Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/12/2008US7410061 Thin plate supporting container
08/12/2008US7410060 Stackable tray for integrated circuit chips
08/12/2008US7409761 Electronic component mounting apparatus and method of mounting electronic components
08/12/2008CA2280865C Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/12/2008CA2280128C Cmos architecture for a digital radio receiver
08/07/2008WO2008095154A1 Semiconductor wafer boat for batch processing
08/07/2008WO2008094888A1 Fabrication process for nanotube-cmos integration
08/07/2008WO2008094828A1 Venturi vacuum generator on an electronic component handler
08/07/2008WO2008094826A1 Electronic component handler having gap set device
08/07/2008WO2008094797A1 Device having pocketless regions and methods of making the device
08/07/2008WO2008094792A1 Novel air gap integration scheme
08/07/2008WO2008094752A1 Processing chamber with heated chamber liner
08/07/2008WO2008094745A1 Electronic device including insulating layers having different strains and a process for forming the electronic device
08/07/2008WO2008094702A1 Method of polishing a tungsten-containing substrate
08/07/2008WO2008094699A1 A transistor with embedded silicon/germanium material on a strained semiconductor on insulator substrate
08/07/2008WO2008094669A1 Increasing reliability of copper-based metallization structures in a microstructure device by using aluminum nitride
08/07/2008WO2008094666A2 An soi device having a substrate diode with process tolerant configuration and method of forming the soi device
08/07/2008WO2008094654A1 Method of forming vias in a semiconductor device
08/07/2008WO2008094653A2 Method for forming silicon/germanium containing drain/source regions in transistors with reduced silicon/germanium loss
08/07/2008WO2008094642A1 Electronic and optical circuit integration through wafer bonding
08/07/2008WO2008094544A1 Electronic device and method of making the same
08/07/2008WO2008094497A1 Termination trench structure for mosgated device and process for its manufacture
08/07/2008WO2008094494A1 Compositions and methods for forming and depositing metal films on semiconductor substrates using supercritical solvents
08/07/2008WO2008094464A2 Thick pseudomorphic nitride epitaxial layers
08/07/2008WO2008094457A1 Composition and methods for forming metal films on semiconductor substrates using supercritical solvents
08/07/2008WO2008094441A1 Bevel etcher with vacuum chuck
08/07/2008WO2008094149A1 Semiconductor wafter coated with a filled, spin-coatable material
08/07/2008WO2008093969A1 Method and apparatus for etching a substrate
08/07/2008WO2008093904A1 Probe station
08/07/2008WO2008093899A1 Analog-to-digital converter
08/07/2008WO2008093873A1 ZnO SEMICONDUCTOR ELEMENT
08/07/2008WO2008093854A1 Thin film semiconductor device fabrication method and thin film semiconductor device
08/07/2008WO2008093850A1 Polishing pad and process for production of polishing pad
08/07/2008WO2008093824A1 Gan semiconductor element
08/07/2008WO2008093789A1 Bipolar semiconductor device, method for manufacturing the bipolar semiconductor device and method for controlling zener voltage
08/07/2008WO2008093787A1 Substrate treating apparatus and method of preventing particle adhesion
08/07/2008WO2008093759A1 Method for producing group 3-5 compound semiconductor
08/07/2008WO2008093741A1 Thin film transistor and its manufacturing method
08/07/2008WO2008093663A1 Organic thin film transistor, method for manufacturing the organic thin film transistor, and organic semiconductor device
08/07/2008WO2008093640A1 Flotox-type eeprom
08/07/2008WO2008093626A1 Chip element and process for producing the same
08/07/2008WO2008093624A1 Treating system
08/07/2008WO2008093617A1 Stage device and exposure device
08/07/2008WO2008093534A1 Reflective mask blank for euv lithography
08/07/2008WO2008093512A1 Polycrystal silicon, polycrystal silicon base, manufacturing method thereof, and photoelectric conversion element using the polycrystal silicon base
08/07/2008WO2008093507A1 Radiation-sensitive resin composition
08/07/2008WO2008093488A1 Silicon wafer beveling device, silicon wafer manufacturing method, and etched silicon wafer
08/07/2008WO2008093465A1 Testing apparatus and probe card
08/07/2008WO2008093450A1 Additive for abrasive composition
08/07/2008WO2008093419A1 Transfer apparatus and transfer method
08/07/2008WO2008093408A1 Adhesive chuck device
08/07/2008WO2008093389A1 Microwave plasma cvd system
08/07/2008WO2008093193A1 Process for fabricating a substrate of the silicon-on-insulator type
08/07/2008WO2008093187A1 Process for fabricating a substrate of the silicon-on-insulator type
08/07/2008WO2008093115A1 Coating substrates
08/07/2008WO2008093053A1 Securing a substrate to an electrostatic chuck
08/07/2008WO2008093008A2 Method for preparing thin gan layers by implantation and recycling of a starting substrate
08/07/2008WO2008092798A1 Device for mounting a flip-chip on a substrate
08/07/2008WO2008092414A1 Method for the production of a pluggable connection contact on a semiconductor module and semiconductor module produced by this method
08/07/2008WO2008092186A1 Method of forming openings in selected material
08/07/2008WO2008073763A3 Methods for creating a densified group iv semiconductor nanoparticle thin film
08/07/2008WO2008070003A3 High throughput serial wafer handling end station
08/07/2008WO2008070003A2 High throughput serial wafer handling end station
08/07/2008WO2008051172A3 METHOD FOR PRODUCING CUBICAL GaN FILMS ON SUBTRACTS OF A POROUS GaAs LAYER
08/07/2008WO2008048483A3 Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position
08/07/2008WO2008048316A3 Synthesis of metallic nanoparticle dispersions
08/07/2008WO2008045826A3 Method of arranging dies in a wafer for easy inkless partial wafer process
08/07/2008WO2008042903A3 Systems for sensing pressure/shear force
08/07/2008WO2008042578B1 Automatic dynamic baseline creation and adjustment
08/07/2008WO2008036484A3 Nonvolatile memory with reduced coupling between floating gates
08/07/2008WO2008033695A3 Efficient pitch multiplication process
08/07/2008WO2008021736A3 Nonvolatile memories with shaped floating gates
08/07/2008WO2008021363A3 Electron beam processing method using carbon nanotube emitter
08/07/2008WO2007136841A3 Digital alloys and methods for forming the same
08/07/2008WO2007120175A3 Apparatus and methods for solar energy conversion using nanoscale cometal structures
08/07/2008WO2007067589A3 Insulated gate devices and method of making same
08/07/2008US20080189674 Data Generating Method, Data Generating Device, and Program
08/07/2008US20080189575 Methods and apparatus for data analysis
08/07/2008US20080188634 Polymers with high internal free volume
08/07/2008US20080188578 Precursors for Porous Low-Dielectric Constant Materials for Use in Electronic Devices
08/07/2008US20080188167 Substrate processing apparatus
08/07/2008US20080188092 Electronic Device Array
08/07/2008US20080188091 Semiconductor device, method for fabricating thereof and method for increasing film stress
08/07/2008US20080188090 Internal balanced coil for inductively coupled high density plasma processing chamber
08/07/2008US20080188089 Method for reducing top notching effects in pre-doped gate structures
08/07/2008US20080188088 Forming method and structure of porous low-k layer, interconnect process and interconnect structure
08/07/2008US20080188087 Internal balanced coil for inductively coupled high density plasma processing chamber
08/07/2008US20080188086 Etching method, etching apparatus and storage medium
08/07/2008US20080188085 Post-dry etching cleaning liquid composition and process for fabricating semiconductor device
08/07/2008US20080188084 Method For Reducing And Homogenizing The Thickness Of A Semiconductor Layer Which Lies On The Surface Of An Electrically Insulating Material
08/07/2008US20080188083 Method of forming fine patterns of semiconductor device using double patterning
08/07/2008US20080188082 Pulsed ultra-high aspect ratio dielectric etch
08/07/2008US20080188081 Ultra-high aspect ratio dielectric etch
08/07/2008US20080188080 Mandrel/trim alignment in sit processing
08/07/2008US20080188079 Metal-polishing composition and chemical mechanical polishing method by using the same
08/07/2008US20080188078 Manufacturing method of electronic element
08/07/2008US20080188077 Barrier film deposition over metal for reduction in metal dishing after CMP
08/07/2008US20080188076 Method for fabricating semiconductor device
08/07/2008US20080188075 Semiconductor device and production method therefor
08/07/2008US20080188074 Peeling-free porous capping material