Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/30/2008CN101233607A Measuring alignment between a wafer chuck and polishing/plating receptacle
07/30/2008CN101233606A Methods for fabricating a stressed MOS device
07/30/2008CN101233605A Methods for fabricating a stressed MOS device
07/30/2008CN101233604A Semiconductor device and method of manufacturing such a device
07/30/2008CN101233603A Semiconductor structures formed on substrates and methods of manufacturing the same
07/30/2008CN101233602A Method for forming film of group iii nitride such as gallium nitride
07/30/2008CN101233601A Compositions and methods for selective removal of metal or metal alloy after metal silicide formation
07/30/2008CN101233578A Semiconductor memory
07/30/2008CN101233531A Manufacturing method of semiconductor device
07/30/2008CN101233264A Composite metal layer formed using metal nanocrystalline particles in an electroplating bath
07/30/2008CN101233257A Semiconductor thin film and process for producing the same
07/30/2008CN101233072A A method of processing substrates
07/30/2008CN101232970A Chemically modified polishing pad for chemical mechanical polishing
07/30/2008CN101232952A Substrate, including at least one full or partial surface macro-structured layer, method for producing same and its application
07/30/2008CN101232783A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232781A Technique improvement of drawing electronic component circuit diagram on ceramic base plate
07/30/2008CN101232779A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232778A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232777A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232776A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232775A Printed circuit board and method for producing the printed circuit board
07/30/2008CN101232769A Plasma processing apparatus
07/30/2008CN101232152A Semiconductor laser apparatus
07/30/2008CN101232128A Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same
07/30/2008CN101232067A Light emitting diode and manufacturing method thereof, integrated light emitting diode, and display
07/30/2008CN101232063A Method for assembling high power LED desk lamp
07/30/2008CN101232060A Solid-state luminous element and manufacturing method thereof
07/30/2008CN101232059A Method for the structuring of a thin-layer solar module
07/30/2008CN101232048A Memory device and method of operating and fabricating the same
07/30/2008CN101232047A Semiconductor device and manufacturing method thereof
07/30/2008CN101232045A Field effect transistor multi-layer field plate device and method for making the same
07/30/2008CN101232041A Display device and manufacturing method of the same
07/30/2008CN101232039A Diode-and-fuse storage cell for write primary memory containing anisotropic semiconductor thin plate
07/30/2008CN101232038A Structure of high-density phase transition memory and process of preparation thereof
07/30/2008CN101232036A Phase change memory and manufacturing method thereofs
07/30/2008CN101232033A Image sensor module and the method of the same
07/30/2008CN101232032A 半导体装置及其制造方法 Semiconductor device and manufacturing method
07/30/2008CN101232031A Back lighting type semiconductor device and manufacturing method thereof
07/30/2008CN101232028A Two-sided semiconductor-on-insulator structures and methods of manufacturing the same
07/30/2008CN101232027A Light emitting device and its formation method
07/30/2008CN101232026A Semiconductor substrate, preparing technique and application in advanced three-dimensional electronic packaging
07/30/2008CN101232024A Non-volatile memory devices and methods of operating and fabricating the same
07/30/2008CN101232022A Semiconductor device comprising a barrier insulating layer and related method
07/30/2008CN101232019A Semiconductor device and method for fabricating the same
07/30/2008CN101232016A Semiconductor component with dual whole metal silicide grids and manufacturing method thereof
07/30/2008CN101232014A Organic illuminated display element and manufacturing method thereof
07/30/2008CN101232013A Organic illuminated display element and manufacturing method thereof
07/30/2008CN101232011A Stack type chip packaging structure and manufacturing method thereof
07/30/2008CN101232009A Mounting structures for integrated circuit modules
07/30/2008CN101232008A Multi-chips package and method of forming the same
07/30/2008CN101232003A Chip safety wire and method for making the same
07/30/2008CN101232002A Package with a marking structure and method of the same
07/30/2008CN101232001A Semiconductor device and method of disconnecting fuse element
07/30/2008CN101231999A Method of manufacturing semiconductor integrated circuit
07/30/2008CN101231980A Electronic device without wiring
07/30/2008CN101231977A Semiconductor structure and forming method thereof
07/30/2008CN101231976A Semiconductor package substrate structure and encapsulation method thereof
07/30/2008CN101231975A Chip packaging body and method of manufacturing the same
07/30/2008CN101231974A Apparatus for depositing a multilayer coating on discrete sheets
07/30/2008CN101231973A Display device and manufacturing method of the same
07/30/2008CN101231972A Flexible display device and fabricating method thereof
07/30/2008CN101231971A CMOS image sensors with a bonding pad and methods of forming the same
07/30/2008CN101231970A Method for manufacturing integrated diode and CuxO resistance memory
07/30/2008CN101231969A Forming method of IC structure
07/30/2008CN101231968A Inlaying inner connecting line structure and double inlaying process
07/30/2008CN101231967A Shallow groove isolation layer of semiconductor element and manufacturing method thereof
07/30/2008CN101231966A Wafer retaining device for etching course and method for controlling wafer etching speed
07/30/2008CN101231965A Wafer manufactory and carrier transportation system and method thereof
07/30/2008CN101231964A Semiconductor component voltage stabilization testing method and testing tool
07/30/2008CN101231963A Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same
07/30/2008CN101231962A Method of manufacturing semiconductor device
07/30/2008CN101231961A Basal plate making process of inner embedded component
07/30/2008CN101231960A Improvement of semiconductor device packaging technique
07/30/2008CN101231959A Sensing type packaging part and manufacturing method thereof
07/30/2008CN101231958A Chip carrier including an interlocking structure
07/30/2008CN101231957A Non-volatile semiconductor memory device and manufacturing method thereof
07/30/2008CN101231956A Method for realizing portion exhaust insulators upper silicon device physical contact
07/30/2008CN101231955A Method for enhancing breakdown voltage of P channel metal oxidizing semiconductor
07/30/2008CN101231954A Method for making strain silicon channel metal semiconductor transistor
07/30/2008CN101231953A Method for producing semiconductor elements
07/30/2008CN101231952A Method for forming SrTiO3 film
07/30/2008CN101231951A Oxide etch with NH3-NF3 chemical
07/30/2008CN101231950A Method for curing porous low dielectric constant layer
07/30/2008CN101231949A Method and semiconductor structure improving adhesion strength between two different layers
07/30/2008CN101231948A Method for stripping electrode
07/30/2008CN101231947A Reflux processing method and method for manufacturing tft
07/30/2008CN101231946A Manufacturing method of semiconductor devices and semiconductor device manufactured thereby
07/30/2008CN101231945A Method of manufacturing semiconductor device
07/30/2008CN101231944A Multiple layer structure including silicon nanometer die and manufacturing method thereof
07/30/2008CN101231943A Plasma processing apparatus and method
07/30/2008CN101231942A Integrated multiple gate dielectric composition and thickness semiconductor chip and method of manufacturing the same
07/30/2008CN101231941A Temperature measurement and control of wafer support in thermal processing chamber
07/30/2008CN101231940A Method of manufacturing multilayer thin film pattern and display device
07/30/2008CN101231939A Apparatus and method for controlling silicon nitride etching tank
07/30/2008CN101231938A Element fixing device of automatic multitime return current machine
07/30/2008CN101231937A Chip bonding machine platform and heating plate thereof
07/30/2008CN101231881A Shared global word line magnetic random access memory
07/30/2008CN101231709A Structure of memory card and the method of the same
07/30/2008CN101231667A Method of filling redundancy for semiconductor manufacturing process and semiconductor device
07/30/2008CN101231508A Control method for fabrication technology of analysis estimation-correcting integrated circuit by time series