Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2008
08/13/2008CN101241894A Metal carriage belt of intelligent card, its making and encapsulation module including this carrying belt
08/13/2008CN101241891A Semiconductor device and method of manufacturing the same
08/13/2008CN101241890A Chip package structure and its making method
08/13/2008CN101241889A Under bump metallurgy structure of a package and method of making same
08/13/2008CN101241888A Contact structure and its making method
08/13/2008CN101241883A Preparation method of a coating of gallium nitride
08/13/2008CN101241882A Realization method for 3-D integrated circuit based on SOI round slice
08/13/2008CN101241881A Nonvolatile semiconductor memory device and method of manufacturing the same
08/13/2008CN101241880A Manufacturing method for an integrated semiconductor memory device and corresponding semiconductor memory device
08/13/2008CN101241879A Manufacturing method for organic electroluminescence device, and electronic device therewith
08/13/2008CN101241878A Method of manufacturing semiconductor device
08/13/2008CN101241877A Flash memory device and method of manufacturing the same
08/13/2008CN101241876A Line repair method
08/13/2008CN101241875A A mobile carrier for lead frame and method for using this mobile carrier
08/13/2008CN101241874A Package device and its base plate carrier
08/13/2008CN101241873A Article transport facility
08/13/2008CN101241872A A distributed online detection system for ultrasonic lead key connection quality
08/13/2008CN101241871A Observation apparatus and method for manufacturing electronic device
08/13/2008CN101241870A Device for measuring the wafer film thickness
08/13/2008CN101241869A Chip testing classifier
08/13/2008CN101241868A Encapsulation technology for internal buried semiconductor component and its encapsulation structure
08/13/2008CN101241867A A method for improving chip anti-electric over-stress capability
08/13/2008CN101241866A Protrusion block structure with reinforced object and its making method
08/13/2008CN101241865A Flat top protrusion block structure and its making method
08/13/2008CN101241864A Inductance semiconductor encapsulation part and its making method
08/13/2008CN101241863A Chip package structure and its making method
08/13/2008CN101241862A Connection method for chip and bearer
08/13/2008CN101241861A Novel multilayered coreless support structure and their fabrication method
08/13/2008CN101241860A Method for making MOSFET
08/13/2008CN101241859A Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium
08/13/2008CN101241858A Annealing process of polysilizane layer and method of forming isolation layer of semiconductor device employing the same
08/13/2008CN101241857A Method for forming dielectric structure and semiconductor structure
08/13/2008CN101241856A Method for reducing and homogenising the thickness of a semiconductor layer on the surface of an electrically insulating material
08/13/2008CN101241855A ó¾-ó§ compound semiconductor substrate manufacturing method
08/13/2008CN101241854A A wafer production technology
08/13/2008CN101241853A A grid making method for improving multi-crystal silicon grid side profile
08/13/2008CN101241852A A making method for grid side wall for reducing N adulterated grid resistance
08/13/2008CN101241851A Substrate for growing gallium nitride, method for preparing the substrate for growing gallium nitride and method for preparing gallium nitride substrate
08/13/2008CN101241850A Method for making sequential indium arsenic quanta point on semiconductor underlay
08/13/2008CN101241849A Method for making quanta ring structure on semiconductor underlay
08/13/2008CN101241848A Method for manufacturing semiconductor device
08/13/2008CN101241847A Method for forming a film pattern having a reduced pattern size
08/13/2008CN101241846A Techniques for improving etch rate uniformity
08/13/2008CN101241845A Silicon parts for plasma reaction chamber
08/13/2008CN101241844A In-situ dry clean chamber for front end of line fabrication
08/13/2008CN101241843A Substrate polishing apparatus
08/13/2008CN101241842A Method of forming fine patterns of semiconductor device using double patterning
08/13/2008CN101241841A Removal of process residues on the backside of a substrate
08/13/2008CN101241840A Vacuum processing apparatus and method, and storage medium
08/13/2008CN101241839A System for manufacturing semiconductor package and method for manufacturing semiconductor package
08/13/2008CN101241838A Method for thinning a sample and sample carrier for performing the method
08/13/2008CN101241837A Exhaust unit, exhausting method, and semiconductor manufacturing facility with the exhaust unit
08/13/2008CN101241836A Method of manufacturing semiconductor device
08/13/2008CN101241835A Method of manufacturing bonded wafer
08/13/2008CN101241834A Non contact Ra radiation character etching process and its device
08/13/2008CN101241829A 转换的均匀性控制 Conversion uniformity control
08/13/2008CN101241687A Image display device
08/13/2008CN101241560A Electronic device manufacturing system and electronic device manufacturing method
08/13/2008CN101241534A Semiconductor device including encryption section or external interface, and content reproduction method
08/13/2008CN101241533A Semiconductor device including encryption section or external interface, and content reproduction method
08/13/2008CN101241518A Semiconductor chip design method
08/13/2008CN101241318A Exposure apparatus and method, and device fabricating method using the same
08/13/2008CN101241316A Lithography device and its manufacture method
08/13/2008CN101241309A Method for calibrating sub-nanometer critical dimension using pitch offset
08/13/2008CN101241308A Immersion photolithography system and method for exposing substrate
08/13/2008CN101241307A Levelling focusing mechanism possessing great stroke control function
08/13/2008CN101241303A Semiconductor device and methods for controlling its patterns
08/13/2008CN101241302A Preparation method for improving mask critical size trend
08/13/2008CN101241301A Photo mask pattern correction method
08/13/2008CN101241288A Active matrix substrate and display device
08/13/2008CN101241285A Electro-optical device substrate, electro-optical device, and electronic apparatus
08/13/2008CN101241277A Liquid crystal display panel and method for manufacturing the same
08/13/2008CN101241258A Apparatus for fabricating bonded substrate
08/13/2008CN101241159A Electrical testing device for testing electrical test items
08/13/2008CN101241158A Electrical testing device for testing electrical test items
08/13/2008CN101241144A Probe card for testing wafer
08/13/2008CN101240147A Compositions for chemical mechanical planarization of copper
08/13/2008CN101240146A Metal-polishing composition and chemical mechanical polishing method by using the same
08/13/2008CN101239515A Dielectric adjustable thin film based on implantation type nano line electrode and preparation thereof
08/13/2008CN101239457A Elastomer-modified chemical mechanical polishing pad
08/13/2008CN101239453A Planarization grinding method and method for manufacturing semiconductor device
08/13/2008CN101239450A Chemical mechanical polishing method for GaAs wafer
08/13/2008CN101239449A Method for preventing wafer surface oxidation layer grinding thickness from uneven
08/13/2008CN100411261C 半导体装置 Semiconductor device
08/13/2008CN100411218C Production process and package process of organic electroluminescence panel
08/13/2008CN100411203C Process for producing light-emitting diode element emitting white light
08/13/2008CN100411199C Top-emitting nitride-based light emitting device and method of manufacturing the same
08/13/2008CN100411193C Manufacturing method of thin film transistor array panel
08/13/2008CN100411192C Power semiconductor device for preventing punchthrough and manufacturing method thereof
08/13/2008CN100411191C Transistor and method of making same
08/13/2008CN100411190C BiCMOS structure and method of base formation in a BiCMOS process
08/13/2008CN100411185C Method to improve image sensor sensitivity
08/13/2008CN100411180C Semiconductor structure and method for manufacturing semiconductor structure
08/13/2008CN100411178C Semiconductor device and method for manufacturing the same
08/13/2008CN100411177C Floating gate type involatile memory and its manufacturing method
08/13/2008CN100411176C Semiconductor device, production method and electonic apparatus therefor
08/13/2008CN100411175C Structure and method of applying stresses to PFET and NFET transistor channels for improved performance
08/13/2008CN100411173C Layered power source noise monitoring device of ultra large scale integrated circuit and system
08/13/2008CN100411165C Integrate circuit and method producing the same
08/13/2008CN100411164C Semiconductor device having a multilayer interconnection structure, fabrication method thereof, and designing method thereof
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