Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/31/2008WO2008091460A1 Pedestal pocket tray containment system for integrated circuit chips
07/31/2008WO2008091396A2 Thermoelectric nanowire composites
07/31/2008WO2008091360A2 Electro-chemical processor
07/31/2008WO2008091343A1 Methods for fabricating semiconductor structures
07/31/2008WO2008091328A1 Second surface metallization
07/31/2008WO2008091220A1 Trench isolation for reduced cross talk
07/31/2008WO2008091010A1 Light-emitting device and method for manufacturing the same
07/31/2008WO2008090995A1 Inductor
07/31/2008WO2008090988A1 Optical element, exposure apparatus employing the optical element, and device manufacturing method
07/31/2008WO2008090976A1 Apparatus and method for supplying piling tray and apparatus and method for mounting component
07/31/2008WO2008090975A1 Support structure and exposure apparatus
07/31/2008WO2008090951A1 Ceiling member, and plasma-treating apparatus using the ceiling member
07/31/2008WO2008090942A1 Exposure method, exposure device, and micro device manufacturing method
07/31/2008WO2008090828A1 Organic thin film transistor and method for manufacturing the same, and organic semiconductor device
07/31/2008WO2008090820A1 Wafer container with cushion sheet
07/31/2008WO2008090816A1 Mask pattern designing method and semiconductor device fabrication method
07/31/2008WO2008090803A1 Micro ball feeding method
07/31/2008WO2008090801A1 Projection exposure device and projection exposure method
07/31/2008WO2008090788A1 Nitride semiconductor device, nitride semiconductor package, and method for manufacturing nitride semiconductor device
07/31/2008WO2008090771A1 Semiconductor device and production method thereof
07/31/2008WO2008090769A1 Photosensitive resin composition and method for formation of resist pattern by using the same
07/31/2008WO2008090763A1 Semiconductor device manufacturing method and semiconductor manufacturing apparatus
07/31/2008WO2008090696A1 Magnetoresistive element and magnetic storage device
07/31/2008WO2008090694A1 Conveyance position aligning method for conveyance system
07/31/2008WO2008090684A1 Flexible substrate and semiconductor device
07/31/2008WO2008090669A1 Coating forming agent for pattern fining, and method for fine pattern formation using the same
07/31/2008WO2008090668A1 Coating forming agent for pattern fining, and method for fine pattern formation using the same
07/31/2008WO2008090578A1 Chemical and/or biomolecular analysis integrated system and method for manufacturing the same
07/31/2008WO2008090512A1 Electronic field effect devices and methods for their manufacture
07/31/2008WO2008090511A1 Plasma etching of diamond surfaces
07/31/2008WO2008090439A1 Method for manufacturing compound material wafers and corresponding compound material wafer
07/31/2008WO2008090418A1 Liquid cleaning composition and method for cleaning semiconductor devices
07/31/2008WO2008090281A1 Method and equipment for exposing the surface of an integrated circuit
07/31/2008WO2008090023A1 Electronic component
07/31/2008WO2008090019A1 Method for cleaning a surface
07/31/2008WO2008074016A3 Method and apparatus for low temperature and low k sibn deposition
07/31/2008WO2008073753A3 Memory device protection layer
07/31/2008WO2008070004A3 High throughput wafer notch aligner
07/31/2008WO2008063785A3 Radio frequency identification (rfid) tag lamination process
07/31/2008WO2008063337A3 Semiconductor-on-diamond devices and associated methods
07/31/2008WO2008057896A3 Multi-component electronic package with planarized embedded-components substrate
07/31/2008WO2008057179A3 Atomic layer deposition in the formation of gate structures for iii-v semiconductor
07/31/2008WO2008051369A3 Low-cost electrostatic clamp with fast declamp time and the manufacture
07/31/2008WO2008042145A3 System and method for providing a high frequency response silicon photodetector
07/31/2008WO2008042110A3 Flexible substrate with electronic devices and traces
07/31/2008WO2008036062A3 Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
07/31/2008WO2008025475A3 Multilayered semiconductor wafer and process for manufacturing the same
07/31/2008WO2008019154A3 Methods of and systems for forming carbon based materials
07/31/2008WO2008009961A3 Improvements in hydrogen trapping
07/31/2008WO2007143505A3 Method and apparatus for automatically processing multiple applications in a predetermined order to affect multi-application sequencing
07/31/2008WO2007106487A3 Methods of making qfn package with power and ground rings
07/31/2008WO2007089886A3 Biaxially oriented film on flexible polymeric substrate
07/31/2008WO2007056224B1 Technique and apparatus for depositing layers of semiconductor for solar cell and module fabrication
07/31/2008WO2007005636A3 Semiconductor failure analysis tool
07/31/2008US20080183340 Pressure Control Device for Low Pressure Processing Chamber
07/31/2008US20080182430 Multiple-time flash anneal process
07/31/2008US20080182429 Semiconductor manufacturing system and method of manufacturing semiconductor device
07/31/2008US20080182428 Electronic device including a layer of discontinuous storage elements and a process for forming the electronic device
07/31/2008US20080182427 Deposition method for transition-metal oxide based dielectric
07/31/2008US20080182426 Method for growing nitride semiconductor
07/31/2008US20080182425 Vessel with a removable top wall, a sidewall and a bottom wall forming an internal vessel to hold a source chemical and an inner gas volume above the fill level; temperature sensor and a source chemical level sensor
07/31/2008US20080182424 Method for selectively controlling lengths of nanowires
07/31/2008US20080182423 Substrate processing apparatus and gas supply method
07/31/2008US20080182422 Generating a plasma from the process gas of carbon tetrachloride, oxygen and methane;selectively plasma etching the carbon-rich layer relative to the inorganic layer, wherein an etch
07/31/2008US20080182421 Substrate processing method and substrate processing apparatus
07/31/2008US20080182420 Ion beam treatment for the structural integrity of air-gap iii-nitride devices produced by the photoelectrochemical (pec) etching
07/31/2008US20080182419 Plasma processing method
07/31/2008US20080182418 Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
07/31/2008US20080182417 Plasma process uniformity across a wafer by apportioning ground return path impedances among plural vhf sources
07/31/2008US20080182416 Plasma process uniformity across a wafer by apportioning power among plural vhf sources
07/31/2008US20080182415 Semiconductor device and method for fabricating the same
07/31/2008US20080182414 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device
07/31/2008US20080182413 Selective chemistry for fixed abrasive cmp
07/31/2008US20080182412 Configurable bevel etcher
07/31/2008US20080182411 Plasma-enhanced ald of tantalum nitride films
07/31/2008US20080182410 Passivated stoichiometric metal nitride films
07/31/2008US20080182409 Method of forming a metal layer over a patterned dielectric by electroless deposition using a selectively provided activation layer
07/31/2008US20080182408 Forming an oxidized metal layer on a substrate;then an insulation layer pattern, with an exposed opening on the surface; converting the oxidized metal layer exposed through the opening into a catalyst metal layer, growing the carbon nano-tube from the catalyst
07/31/2008US20080182407 Method of forming vias in a semiconductor device
07/31/2008US20080182406 Method of forming a copper-based metallization layer including a conductive cap layer by an advanced integration regime
07/31/2008US20080182405 Self-aligned air-gap in interconnect structures
07/31/2008US20080182404 Novel air gap integration scheme
07/31/2008US20080182403 Uv curing of pecvd-deposited sacrificial polymer films for air-gap ild
07/31/2008US20080182402 Sub-lithographic interconnect patterning using self-assembling polymers
07/31/2008US20080182401 Fabrication method of a semiconductor device
07/31/2008US20080182400 Manufacturing method of semiconductor device
07/31/2008US20080182399 Methods of Forming Pad Structures and Related Methods of Manufacturing Recessed Channel Transistors that Include Such Pad Structures
07/31/2008US20080182398 Varied Solder Mask Opening Diameters Within a Ball Grid Array Substrate
07/31/2008US20080182397 Selective Epitaxy Process Control
07/31/2008US20080182396 Method of manufacturing semiconductor device
07/31/2008US20080182395 Method for forming pattern in semiconductor device
07/31/2008US20080182394 Dual gate ldmos device and method
07/31/2008US20080182393 Gallium nitride materials and methods associated with the same
07/31/2008US20080182392 Method for fabricating polysilicon layer with large and uniform grains
07/31/2008US20080182391 Doped nanoparticle semiconductor charge transport layer
07/31/2008US20080182390 Methods of filling a set of interstitial spaces of a nanoparticle thin film with a dielectric material
07/31/2008US20080182389 Low threshold voltage semiconductor device with dual threshold voltage control means
07/31/2008US20080182388 Production device and production method for conductive nano-wire
07/31/2008US20080182387 Method of fabricating a semiconductor device employing electroless plating
07/31/2008US20080182386 Controlled cleaving process