Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/06/2008CN101236919A Method for producing semiconductor device
08/06/2008CN101236918A Method of manufacturing semiconductor apparatus, and semiconductor apparatus
08/06/2008CN101236917A Contact forming method on adjacent underlay and related semiconductor device
08/06/2008CN101236916A Mounting device
08/06/2008CN101236915A Substrate processing device and focus ring
08/06/2008CN101236914A Wafer appearance detection device
08/06/2008CN101236913A Apparatus and method for analyzing contaminants on wafer
08/06/2008CN101236912A ZIF connector pin measuring card, its assembly method, wafer testing system and its testing method
08/06/2008CN101236911A Reverse slice joint technology
08/06/2008CN101236910A Method for electrically connecting semiconductor member to substrate and semiconductor structure
08/06/2008CN101236909A Chip package structure and its package method
08/06/2008CN101236908A A production method for block commutation diode
08/06/2008CN101236907A Method and its line layout for cutting signal line on the circuit board
08/06/2008CN101236906A Acceptor activation method for nitrogen adulterated ZnO
08/06/2008CN101236905A A method for making IV-VI sector semiconductor single crystal film on CdZnTe underlay
08/06/2008CN101236904A Making method for multi-crystal silicon film transistor with the slight adulterated leakage pole area
08/06/2008CN101236903A Technology method for improving bidirectional small thyristor ó¾ quadrant trigger sensibility
08/06/2008CN101236902A Method of removing an oxide and method of filling a trench using the same
08/06/2008CN101236901A Apparatus for defining regions of process exclusion and process performance in a process chamber
08/06/2008CN101236900A Method for production of thin-film semiconductor device
08/06/2008CN101236899A Grid making method
08/06/2008CN101236898A Making method for low-temperature multi-crystal silicon film
08/06/2008CN101236897A Method for manufacturing semi-conductor device
08/06/2008CN101236896A Crystallized heat treatment system for noncrystalline silicon
08/06/2008CN101236895A Method for using one or multiple semiconductor substrate manufacturing material independent thickness
08/06/2008CN101236894A Substrate processing apparatus
08/06/2008CN101236893A Substrate processing method and substrate processing device
08/06/2008CN101236892A Ion beam apparatus having plasma sheath controller
08/06/2008CN101236891A Plasma processing device
08/06/2008CN101236890A Substrate processing apparatus and substrate processing method
08/06/2008CN101236889A Substrate processing device and substrate processing method
08/06/2008CN101236888A Vaccuum processing apparatus
08/06/2008CN101236887A Processing system and method for common storage position in semiconductor manufacturing
08/06/2008CN101236886A Selection method and system for bridge connection storage
08/06/2008CN101236885A Adhesive tape device for wafer and adhesive tape method for wafer
08/06/2008CN101236873A Judgement method for surface cleanness after GaAs photoelectric cathode anneal
08/06/2008CN101236871A Silicon base medium blocking type 1-dimention nano pole structure
08/06/2008CN101236773A Classification device and burning device for integrated circuit encapsulation chip
08/06/2008CN101236428A Methods, systems for product randomization and analysis in a manufacturing environment
08/06/2008CN101236419A Automated trans-factory transmission system
08/06/2008CN101236418A Semiconductor clustering statistical process control system and method
08/06/2008CN101236360A Method and apparatus for inspecting defects on mask
08/06/2008CN101236359A Inspection method and apparatus, lithographic apparatus, lithographic processing cell
08/06/2008CN101236356A Photoresist composition, thin film patterning method using the same, and method of fabricating liquid crystal display using the same
08/06/2008CN101236345A Liquid crystal display panel, pixel structure and method of manufacture
08/06/2008CN101236340A Fringe field switching mode liquid crystal display and manufacturing method thereof
08/06/2008CN101236336A Mother display panel for producing display panels with improved efficiency
08/06/2008CN101236335A Display device and method of manufacturing the same
08/06/2008CN101236313A Display device and making method thereof
08/06/2008CN101236164A Method and system for defect detection
08/06/2008CN101235541A Single crystal silicon rod fabrication methods and a single crystal silicon rod structure
08/06/2008CN101235524A Non-cyanide electrolysis gold plating bath for gold bump and gold wiring
08/06/2008CN101235457A N2O doping p-type Zn1-xCoxO diluted magnetic semi-conductor thin film and preparation method thereof
08/06/2008CN101235255A Polishing liquid for chemo-mechanical polishing semiconductor wafer
08/06/2008CN101235254A Dispersion for chemical machinery mechanical polishing
08/06/2008CN101235253A 抛光组合物和抛光方法 Polishing composition and polishing method
08/06/2008CN101234704A Electronic component transfer loading device and method
08/06/2008CN101234693A Glass substrate bearing tools
08/06/2008CN101234482A Polishing pad with grooves to reduce slurry consumption
08/06/2008CN101234481A Polishing pad with grooves to retain slurry on the pad texture
08/06/2008CN101234455A Soldering tin paste composition and soldering-tin precoating method
08/06/2008CN100409726C Plasma processing device
08/06/2008CN100409456C Integrated field effect transistor and schottky device
08/06/2008CN100409455C Field effect transistor, associated use, and associated production method
08/06/2008CN100409454C Silicon-based one-electron transistor with quantum limit by oxygen injection and its manufacture method
08/06/2008CN100409453C Field-effect transistor with high-sensitivity gate
08/06/2008CN100409452C Power semiconductor device and method for forming the same
08/06/2008CN100409451C Bipolar transistor and semiconductor device applying same
08/06/2008CN100409450C Nanowire and electronic device
08/06/2008CN100409449C Polysilicon-insulating layer-polysilicon capacitance, high-capacitant polysilicon device and its production
08/06/2008CN100409448C Image pick-up device and camera system comprising an image pick-up device
08/06/2008CN100409445C Semiconductor device and ferroelectric memory, and method for manufacturing semiconductor device
08/06/2008CN100409444C Non-volatility memory, switching method and preparing method based on resistance change
08/06/2008CN100409443C Semiconductor die package with semiconductor die having side electrical connection
08/06/2008CN100409442C Storage system and data transmission method
08/06/2008CN100409441C 显示装置 The display device
08/06/2008CN100409440C Matrix type LED and manufacturing method thereof
08/06/2008CN100409437C Multistage interconnection structure and method of forming cu interconnection on IC wafer
08/06/2008CN100409436C Application method of press welding block on top of logic integrated circuit
08/06/2008CN100409434C Semiconductor modules and manufacture method thereof
08/06/2008CN100409431C Semiconductor device and method for manufacturing the same
08/06/2008CN100409430C Semiconductor device and method for assembling the same
08/06/2008CN100409429C Semiconductor packaging element and method for packaging semiconductor
08/06/2008CN100409428C Non-volatile memory, its production method and operation method
08/06/2008CN100409427C Manufacturing method of ferroelectric semi conductor storage
08/06/2008CN100409426C 半导体装置 Semiconductor device
08/06/2008CN100409425C Fabrication process and using method for three dimensional structure memory
08/06/2008CN100409424C Substrate processing device
08/06/2008CN100409423C Method for interconnecting terminals and method for mounting semiconductor device
08/06/2008CN100409422C Lead ring and semiconductor device, lead joint method and lead joint device
08/06/2008CN100409421C Method of fixing a sealing object to a base object
08/06/2008CN100409420C Semiconductor device and method of manufacturing thereof
08/06/2008CN100409419C Method for interconnecting and packaging 3-D multi-chip module
08/06/2008CN100409418C QFN chip packaging technique
08/06/2008CN100409417C Film transistor and its manufacturing method
08/06/2008CN100409416C Method for eliminating copper particles on metal link wine
08/06/2008CN100409415C Method for using alpha polycrystal silicon in integrated circuit
08/06/2008CN100409414C Gas switching device, gas supply source system, method for control gas flow and method for etching silicon
08/06/2008CN100409413C Processing method and processing system
08/06/2008CN100409412C Abrasive compound for semiconductor planarization and manufacturing method thereof