A2 High density three dimensional semiconductor die package
07/30/2008EP1949426A2 Fine pitch interconnect and method of making
07/30/2008EP1949424A2 Composition and method for selectively etching gate spacer oxide material
07/30/2008EP1949423A1 Method for removing etch residue and chemistry therefor
07/30/2008EP1949422A1 Method for cleaning a semiconductor structure and chemistry thereof
07/30/2008EP1949421A2 Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
07/30/2008EP1949420A2 A strain-compensated metastable compound base heterojunction bipolar transistor
07/30/2008EP1949419A1 Trench capacitor device suitable for decoupling applications in high-frequency operation
07/30/2008EP1949418A2 Integrated capacitor arrangement for ultrahigh capacitance values
07/30/2008EP1949416A2 A method of fabricating a structure for a semiconductor device
07/30/2008EP1948850A1 Method of forming a multilayer structure
07/30/2008EP1948720A1 Method for modifying insulating or semi-conductive surfaces, and resulting products
07/30/2008EP1948427A2 Wire embedded bridge
07/30/2008EP1782456A4 Exposure apparatus, exposure method, and exposure mask
07/30/2008EP1726197B1 An element for carrying electronic components
07/30/2008EP1680806A4 Cleaning solutions and etchants and methods for using same
07/30/2008EP1638864A4 Wafer box with radially pivoting latch elements
07/30/2008EP1568262B1 Electronic parts mounting apparatus and method
07/30/2008EP1548802B1 Light conducting device
07/30/2008EP1454257B1 Programmable gate array having interconnecting logic to support embedded fixed logic circuitry
07/30/2008EP1451629B1 Homogenizer
07/30/2008EP1425756A4 Non-volatile semiconductor memory and method of operating the same
07/30/2008EP1422743B1 Treatment system
07/30/2008EP1374297B1 Flip chip interconnection using no-clean flux
07/30/2008EP1342266B1 Method for producing high-speed vertical npn bipolar transistors and complementary mos transistors on a chip
07/30/2008EP1295334B1 Hermetic high frequency module and method for producing the same
07/30/2008EP1285465B1 Bipolar transistor
07/30/2008EP1273058B1 Method for producing a thin-film battery having an ultra-thin electrolyte
07/30/2008EP1255980B1 Portable sensor array system
07/30/2008EP1157454A4 Power supply with flux-controlled transformer
07/30/2008EP1042808B1 Reduced capacitance transistor with electro-static discharge protection structure and method for forming the same
07/30/2008CN201094136Y Box door with anti-separating structure standard mechanical interface wafer box
07/30/2008CN101233793A Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure
07/30/2008CN101233655A Anisotropic conductive film and method for producing same
07/30/2008CN101233621A Method for passivating a substrate surface
07/30/2008CN101233619A A package and manufacturing method for a microelectronic component
07/30/2008CN101233618A Semiconductor device and method of manufacturing the same
07/30/2008CN101233616A Semiconductor element and electric device
07/30/2008CN101233615A Semiconductor element and electric device
07/30/2008CN101233611A Metal gate mosfet by full semiconductor metal alloy conversion
07/30/2008CN101233610A Probe card manufacture method and device
07/30/2008CN101233609A Method for manufacturing semiconductor device
07/30/2008CN101233608A Process for producing junction structure